Patents Assigned to Mindset Innovation Inc.
  • Patent number: 11540759
    Abstract: There are described headphones comprising earcups to be placed about ears of a user, with a headband linking the earcups and to be extending above a head of the user. A flexible band distinct from the headband is secured below the headband for contact with the head of the user. Removable headband sensors are embedded in the flexible band and have a portion thereof protruding downwardly from the flexible band to reach the scalp. The flexible band has a flexibility which makes the flexible band deform under the weight of the earcups to conform with the head of the user to ensure high quality contact between the headband electrodes and the scalp. There are further provided earcup electrodes on the earcups for contact with a region on or behind an ear of the user. Signals from the electrodes can be used for different purposes such as concentration monitoring and feedback.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: January 3, 2023
    Assignee: Mindset Innovation Inc.
    Inventors: Jacob Flood, David Doyon, Warren Robinson, Xin Yao, Christopher Faust