Abstract: There is disclosed a method of providing an elongated stock; producing a wafer comprising the steps of processing one end face of an elongated stock to form a first flat surface; cutting through one end portion of the stock transversely by a cutter to provide a slice of a predetermined thickness having opposite side faces defined respectively by the first flat surface and a cut surface subjected to the cutting; and processing the cut surface of the slice to form a second flat surface, using the first flat surface as a reference surface, thereby providing the wafer.