Patents Assigned to Mitsubishi Gas Chemical Company, Inc.
  • Publication number: 20220098369
    Abstract: Disclosed are a degradable resin composition including a cyanate ester (A) and a compound (B) having a hydroxyl group with a hydroxyl group equivalent of less than 240 g/eq., and a degradable cured product and a downhole tool for drilling using the same.
    Type: Application
    Filed: February 3, 2020
    Publication date: March 31, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Masahiro SHIMADA, Daisuke OHNO, Hiroto KUMAGAI
  • Patent number: 11286342
    Abstract: A polycarbonate resin having a high refractive index, low Abbe number, and high moist heat resistance that includes structural units represented by general formula (1):
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: March 29, 2022
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Noriyuki Kato, Mitsuteru Kondo, Kentaro Ishihara, Munenori Shiratake, Koji Hirose, Shinya Ikeda, Kensuke Oshima, Shuya Nagayama, Shoko Suzuki
  • Publication number: 20220089865
    Abstract: Provided a resin composition that is excellent in formability, and is also excellent in heat resistance and transparency when made into a formed article, as well as a formed article using the resin composition. The resin composition of the present invention contains a bisphenol AP type polycarbonate resin having a viscosity average molecular weight of 18,500 to 23,000; and a bisphenol A type polycarbonate resin having a viscosity average molecular weight of 25,000 to 35,000, wherein the ratio (WAP/WA) of the mass (WAP) of the bisphenol AP type polycarbonate resin to the mass (WA) of the bisphenol A type polycarbonate resin is 20/80 to 90/10, and the difference (|?A??AP|) between the intrinsic viscosity (?AP) of the bisphenol AP type polycarbonate resin and the intrinsic viscosity (?A) of the bisphenol A type polycarbonate resin is 0.04 to 0.18 dL/g.
    Type: Application
    Filed: February 4, 2020
    Publication date: March 24, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventor: Keisuke TOMITA
  • Publication number: 20220089866
    Abstract: Provided is a resin composition that is excellent in formability, and is also excellent in heat resistance and transparency when made into a formed article, as well as a formed article. The resin composition of the present invention contains a bisphenol AP type polycarbonate resin having a viscosity average molecular weight of 18,500 to 23,000; and a bisphenol A type polycarbonate resin having a viscosity average molecular weight of 10,000 to 15,000, wherein the mass ratio of the bisphenol AP type polycarbonate resin to the bisphenol A type polycarbonate resin is 20/80 to 90/10, the difference between the viscosity average molecular weight of the bisphenol AP type polycarbonate resin and the viscosity average molecular weight of the bisphenol A type polycarbonate resin is 5,000 to 13,000, and the total content of the bisphenol AP type polycarbonate resin and the bisphenol A type polycarbonate resin is more than 85% by mass of resin components contained in the composition.
    Type: Application
    Filed: February 4, 2020
    Publication date: March 24, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventor: Keisuke TOMITA
  • Patent number: 11279957
    Abstract: To provide a method for producing a polyester comprising at least a 3-hydroxybutyrate unit as a polymerization unit and having a high molecular weight and a narrow molecular weight distribution (that is, small Mw/Mn). A method for producing a polyester comprising culturing a microorganism in a culture solution containing a carbon source and a nitrogen source, the polyester having a weight average molecular weight of 1,000,000 or greater and comprising at least a 3-hydroxybutyrate unit as a polymerization unit. The culture conditions include maintenance of an osmotic pressure of the culture solution from 200 mOsm to 900 mOsm during culture period, and maintenance of a nitrogen atom concentration of the culture solution at 0.30 g/L or greater during culture period.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: March 22, 2022
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventor: Akira Maehara
  • Patent number: 11279826
    Abstract: There is provided a low-viscosity resin composition having high mechanical strength when formed into a molded article and having excellent fluidity, and a molded article formed from the resin composition.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: March 22, 2022
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Momoko Yamashita, Takafumi Oda, Hatsuki Oguro
  • Publication number: 20220076859
    Abstract: A resin composition comprising a maleimide compound, a cyanate ester compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
    Type: Application
    Filed: November 16, 2021
    Publication date: March 10, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya TOMIZAWA, Yoichi TAKANO, Meguru ITO, Eisuke SHIGA
  • Publication number: 20220073755
    Abstract: An antireflection film is provided and includes a base material layer that contains a thermoplastic resin and a high refractive index layer that is superposed on at least one surface of the base material layer, while having a refractive index that is higher than the refractive index of the base material layer, and which is configured such that the high refractive index layer contains a fluorene diol, an isocyanate and a polymer of a resin material that contains a (meth)acrylate and a urethane (meth)acrylate derived from a (meth)acrylate.
