Patents Assigned to MIND TECHNOLOGY DEVELOPMENT LIMITED
  • Patent number: 10572089
    Abstract: A flexible transparent sensing film with embedded electrodes is described in the present invention, which would greatly improve the optical transmittance, electrical conductivity and reliability. The present sensing film can also simultaneously enable multiple touches for distinct locations sensing and at least another set of electrical signal sensing. The present sensing film includes a top conductive electrode, a bottom conductive electrode and a dielectric substrate or a functional substrate that would generate electrical signal response due to a specific input such as motion, light, chemical, or temperature. The present sensing film apparatus could be configured to have the top and bottom conductive electrodes which are partially or fully embedded onto the surfaces of the dielectric and/or functional substrates.
    Type: Grant
    Filed: September 29, 2018
    Date of Patent: February 25, 2020
    Assignees: MIND TECHNOLOGY DEVELOPMENT LIMITED, NEW ASIA GROUP HOLDINGS LIMITED
    Inventors: Chung Pui Chan, Wing Hong Choi, Lai Fan Lai, Kwok Keung Paul Ho, Chien Chung
  • Patent number: 10329660
    Abstract: The present invention provides a transparent conductive thin film which is flexible for suiting substantially all kinds of electronic and optoelectronic devices or display panel. The present conductive thin film includes at least one transparent substrate, a deformable layer and a conductive network pattern having a high aspect ratio such that at least one surface of the conductive network being exposed out of the deformable layer or the transparent substrate for contacting with an external structure while a large proportion thereof stays firmly integrated into the substrate. The present invention also relates to methods of fabricating a transparent conductive thin film including the structural features of the transparent conductive thin film of the present invention. Various optimizations of the present methods are also provided in the present invention for facilitating large area thin film fabrication and large scale production.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: June 25, 2019
    Assignees: MIND TECHNOLOGY DEVELOPMENT LIMITED, NEW ASIA GROUP HOLDINGS LIMITED
    Inventors: Chung Pui Chan, Lai Fan Lai, Wing Hong Choi, Bin Zhang, Kwok Keung Paul Ho, Chien Chung, Chun Pong Lee