Patents Assigned to Mitsubishi Electrics Corporation
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Patent number: 11385403Abstract: An optical transmission device includes a semiconductor laser chip in which a semiconductor laser array having a plurality of distributed feedback semiconductor lasers formed on a first semiconductor substrate is formed, a semiconductor waveguide chip in which a semiconductor modulator array formed on a second semiconductor substrate and having the same number of semiconductor modulators as the semiconductor lasers is formed. In the optical transmission device, a waveguide and a waveguide are butt-joined such that a distance between an end face of the waveguide on a side to the semiconductor modulator array in each of the semiconductor lasers of the semiconductor laser array and an end face of the waveguide on a side to the semiconductor laser array in each of the semiconductor modulators of the semiconductor modulator array is 10 ?m or less.Type: GrantFiled: July 12, 2018Date of Patent: July 12, 2022Assignee: Mitsubishi Electric CorporationInventor: Takeshi Yamatoya
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Patent number: 11387173Abstract: A first lead terminal, a second lead terminal provided parallel to the first lead terminal, and a tie bar connecting the first lead terminal and the second lead terminal are provided. The tie bar includes a first narrow-width section touching the first lead terminal, a second narrow-width section touching the second lead terminal, and a wide-width section having a larger width than the first narrow-width section and the second narrow-width section and connecting the first narrow-width section and the second narrow-width section. The wide-width section has a through-hole formed between the first narrow-width section and the second narrow-width section.Type: GrantFiled: November 18, 2019Date of Patent: July 12, 2022Assignee: Mitsubishi Electric CorporationInventors: Ken Sakamoto, Taketoshi Shikano, Hiroshi Kawashima
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Patent number: 11387816Abstract: An operation processing unit computes an amount of operation for adjusting electric power supplied to a load. A signal generator computes, based on an amount of operation, the number of switch elements to be turned on among switch elements and a duty ratio to be set for the number of switch elements to be turned on and generates, based on the determined number of switch elements and duty ratio, a signal for driving at least one of the switch elements. The signal generator includes a correction value operation unit that obtains a correction value based on a difference of an on-pulse width between a shunt current flowing through a corresponding one of the switch elements and a shunt drive signal for driving the corresponding one switch element, and a corrector that corrects, based on the correction value, an amount of operation output from the operation processing unit.Type: GrantFiled: January 31, 2019Date of Patent: July 12, 2022Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Satoshi Ojika, Shinichiro Oikawa
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Patent number: 11387894Abstract: A satellite receiver includes: N reception antenna elements; N demultiplexing units; a correlation detection unit configured to perform correlation processing on each of reception signals demultiplexed by the N demultiplexing units with a reception antenna element that receives the highest power being set as a reference element so as to calculate a relative phase difference, and calculate an excitation coefficient for cancelling a phase difference between the N reception antenna elements for each of sub-channels based on the calculated relative phase difference; N phase compensation units configured to multiply the reception signals demultiplexed by the N demultiplexing units, respectively, by the excitation coefficient for each of the sub-channels; and a combiner configured to combine multiplication results from the N phase compensation units for each of the sub-channels to generate output signals.Type: GrantFiled: January 30, 2019Date of Patent: July 12, 2022Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Hitomi Ono, Akinori Fujimura, Terumi Sunaga, Toshiyasu Tsunoda
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Patent number: 11387631Abstract: A heat pipe includes an insulating hollow body located inside an outer conductor. The insulating hollow body insulates a portion of the heat pipe on an outer conductor side and a portion of the heat pipe on an inner conductor side from each other. The heat pipe has a plurality of sections each connecting a corresponding one of a plurality of connection conductors to the insulating hollow body. The heat pipe further includes a communication path connecting portions of the heat pipe to each other to cause the plurality of sections to be in communication with each other. Each of the portions is connected to a corresponding one of the plurality of connection conductors.Type: GrantFiled: October 24, 2017Date of Patent: July 12, 2022Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Naoki Iwamoto, Hirokazu Otani, Motohiro Sato
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Patent number: 11384965Abstract: During a first cooling operation, a compressor is in an operational state, a liquid pump is in a non-operational state, and an amount of refrigerant allowing for existence of a liquid surface of the refrigerant in a refrigerant tank is accumulated in the refrigerant tank. During a second cooling operation, the compressor is in the non-operational state, the liquid pump is in the operational state, and the amount of the refrigerant allowing for the liquid surface of the refrigerant in the refrigerant tank is accumulated in the refrigerant tank.Type: GrantFiled: April 4, 2017Date of Patent: July 12, 2022Assignee: Mitsubishi Electric CorporationInventors: Masahiro Ito, So Nomoto