    Type: Application
    Filed: January 8, 2020
    Publication date: March 10, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Fumiaki KAKEYA, Yasutaka FUKUNAGA
  • Patent number: 11271245
    Abstract: The present invention can provide a production method for a solid electrolyte having Li3PS4, said method characterized by including: a solution-making step in which a homogenous solution is prepared by mixing Li2S and P2S5 into an organic solvent; and a precipitation step in which further Li2S is added to and mixed in the homogenous solution and a precipitate is formed. Preferably, the embodiment either has a molar ratio (Li2S/P2S5) between the Li2S and the P2S5 in the solution-making step of 1.0-1.85 or has further Li2S added to the homogenous solution in the precipitation step such that the molar ratio becomes Li2S/P7S5=2.7-3.3.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 8, 2022
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Aki Katori, Kotaro Kawakami
  • Publication number: 20220062881
    Abstract: It is desired to develop a method of producing hydrogen peroxide, which is capable of producing hydrogen peroxide with high production efficiency. According to the present invention, provided is a palladium-containing composition comprising palladium particles and a coating agent that coats the surface of the palladium particles, wherein a compound having an O?X structure (wherein X represents any of a phosphorus atom, a sulfur atom, and a carbon atom) is comprised as the coating agent.
    Type: Application
    Filed: September 12, 2019
    Publication date: March 3, 2022
    Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC., KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
    Inventors: Tatsumi ISHIHARA, Norikazu OKUDA, Ken-ichi KIMIZUKA, Ken TASAKI
  • Publication number: 20220071025
    Abstract: A resin composition of the present invention contains: a maleimide compound (A) having a transmittance of 5% or more at a wavelength of 405 nm (h-line); a particular carboxylic acid containing compound (B); and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).
    Type: Application
    Filed: January 17, 2020
    Publication date: March 3, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yune KUMAZAWA, Takuya SUZUKI, Seiji SHIKA
  • Patent number: 11261194
    Abstract: Provided is a method for producing a diol represented by Formula (1), the method including using water as a solvent to carry out a cyclodehydration reaction of a 1,4-cyclohexanedione derivative represented by Formula (2) with a triol represented by Formula (3) to produce a diol represented by Formula (1). In Formula (1), R1 and R2 each independently denote a hydrocarbon group, and R3 each independently denotes a hydrogen atom, a heteroatom-containing group, a halogen atom-containing group, a linear alkyl group having from 1 to 6 carbon atoms, a branched alkyl group having from 3 to 6 carbon atoms, or a group including an aryl group and having from 6 to 12 carbon atoms.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: March 1, 2022
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Hideyuki Sato, Ryuji Hasemi
  • Patent number: 11261167
    Abstract: To provide a method that can efficiently produce 2,5-bis(aminomethyl)tetrahydrofuran. The method for producing 2,5-bis(aminomethyl)tetrahydrofuran, the method including subjecting 2,5-bis(aminomethyl)furan to a reaction with hydrogen source by using a hydrogenation catalyst to obtain 2,5-bis(aminomethyl)tetrahydrofuran.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: March 1, 2022
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Ryo Asai, Tomoaki Kirino
  • Patent number: 11261303
    Abstract: A method for producing a polyimide resin film, including: a coating step of forming a coated film by coating a polyimide resin composition containing a polyimide resin, an antioxidant, and a solvent on a substrate; and a drying step of drying the coated film in air at 180° C. or more, the antioxidant being a phenol-based antioxidant, and a content of the phenol-based antioxidant being 0.05 part by mass or more per 100 parts by mass of the polyimide resin.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: March 1, 2022
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Aoi Daito, Shinji Sekiguchi
  • Publication number: 20220056214
