Abstract: A jig for calcining an electronic component including a substrate 11 and a zirconia layer 12 coated on a surface of the substrate characterized in that the zirconia layer including one or more metal oxides forming a liquid phase is calcined for improving peel-off resistance and wear resistance to crystallize the liquid phase after the calcination. In the jig for calcining the electronic component, when the zirconia layer is formed by using an inexpensive method such as an application method, the zirconia layer is not peeled off from the substrate, and grains are not detached.

Abstract: Disclosed is a composite black oxide particle which is composed of oxide of cobalt, copper and manganese. The copper/cobalt molar ratio is 0.1-0.5, and the manganese/cobalt molar ratio is 0.2-1.0. The composite black oxide particle further contains silicon, and the silicon content to the total oxide particle is 0.1-3 mass %. The surface of the composite black oxide particle is coated with aluminum oxide. The Al content in the surface coating to the entire particle is 0.05-3 mass %.

Abstract: A clutch mechanism of the present power device comprises a fixed gear member, a moving gear member engaged with the fixed gear member when moving to a clutch connecting position, an armature for moving the moving gear member to the clutch connecting position when rotated relatively to the moving gear member, an electromagnetic coil unit for applying a brake resistance to the armature, and a clutch holding surface for abutting against the moving gear member when the electromagnetic coil unit is turned off in the clutch connecting state and for holding the moving gear member at a brake-clutch connecting position. The abutment of the moving gear member against the clutch holding surface is released by rotating the moving gear member relatively to the armature in a state in which the electromagnetic coil unit is operated.

Abstract: It is an object to provide a copper-containing tin powder having excellent capabilities in forming fine wiring circuits and filling via holes with ability in bond by melting at a low temperature. In order to achieve the object, it is produced from a copper powder as a starting material by a wet substitution process and it contains remainder of copper un-substituted at 30% by weight or less. The change rate of properties of the copper-containing tin powder, e.g. an average primary particle size or the like is in the range from ?20 to +5% with respect to the starting copper powders. The copper-containing tin powder is produced by a wet substitution process in which a copper powder is brought into contact with a plating solution for tin substitution to make copper component constituting the copper powder dissolve with simultaneous substituted deposition of tin.