Abstract: There is provided a resist film removing composition used in a manufacture of a thin film circuit element having an organic insulation film that can remove a resist film remaining after etching easily without swelling the organic insulation film. The resist film removing composition comprises 50 to 90% by weight of an alkanolamine having 3 or more carbon atoms, 8 to 40% by weight of a water-miscible solvent and 2 to 30% by weight of water.
Type:
Application
Filed:
October 21, 1998
Publication date:
August 16, 2001
Applicant:
SHARP CORPORATION; MITSUBISHI GAS CHEMICAL COMPANY INCORPORATED
Abstract: A gas injection technique of injecting an inert gas (e.g., nitrogen gas) into a molten resin in a cavity, involves utilizing the strokes of reciprocation of a piston in the compression cylinder are used in a series mode, to perform a two-stage compression within the same cylinder, thereby providing a high-pressure gas. The method can also include establishing a relationship or pattern of the amount of movement of the piston with the speed of movement of the piston established to provide optimum control of the relationship between the pressure generated and piston stroke, and quantity of gas injected. The injecting gas pressure can be detected, to control a hold pressure, or the relationship between a piston stroke and generated pressure, so as to obtain optimal injecting pressure during the injection molding operation.
Type:
Grant
Filed:
November 21, 1989
Date of Patent:
October 15, 1991
Assignees:
Mitsubishi Gas Chemical Company, Incorporated, Nireco Corporation