    Abstract: A polyimide resin composition containing a polyimide resin (A) and an antioxidant (B), wherein the polyimide resin (A) contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %, and the antioxidant (B) contains one or more copper compounds (B1) selected from the group consisting of copper fluoride, copper bromide, copper iodide, and copper carboxylates, or a cerium-containing compound (B2); wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containin
    Type: Application
    Filed: March 5, 2020
    Publication date: February 24, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Atsushi SAKAI, Yuuki SATO
  • Publication number: 20220056259
    Abstract: It has been desired to develop a method for producing an oxymethylene polymer, by which an oxymethylene polymer having a high polymerization degree can be produced with high efficiency while suppressing increase in the amount of generation of an odor. Further, it has been desired to develop an oxymethylene polymer resin composition, wherein generation of an odor at the time of molding or after molded to obtain a molded body is suppressed. The present invention provides a method for producing an oxymethylene polymer, wherein the oxymethylene polymer is produced by polymerizing a cyclic oligomer of formaldehyde, and wherein a boron trifluoride compound and an aryl fluoride boron compound are used as polymerization catalysts. The present invention also provides an oxymethylene polymer resin composition containing an oxymethylene polymer and a derivative of an aryl fluoride boron compound.
    Type: Application
    Filed: June 10, 2020
    Publication date: February 24, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takuya OKADA, Daisuke SUNAGA
  • Publication number: 20220056224
    Abstract: Provided is a resin sheet for molding, which is provided with a base material layer that contains a polycarbonate resin (a1), a high hardness resin layer that contains a high hardness resin, and a hard coat anti-glare layer, and which is configured such that: the high hardness resin layer is arranged between the base material layer and the hard coat anti-glare layer; the glass transition points of the polycarbonate resin (a1) and the high hardness resin satisfy the relational expression ?10° C.?(glass transition point of high hardness resin)?(glass transition point of polycarbonate resin (a1))?40° C.; and two protective films are superposed and bonded onto both surfaces of the resin sheet.
    Type: Application
    Filed: February 25, 2020
    Publication date: February 24, 2022
    Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC., MGC FILSHEET CO., LTD.
    Inventors: Atsuhiro TOKITA, Kenta NONAKA, Masato TAKASAKI
  • Patent number: 11256170
    Abstract: The resist composition of the present invention contains one or more selected from compounds represented by specific formulae and resins obtained using these as monomers.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: February 22, 2022
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takumi Toida, Masatoshi Echigo, Takashi Sato, Youko Shimizu
  • Patent number: 11254818
    Abstract: A resin composition which has oxygen-barrier properties less apt to depend on humidity and has high transparency; and a formed article and a film which include the resin composition are provided.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: February 22, 2022
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takanori Miyabe, Takafumi Oda, Kazuya Sato
  • Publication number: 20220051958
    Abstract: A method for producing a package substrate for mounting a semiconductor device includes: forming a first substrate by forming a laminate in which a first metal layer that has a thickness of 1 ?m to 70 ?m and that is peelable from a core resin layer, a first insulating resin layer, and a second metal layer are arranged on both sides of the core resin layer having a thickness of 1 ?m to 80 ?m, and heating and pressurizing the laminate simultaneously; forming a pattern on the second metal layer; forming a second substrate by heating and pressurizing a laminate formed by arranging a second insulating resin layer and a third metal layer on a surface of the second metal layer; and peeling, from the core resin layer, a third substrate including the first metal and insulating resin layers, the second metal and insulating layers, and the third metal layer.
    Type: Application
    Filed: October 21, 2019
    Publication date: February 17, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Syunsuke HIRANO, Yoshihiro KATO, Takaaki OGASHIWA