Patents Assigned to Minowa KOA Inc.
  • Publication number: 20080303149
    Abstract: An electronic component including, on one surface of a substrate (1), a plurality of circuit elements and external terminals each consisting of a conductive protrusion (9) for the circuit elements is provided with a structure capable of resisting an external force after mounting.
    Type: Application
    Filed: January 21, 2005
    Publication date: December 11, 2008
    Applicant: MINOWA KOA INC.
    Inventors: Toshiharu Takayama, Ryuusuke Suzuki, Takefumi Nakamori
  • Patent number: 7154373
    Abstract: A surface mounting chip network component in which a network having three or more odd number of terminals are formed on the surface of an insulating substrate and Tomb Stone Phenomenon is suppressed. Even number of network circuits are formed on the surface of the insulating substrate (2) and the same number of terminals (1) are arranged, respectively, on the opposite sides of the insulating substrate (2). Alternatively, even number of network circuits are formed on the surface of the insulating substrate (2) and the terminals (1) are arranged on the side edges of the insulating substrate (2) point-symmetrically with respect to the center of the surface of the insulating substrate (2).
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: December 26, 2006
    Assignee: Minowa KOA Inc.
    Inventor: Eiji Kobayashi