Abstract: A polishing method and a polishing film are provided for automatically performing multi-stage batch polishing on an end surface of a workpiece. An end surface of a workpiece and a polishing plate are moved relative to each other while bringing the end surface of the workpiece into contact with a polishing film of the polishing plate. The end surface is moved in a circular motion with a diameter 2 R relative to the polishing film; the center of the circular motion is moved linearly by a distance S on the polishing film; the polishing film is provided with first, second, and third polishing surfaces; and the polishing film is further provided with cleaning surfaces between the polishing surfaces so that the range of the distance S in which one rotation in the circular motion crosses over different polishing surfaces is reduced, or does not cross over different polishing surfaces.

Abstract: A polishing sheet capable of reducing recesses formed at the core of the end surface of an optical fiber, and a manufacturing method for an optical fiber connector using the polishing sheet are provided. The method includes a step of the final polishing of an optical fiber ferrule assembly in which an optical fiber protrudes from the end surface of a ferrule, the protruding optical fiber having a recess in the tip end core. During the final polishing step, the optical fiber having the recess in the core is inserted into a flocked portion of a flocked polishing sheet. The optical fiber ferrule assembly and the flocked polishing sheet are disposed opposite one another and moved relatively to each other in order to polish the optical fiber. Fibers constituting the flocked portion have silica particles with an average particle diameter from 0.01 ?m to 0.1 ?m adhered to the surface.

Abstract: There is provided a method that makes it possible to observe fine crystal defects using light of a visible region. The method includes illuminating a substrate with polarized parallel light and evaluating a crystal quality of at least a part of the substrate from an image obtained by light transmitted through or reflected by the substrate. The half width HW, the divergence angle DA, and the center wavelength CWL of the parallel light satisfy conditions given below 3?HW?100 0.1?DA?5 250?CWL?1600 where the center wavelength CWL and the half width HW are expressed in units of nm and the divergence angle DA is expressed in units of mrad.

Abstract: Provided is a method for producing a circular wafer using a grinding tape to grind the edge of a wafer comprising a crystalline material. A primary grinding step is provided for contacting a grinding body to the peripheral portion of a wafer placed centered on a horizontal stage and rotating the stage, thus grinding the peripheral portion. The radius of the wafer is measured, and a radius is set that is no greater than the measured smallest radius, and the difference ?r between the set radius and the measured wafer radius along the peripheral portion is determined. The portions of the peripheral portion at which ?r is greater than a predetermined value are determined and a secondary grinding step is provided for contacting the peripheral portion and the grinding body, rotating the stage forwards and backwards in a predetermined range of rotational angles, and grinding the peripheral portion.

Abstract: A detergent composition comprising ethylene oxide/propyleneoxide (EO/PO), sodium-2-ethylhexyliminodipropionate, potassium hydroxide, hydroxyethylene diphosphonic acid (HEDP), and diethylenetriamine-penta(methylene phosphonic acid) (DTPMP) for removing contaminants from the surface of a hard disk.