Abstract: A mobile station includes a transmission data storage unit for temporarily storing at least one or more input packet data, a priority control unit for generating priority information which a base station uses for determination of a schedule in advance based on the priority of at least the one or more packet data, and a transmitting unit for transmitting the priority information to the base station. Therefore, to generate a schedule such as a transmission timing at which the base station communicates with each mobile station, the base station can know the priority of packet data stored in each mobile station in advance, and can recognize the existence of a mobile station which is trying to transmit packet data with a high priority to the base station at an early stage. As a result, the base station can assign a transmission timing etc. quickly to the mobile station.

Abstract: A semiconductor laser element including a ridge extending along a laser output direction of the laser element. The ridge has a central portion, two peripheral portions sandwiching the central portion, and two transitional portions. Window regions that are non-gain regions are located in corresponding peripheral portions. A difference in an equivalent refractive index between the central portion of the ridge and the peripheral portions on both sides is larger than a difference in an equivalent refractive index between the central portion of the ridge and transitional portions on both sides of the central portion in a gain region.

Abstract: Each subnet has an environment for executing the agent service program. When a request for service such as file system is made from the subnet B103 to the subnet A102 by a user, a client side agent created at the subnet B103 further creates a peer agent, and the peer agent is transmitted to the subnet A102 according to the communication condition such as a firewall 104 which is already being notified. A peer-to-peer session is configured between the agents.

Abstract: A semiconductor device has a dummy pattern including an underlying layer which is formed on a semiconductor substrate and in which a plurality of word lines from N−2 to N+2 are arranged in parallel, a plurality of blocks each of which has a plurality of dummy sheets arranged in such a way that each of them spreads over the two word lines neighboring in the direction along the word lines from N−2 to N+2, and a plurality of dummy sheets arranged between the plurality of blocks in such a way that each of them spreads over the two word lines neighboring between the blocks.

Abstract: An address input is received earlier than data input, and a result of decoding of a column address at the time of writing and results of substitution determination for a redundancy memory column are held in a latch circuit corresponding to each bank. When the data arrives at the bank, the data is immediately written to each bank, utilizing the results of address processing. Operation frequency of the chip is not limited by the conventionally experienced wasteful wait time for the data in the process of writing, and efficient data input/output is possible.

Abstract: A DSRC car-mounted equipment which self-diagnoses its communication function and informs the driver of the result, comprising a first local oscillator 30 for generating a car-mounted equipment frequency fosc, a demodulator 16 for detecting the electric field intensity HE and for picking up reception data D1, a car-mounted controller 40 for fetching the reception data by changing over the transmission/reception change-over switch SW1 and for sending transmission data D2, a second local oscillator 31 that outputs a frequency for detecting abnormal condition corresponding to an on-the-road equipment frequency fs, and means for judging the condition of the transmission/reception circuit using the frequency for judging abnormal condition, wherein the transmission/reception change-over switch is connected to the reception circuit, abnormal condition is judged from at least either the electric field intensity or the reception data detected based on a leakage power of the frequency for detecting abnormal condition, a

Abstract: An inspection apparatus for foreign matter and pattern defects includes an optical portion (D) and an analyzer (AN). The optical portion (D) includes a microscope illumination optical system (D1) for detecting the surface of a semiconductor wafer (2) in the form of a piece of first surface information by using microscope illumination, and a laser scattering type optical system (D2) for detecting scattered laser light from the semiconductor wafer by using laser light to detect the surface of the semiconductor wafer (2) in the form of a piece of second surface information.

Abstract: In order to reduce the possibility of moisture, which has seeped into a door from its lower side, contacting with a speaker and also of air pressure building up behind the speaker and hindering the movement of the diaphragm, a waterproof cover 3 is provided which includes a magnet cover 31 which follows the circumference of a magnet 16, a frame cover 32 which partially overlaps with the magnet cover 31 and follows the circumference of the frame 15 when it is combined with a speaker 2, a first aperture 33 placed between the magnet 16 and the magnet cover 31 and a second aperture 34 placed between the magnet cover 31 and the frame cover 32.

Abstract: A wire bonding method for joining a metal wire with a bonding pad disposed on a semiconductor element by using a load and supersonic wave vibration, comprising: during interval of time from contact of the metal wire with the bonding pad to application of the supersonic wave vibration, continuously applying a first bonding load and a second bonding load which is lower than the first bonding load; and after application of the supersonic wave vibration, continuously applying a third bonding load of a size of about 50% of the load of the second bonding load and a fourth bonding load which is lower than the first bonding load and higher than the third bonding load. The reliability of the fine wire bonding joint is improved remarkably, whereby a high quality semiconductor device can be produced at a low cost.