Patents Assigned to Misaku Densetsu Co., Ltd.
  • Patent number: 6913822
    Abstract: The present invention concerns a cable erection technique using a plastically deformable coil comprising a metal wire formed in a spiral shape and synthetic resin coated on a surface of the metal wire, wherein said coil is inserted outside around a tensile line drawn between utility poles, the coil is elongated until its plastic deformation for forming a series of cable arrangement spaces inside the spiral, and a cable is extended, added or extracted through the cable arrangement space.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: July 5, 2005
    Assignees: Daimei Telecom Engineering Corp., Daimei Telecom Ltd., Misaku Densetsu Co., Ltd.
    Inventors: Takayuki Nimiya, Zenichi Komine, Akira Kuno, Norio Takemura, Katsunori Misaku, Kazue Misaku, Kaoru Takagi, Makiko Barker
  • Patent number: 6505818
    Abstract: The present invention concerns a cable erection technique using a plastically deformable coil comprising a metal wire formed in a spiral shape and synthetic resin coated on a surface of the metal wire, wherein said coil is inserted outside around a tensile line drawn between utility poles, the coil is elongated until its plastic deformation for forming a series of cable arrangement spaces inside the spiral, and a cable is extended, added or extracted through the cable arrangement space.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: January 14, 2003
    Assignees: Daimei Telecom Engineering Corp., Daimei Telecom Ltd., Misaku Densetsu Co., Ltd.
    Inventors: Takayuki Nimiya, Zenichi Komine, Akira Kuno, Norio Takemura, Katsunori Misaku, Kazue Misaku, Kaoru Takagi, Makiko Barker