Patents Assigned to Mitsubishi Engineering-Plastics Corp.
  • Patent number: 7048428
    Abstract: A light guide plate made of a transparent resin includes a first main surface and a second main surface opposite to the first main surface. The first main surface has a surface portion provided with convex portions having a height in the range of 5×10?7 m to 6×10?5 m each and a pitch in the range of 5×10?7 m to 4×10?4 m. The light guide plate having tip portions of at least 80% of the total convex portions with a radius of curvature of 2×10?6 m or less, or the surface of the convex portions having a surface roughness of 3×10?7 m or less.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: May 23, 2006
    Assignee: Mitsubishi Engineering-Plastics Corp.
    Inventors: Hisashi Tahara, Akimasa Kaneishi
  • Patent number: 6866811
    Abstract: An injection-molding apparatus comprises a mold assembly having a first-molten-resin injection portion for injecting a first molten thermoplastic resin into a cavity of the mold assembly, a second-molten-resin injection portion for injecting a second molten thermoplastic resin into the cavity, and a pressurized-fluid introducing portion for introducing a pressurized fluid into the second molten thermoplastic resin injected into the cavity. The injection-molding apparatus also comprises a first injection cylinder communicating with the first-molten-resin injection portion, and a second injection cylinder communicating with the second-molten-resin injection portion.
    Type: Grant
    Filed: April 26, 2001
    Date of Patent: March 15, 2005
    Assignee: Mitsubishi Engineering-Plastics Corp.
    Inventors: Yoshihiro Kayano, Hiroyuki Imaizumi, Kazuaki Ochiai
  • Patent number: 6730725
    Abstract: The present invention relates to a polycarbonate which can be obtained by a melting method and has a viscosity-average molecular weight of 16000 to 27000, and whose loss angle &dgr; and complex viscosity &eegr;* (Pa·s) measured under the conditions of 250° C. and an angular velocity of 10 rad/s satisfy the following relation (1): 4,700≦Tan &dgr;/(&eegr;*)−0.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: May 4, 2004
    Assignee: Mitsubishi Engineering-Plastics Corp.
    Inventors: Tatsuya Masuki, Hiroshi Yoshioka, Takao Tayama, Masaaki Miyamoto
  • Publication number: 20040034140
    Abstract: The present invention relates to a thermoplastic resin composition comprising a thermoplastic resin and hollow carbon fibrils dispersed in the thermoplastic resin, the hollow carbon fibrils being present in an amount of 0.1 to 20% by weight based on the total weight of the composition, comprising independent fibrils and agglomerated fibrils, and having such a dispersing condition, when represented by indices based on the measurement of transmission electron microphotograph, that the ratio of the independent fibrils to the agglomerated fibrils lies within the range of 8/92 to 40/60 and the independent fibrils have an average length of 20 to 200 nm.
    Type: Application
    Filed: June 17, 2003
    Publication date: February 19, 2004
    Applicant: Mitsubishi Engineering-Plastics Corp.
    Inventors: Yoshihiro Kurasawa, Naoto Obayashi, Kiyoji Takagi, Shigeru Muramatsu
  • Patent number: 6608133
    Abstract: The present invention relates to a thermoplastic resin composition comprising a thermoplastic resin and hollow carbon fibrils dispersed in the thermoplastic resin, the hollow carbon fibrils being present in an amount of 0.1 to 20% by weight based on the total weight of the composition, comprising independent fibrils and agglomerated fibrils, and having such a dispersing condition, when represented by indices based on the measurement of transmission electron microphotograph, that the ratio of the independent fibrils to the agglomerated fibrils lies within the range of 8/92 to 40/60 and the independent fibrils have an average length of 20 to 200 nm.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: August 19, 2003
    Assignee: Mitsubishi Engineering-Plastics Corp.
    Inventors: Yoshihiro Kurasawa, Naoto Obayashi, Kiyoji Takagi, Shigeru Muramatsu
  • Publication number: 20020142115
    Abstract: A multi-layer film bag for packaging medical liquid, wherein the multi-layered film comprises at least five layers in which a polyester layer is located on the outermost, and an adhesive layer, a polyamide layer, an adhesive layer and an polyolefin layer are stacked in this order towards the innermost was disclosed. In such multi-layer film bag for packaging medical liquid, the polyester layer comprises polybutylene terephthalate which contains terephthalic acid as a major dicarboxylic acid component and butylene glycol as a major diol component; the polybutylene terephthalate has an intrinsic viscosity of 0.6 to 2.0 and the content of carboxylic terminal of 3 to 60 &mgr;eq/g. The polyamide layer comprises polyamide 6, polyamide 6-66 or a mixture thereof, and has a relative viscosity of 2.1 to 6.0, a ratio of content of low-molecular-weight polymers of 0.7 wt % or below, and an ash content of 500 ppm or below.