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Patent number: 11384995Abstract: A finless heat exchanger includes two headers and a plurality of heat transfer tubes spaced apart from each other and arranged side by side. The two headers each have a plurality of insertion holes, to which both ends of the heat transfer tubes are fitted and connected. The heat transfer tubes each include straight portions extending in a direction orthogonal to an arrangement direction, in which the heat transfer tubes are arranged, and turning portions. The straight portions and the turning portions are alternately and continuously arranged.Type: GrantFiled: December 11, 2017Date of Patent: July 12, 2022Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Shinichiro Minami, Takashi Matsumoto, Shigeyoshi Matsui
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Patent number: 11387231Abstract: The semiconductor device that supplies a charging current to a bootstrap capacitor includes a semiconductor layer, an N+-type diffusion region, an N-type diffusion region, a P+-type diffusion region, a P-type diffusion region, an N+-type diffusion region, a source electrode, a drain electrode, a back gate electrode, and a gate electrode. The N+-type diffusion region and the N-type diffusion region are electrically connected to a first electrode of the bootstrap capacitor. The N+-type diffusion region is supplied with a power supply voltage. The source electrode is connected to the N+-type diffusion region and is supplied with the power supply voltage. The back gate electrode is connected to a region separated from the N+-type diffusion region and is grounded. The breakdown voltage between the source electrode and the back gate electrode is greater than the power supply voltage.Type: GrantFiled: September 11, 2020Date of Patent: July 12, 2022Assignee: Mitsubishi Electric CorporationInventors: Kazuhiro Shimizu, Yuji Kawasaki, Toshihiro Imasaka, Manabu Yoshino
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Patent number: 11387352Abstract: An object of the present disclosure is to suppress a shrinkage cavity without affecting the layout or the insulation performance of the semiconductor element in a power semiconductor device. A power semiconductor device includes a heat radiation plate; an insulating substrate bonded in a bonding region on an upper surface of the heat radiation plate with a bonding material containing a plurality of elements having different solidification points; a semiconductor element mounted on an upper surface of the insulating substrate; and a bonding wire bonded in the bonding region on the upper surface of the heat radiation plate such that the bonding wire surrounds the semiconductor element in plan view.Type: GrantFiled: October 22, 2020Date of Patent: July 12, 2022Assignee: Mitsubishi Electric CorporationInventor: Norikazu Sakai
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Patent number: 11387768Abstract: A direct-current power supply device includes a reactor, a bridge circuit that converts alternating-current voltage output from an alternating-current power supply, which is connected to the reactor, into direct-current voltage, a capacitor that smoothes the output voltage of the bridge circuit, a current detector that detects a first current flowing as an alternating current between the alternating-current power supply and the bridge circuit, a current detector that detects a second current flowing as a direct current between the bridge circuit and the capacitor, an overcurrent determination unit that determines on the basis of a detected first current value whether or not the first current is an overcurrent, and an overcurrent determination unit that determines on the basis of a detected second current value whether or not the second current is an overcurrent.Type: GrantFiled: September 28, 2018Date of Patent: July 12, 2022Assignee: Mitsubishi Electric CorporationInventors: Satoru Ichiki, Takuya Shimomugi, Koichi Arisawa, Keisuke Uemura, Kenji Iwazaki
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Patent number: 11386585Abstract: A driving support device includes processing circuitry to judge a target object that is a real object existing in the vicinity of the vehicle and should be paid attention to by the driver; to generate a visual attraction stimulation image that appears to move from a position farther than the target object towards a position where the target object exists; to cause a display device to display the visual attraction stimulation image; and to receive body information from a body information detector acquiring the body information on the driver, to calculate a value indicating body reaction to visual stimulation sensed by the driver, and to correct a display parameter that determines display condition of the visual attraction stimulation image based on the value indicating the body reaction so as to change a degree of the visual stimulation given to the driver by the visual attraction stimulation image.Type: GrantFiled: September 4, 2020Date of Patent: July 12, 2022Assignee: Mitsubishi Electric CorporationInventor: Jumpei Hato
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Patent number: 11384955Abstract: An indoor unit for an air-conditioning apparatus includes a body having an opening, a decorative panel attached to the body to cover the opening, and a filter disposed between the body and the decorative panel. The decorative panel has a rectangular air inlet grille disposed at a location that faces the opening of the body. The air inlet grille has long-side wall portions that face each other, a plurality of short-side wall portions disposed perpendicularly to each of the long-side wall portions, a bottom portion surrounded by the long-side wall portions and the plurality of short-side wall portions, and hook receiving portions located in respective grille corner portions each located at the corresponding one of four corners of the bottom portion. The filter is formed in a rectangular shape and has hook portions in respective filter corner portions each located at the corresponding one of four corners of the filter. The hook portions are engaged with the respective hook receiving portions.Type: GrantFiled: February 1, 2017Date of Patent: July 12, 2022Assignee: Mitsubishi Electric CorporationInventors: Jun Tagaya, Tetsuya Tazawa, Keisuke Tomomura
