Abstract: A substrate is prepared for thin film metallization by applying one or more substantially conformal films or layers of a silicon glass onto the surface of the substrate. The total thickness of the glass on the substrate is not more than approximately 12,000 to 15,000 Angstroms and preferably between about 4000 and 6000 Angstroms. The glass is preferably deposited substantially uniformly onto the substrate surface so that the topographical features of the underlying substrate are not significantly changed by the presence of the glass.

Abstract: An optoisolator includes one or more light-emitting diodes (LEDs) within a compartment defined by walls of photocells, where the majority of light emitted by the LED impinges directly upon a photocell and is converted to electricity with a minimum of loss. The photocells are attached together by abutting the end of one photocell to the surface of another, as in a butt joint. In one embodiment, the LEDs is inserted into an opening in the compartment and secured by filling the compartment with a light-transmissive, non-conductive material. In another embodiment, the LEDs and photocells are mounted to a substrate. Optionally, each photocell has more than one electrically-independent photosensitive surface.

Abstract: An isolation amplifier that transmits data to a receiver via a current loop, where the isolated portion of the circuit is powered by a photovoltaic array illuminated by a light source powered directly by the current loop. Optionally, the photovoltaic array is additionally illuminated by any excess power tapped from the current loop by the non-isolated portion of the circuit. Preferably, the light source is an array of light-emitting diodes. Preferably the photovoltaic array is an array of photocells sensitive to the same wavelengths emitted by the light-emitting diodes. Preferably, there are optical conductors connecting the LED's to the photocells.