    Type: Application
    Filed: October 31, 2001
    Publication date: October 3, 2002
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORP.
    Inventor: Katsuhiko Sugiura
  • Patent number: 6391418
    Abstract: The present invention relates to a substrate for information recording media, which comprises aromatic polycarbonate resin composition comprising: 100 parts by weight of an aromatic polycarbonate resin having a viscosity-average molecular weight of 10,000 to 40,000, and 0.01 to 40 parts by weight of a biphenyl compound, a terphenyl compound or a mixture thereof.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: May 21, 2002
    Assignee: Mitsubishi Engineering-Plastics Corp.
    Inventors: Masaya Ueda, Hiroyoshi Maruyama
  • Patent number: 6225383
    Abstract: The present invention relates to a resin composition comprising: 100 parts by weight of resin component comprising a polyamide resin or a polyamide resin and a thermoplastic resin other than polyamide resins, and 1 to 50 parts by weight of a salt of polyphosphoric acid and melam or a melam derivative, a salt of polyphosphoric acid and melem or a melem derivative or a mixture thereof.
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: May 1, 2001
    Assignee: Mitsubishi Engineering Plastic Corp.
    Inventors: Masaki Hirono, Noriyoshi Watanabe
  • Patent number: 6202883
    Abstract: A tray for semiconductor integrated circuit devices, including a plurality of first partition walls extending in a first direction, a plurality of second partition walls extending in a second direction at right angles with the first direction, and circumferential frame portions connecting end portions of the first and second partition walls. The regions surrounded by the first partition walls and the second partition walls constitute seating portions for seating semiconductor integrated circuit devices. The first partition walls are disposed such that one first partition wall is disposed between two rows of the seating portions which are adjacent to each other in the second direction. The second partition walls are disposed such that two second partition walls are disposed between two rows of the seating portions which are adjacent to each other in the first direction, and opening portions are formed between the two second partition walls.
    Type: Grant
    Filed: January 28, 1999
    Date of Patent: March 20, 2001
    Assignee: Mitsubishi Engineering-Plastics Corp.
    Inventors: Norio Narazaki, Yutaka Shiraishi, Osamu Kakinoki
  • Patent number: 6165407
    Abstract: A mold assembly for molding a thermoplastic resin, which comprises; (a) a first mold member and a second mold member for manufacturing a molded article of a thermoplastic resin, (b) an insert block provided in the first mold member, said insert block constituting part of a cavity, having a thickness of 0.1 mm to 10 mm and being formed of a material having a thermal conductivity of 2.times.10.sup.-2 cal/cm.multidot.sec.multidot..degree.C. or less, and (c) a molten thermoplastic resin introduction portion provided in the second mold member, wherein an insert block covering portion is formed in the second mold member, and when the first mold member and the second mold member are clamped to each other, (A) a clearance between the insert block and the insert block covering portion is equal to, or less than, 0.03 mm, and (B) an amount of overlapping of the insert block and the insert block covering portion is equal to, or greater than, 0.5 mm.
    Type: Grant
    Filed: May 28, 1998
    Date of Patent: December 26, 2000
    Assignee: Mitsubishi Engineering-Plastics Corp.
    Inventors: Hisashi Tahara, Takayuki Ito
  • Patent number: 5977206
    Abstract: A polycarbonate resin composition according to the present invention is suited to be used for medical supplies or appliances and shows a very low yellow discoloration when exposed to an ionizing radiation for sterilization. The polycarbonate resin composition comprises 100 parts by weight of a polycarbonate resin; 0.01 to 5 parts by weight of an aromatic compound containing oxy group or carbonyl group; and 0.01 to 5 parts by weight of at least one compound selected from the group consisting of: (A) a compound containing cyclic acetal group; (B) a sulfone compound; (C) a sulfoxide compound; (D) polyalkylene glycol, an ether of polyalkylene glycol or an ester of polyalkylene glycol; (E) a compound containing sulfonate group; and (F) an aromatic hydrocarbon-aldehyde resin.
    Type: Grant
    Filed: January 12, 1998
    Date of Patent: November 2, 1999
    Assignee: Mitsubishi Engineering-Plastics Corp.