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Patent number: 11388845Abstract: The present invention concerns a method for controlling the temperature of a multi-die power module, a multi-die temperature control device. The multi-die temperature control: obtains a signal that is representative of the temperature of one die among the dies of the multi-die power module when the die is not conducting, obtains signals that are representative of a reference temperature that is dependent of the temperature of all the dies of the multi-die power module when the dies are not conducting, compares the signal that is representative of the temperature of one die to the signal that is representative of the reference temperature, reduces the duration of the conducting time of the die or reducing the duration of the conducting time of the other dies of the multi-die power module according to the comparison result.Type: GrantFiled: March 1, 2018Date of Patent: July 12, 2022Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Jeffrey Ewanchuk, Julio Brandelero
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Publication number: 20220215666Abstract: This display control device includes: a first mobile object information acquiring unit that acquires first mobile object information indicating the position, moving speed, and direction of movement of a first mobile object moving in a facility; a second mobile object information acquiring unit that acquires second mobile object information indicating the position, moving speed, and direction of movement of a second mobile object moving in the facility; an image acquisition unit that acquires, on the basis of the first mobile object information acquired by the first mobile object information acquiring unit and the second mobile object information acquired by the second mobile object information acquiring unit, image information indicating a display image to be displayed in a space in the facility by a display output device installed in the facility; and an image output unit that outputs the image information acquired by the image acquisition unit.Type: ApplicationFiled: March 22, 2022Publication date: July 7, 2022Applicant: Mitsubishi Electric CorporationInventor: Naoki FURUHATA
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Publication number: 20220216130Abstract: A semiconductor module includes a refrigerant jacket including a refrigerant passage thro ugh which a refrigerant circulates and an opening extending from an outer surface to the refrigerant passage, a base mounted on the refrigerant jacket and closing the opening, and a semiconductor element provided at the base. The base includes an annular peripheral wall positioned inside the opening, a bottom plate connected to an end portion of the peripheral wall on a side closer to the refrigerant passage, and a fin protrusion protruding from the bottom plate toward the inside of the refrigerant passage and formed on the bottom plate. The base has a recess formed with the peripheral wall and the bottom plate and extending toward the opening. The semiconductor element is disposed on the bottom plate inside the recess.Type: ApplicationFiled: July 26, 2019Publication date: July 7, 2022Applicant: Mitsubishi Electric CorporationInventor: Koichi USHIJIMA
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Publication number: 20220215210Abstract: An information processing apparatus includes a storage unit (102) that stores a feature vector set, a quality label set, and a plurality of non-quality label sets; a non-quality-label clustering unit (107) that calculates an average clustering accuracy of each of the non-quality label sets to calculate a plurality of the average clustering accuracies corresponding to the non-quality label sets, the average clustering accuracy being an average value of a clustering accuracy of clustering performed on a subset by using the quality label set, the subset being obtained by dividing the feature vectors by each of multiple elements indicated by the non-quality labels; and a processing unit (108) that generates a screen image enabling identification of at least one non-quality label type adversely affecting quality of the multiple pieces of digital data by using the average clustering accuracies.Type: ApplicationFiled: March 24, 2022Publication date: July 7, 2022Applicant: Mitsubishi Electric CorporationInventor: Nobuaki TANAKA
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Publication number: 20220216774Abstract: Provided is a rotor of a rotating electric machine, including: a rotor core; an end plate provided at an end portion of the rotor core in an axial direction of the rotor core; and a shaft passing through the rotor core and the end plate along the axial direction. The end plate includes: a flat plate portion that has an annular shape and is held in contact with the rotor core; and a warp portion that is formed more on an inner peripheral side of the end plate than the flat plate portion and is held in contact with the shaft. In a radial cross section of the end plate, the warp portion is warped so as to be apart from the rotor core as extending away from the flat plate portion.Type: ApplicationFiled: July 11, 2019Publication date: July 7, 2022Applicant: Mitsubishi Electric CorporationInventors: Masafumi OKAZAKI, Satoru AKUTSU
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Publication number: 20220215997Abstract: A power conversion device includes an electronic component, a first printed board, a first cooling body, a second printed board, a second cooling body, a third printed board, and a third cooling body. The second cooling body extends from a second principal surface toward a first principal surface of the first printed board. The third cooling body extends from a second principal surface toward the first principal surface of the first printed board.Type: ApplicationFiled: May 20, 2020Publication date: July 7, 2022Applicant: Mitsubishi Electric CorporationInventors: Hiroyuki KIYONAGA, Kenta FUJII, Yuji SHIRAKATA, Tomohito FUKUDA
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Patent number: D957600Type: GrantFiled: April 29, 2020Date of Patent: July 12, 2022Assignee: Mitsubishi Electric CorporationInventors: Izuru Hamasaki, Satoshi Arai, Takanori Ikegaya
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Patent number: D957601Type: GrantFiled: April 29, 2020Date of Patent: July 12, 2022Assignee: Mitsubishi Electric CorporationInventors: Izuru Hamasaki, Satoshi Arai, Takanori Ikegaya