Abstract: Aramid paper with high surface smoothness is offered, wherein [said aramid paper] is characterized by the fact that a surface layer, which contains 100 wt % of poly(metaphenylene isophthalamide) fibrids, which weighs less than 10 g/m.sup.2, and which has a coating ratio of 97% or higher, and an intermediate layer, which comprises 70 to 90 wt % of poly(metaphenylene isophthalamide) fibrids and 10 to 30 wt % of poly(metaphenylene isophthalamide) flocks and weighs 20 g/m.sup.2 or less, are laminated successively on at least one side of the substrate layer which comprises 25 to 60 wt % of said fibrids and 40 to 75 wt % of said flocks, that the surface smoothness of the surface layer is 40 sec per 10 cc or higher, and that the number of fuzz fibers at least 1 mm long, which are generated by surface friction, does not exceed 5 fibers per 25 cm.sup.2. Said aramid paper can be suitably used as electrical insulation paper, heat-resistant labeling paper, heat resistant paper, and the like.
Type:
Grant
Filed:
June 30, 1995
Date of Patent:
September 16, 1997
Assignees:
E. I. Du Pont de Nemours and Company, Mishima Paper Ltd.
Inventors:
Ippei Kato, Yuji Kimura, Lee James Hesler