Patents Assigned to Misubishi Polycrystalline Silicon America Corporation (MIPSA)
  • Patent number: 8425279
    Abstract: An apparatus for manufacturing seeds for polycrystalline silicon manufacture by cutting a silicon rod in an axial direction into at least one plate-like member, and cutting at least one of the silicon plate-like member lengthwise into seeds that are square in cross section, that includes a table which mounts the silicon rod or at least one of the plate-like member, a pair of end-face supporting members which support the silicon rod or at least one of the plate-like member by pressing both end faces thereof in the axial direction, and a cutting blade which cuts the silicon rod or at least one of the plate-like member in the axial direction, in addition the end-face supporting members includes comb-like grooves that allow the cutting blade to pass through.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: April 23, 2013
    Assignees: Misubishi Polycrystalline Silicon America Corporation (MIPSA), Mitsubishi Materials Corporation
    Inventors: Larry Gurley, Ken Rowell, Satoshi Imamura, Yukio Yamaguchi