    Inventors: Shinya Miya, Satoshi Kanayama, Ken Shimomai
  • Patent number: 5948838
    Abstract: The present invention relates to a polycarbonate resin composition comprising 100 parts by weight of a polycarbonate resin; 0.01 to 5 parts by weight of a compound containing oxymethylene unit, a compound containing oxymethylene unit having substituent or a cyclic ether compound having substituent.
    Type: Grant
    Filed: February 25, 1997
    Date of Patent: September 7, 1999
    Assignee: Mitsubishi Engineering-Plastics Corp.
    Inventors: Shinya Miya, Satoshi Kanayama
  • Patent number: 5942169
    Abstract: A method of over-molding used to produce a three-dimensional hollow molded article employs a core made of resin having a hollow portion. The core is placed in a cavity of a mold. Molten resin is injected into a space formed by the core and a cavity wall of the mold through a resin injection portion. In this way at least part of the outer surface of the core is covered with resin. Deformation of the core due to the pressure of the resin during injection is prevented in one of a number of different ways. The over-molding method is optimized by calculating a temperature distribution and a pressure distribution of the molten resin in the step of injecting the molten resin into the space by numerical analysis. The displacement distribution and for the stress distribution of the core caused by pressure applied to the core by flow of the molten resin is calculated by a numerical analysis on the basis of the calculated temperature distribution and pressure distribution.
    Type: Grant
    Filed: November 27, 1995
    Date of Patent: August 24, 1999
    Assignee: Mitsubishi Engineering-Plastics Corp,
    Inventors: Norio Narazaki, Yutaka Shiraishi, Osamu Kakinoki
  • Patent number: 5902534
    Abstract: A method of injection-molding a thermoplastic resin, which involves the steps of(a) injecting a molten resin of a thermoplastic resin into a cavity provided in a mold composed of a fixed mold member and a movable mold member,(b) introducing a predetermined amount of a coating material into between the resin in the cavity and the cavity wall after the injection of the molten resin is completed, to allow the resin in the cavity to be compressed with the introduced coating material and/or to allow the movable mold member to move in the mold-opening direction, and(c) maintaining a molding pressure before the mold releasing at a level higher than 0 kgf/cm.sup.2.
    Type: Grant
    Filed: September 5, 1995
    Date of Patent: May 11, 1999
    Assignees: Mitsubishi Engineering-Plastics Corp., Dai Nippon Toryo Co., Ltd.
    Inventors: Takeshi Fujishiro, Toshiaki Izumida, Kazuyuki Akahori, Yoshiaki Yamamoto
  • Patent number: 5741446
    Abstract: A method is disclosed for the production of a molded article, using a mold assembly including a mold having a cavity, for producing a molded article from a thermoplastic resin; an insert block formed of ceramic or glass having a thermal conductivity of 2.times.10.sup.-2 cal/cm.sec..degree.C. or less, the insert block being disposed inside the mold, constituting part of the cavity, and having a thickness of 0.5 mm to 10 mm; and a cover plate for covering a peripheral portion of the insert block. The cover plate is attached to the mold and constitutes part of the cavity, wherein a clearance between the insert block and the cover plate is 0.001 mm to 0.03 mm, an amount of overlapping of the insert block and the cover plate is at least 0.1 mm. The method includes filling a molten thermoplastic resin in the cavity, and then cooling the thermoplastic resin to solidness.
    Type: Grant
    Filed: May 23, 1996
    Date of Patent: April 21, 1998
    Assignee: Mitsubishi Engineering-Plastics Corp.
    Inventors: Hisashi Tahara, Toshiaki Izumida
  • Patent number: 5736090
    Abstract: A method of in-mold coating using a coating composition including:(A) a vehicle component including (i) a urethane acrylate oligomer or a urethane methacrylate oligomer, which is a reaction product containing no substantial unreacted isocyanate groups, of (a) an organic polyisocyanate, (b) an organic polyol and (c) a hydroxyalkyl acrylate or a hydroxyalkyl methacrylate, and (ii) a polymerizable unsaturated monomer,(B) a polyisocyanate compound, and(C) a polymerization initiator.
    Type: Grant
    Filed: March 20, 1996
    Date of Patent: April 7, 1998
    Assignees: Dai Nippon Tokyo Co., Ltd., Mitsubishi Engineering-Plastics Corp.
    Inventors: Yoshiaki Yamamoto, Kenji Ohta, Kenji Yonemochi, Satoshi Fujii, Takeshi Fujishiro, Toshiaki Izumida