Abstract: Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (?m) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (?m) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.

Abstract: Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.

Abstract: A gas barrier polymer is formed by heat-curing a mixture including polycarboxylic acid and a polyamine compound, in which, in an infrared absorption spectrum, when a straight line connecting a measurement point at 1493 cm?1 and a measurement point at 1780 cm?1 is set as a baseline, an absorption intensity at 1660 cm?1 is set as I(1660), and an absorption intensity at 1625 cm?1 is set as I(1625), R represented by Equation (1) is greater than 1. R=I(1660)/I(1625)?{?0.65×(total amine/COOH)+0.

Abstract: A sheet set for encapsulating a solar battery including a first encapsulating sheet and a second encapsulating sheet which are disposed between a light-incident surface protective member and a back surface protective member, and are used to encapsulate solar battery elements is provided. When the first encapsulating sheet and the second encapsulating sheet are subjected to a heating and pressurization treatment in which the first encapsulating sheet and the second encapsulating sheet are heated and depressurized under defined conditions, a volume resistivity of the first encapsulating sheet measured under defined conditions, is higher than a volume resistivity of the second encapsulating sheet. The first encapsulating sheet is disposed between the light-incident surface protective member and the solar battery elements. The second encapsulating sheet has at least one polar group selected from a carboxyl group, an ester group, a hydroxyl group, an amino group, and an acetal group.

Abstract: Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (?m) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (?m) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.

Abstract: Provided is a component-manufacturing film that includes a first region S1 and a second region S2 disposed so as to surround the region S1; the region S1 is formed of a base layer and an adhesive layer provided on one surface side of the base layer; the region S2 is formed of the base layer, the adhesive layer, and an additional layer affixed onto the layer. In the temperature range of 190° C. or lower, a tensile elastic modulus of the additional layer is equal to or greater than the tensile elastic modulus of the base layer. Further provided are a component-manufacturing tool and method, the latter including a component fixing step; a film placement step of performing placement so that the boundary between the region S1 and the region S2 is located inside with respect to an edge of the chuck table; a chucking step; and a heating step.

Abstract: A barrier laminate film (100) of the present invention includes: a base material layer (101), a stress relaxation layer (102), an inorganic material layer (103), and a barrier resin layer (104) in this order. The barrier resin layer (104) includes an amide cross-linked compound of a polycarboxylic acid and a polyamine, and the stress relaxation layer (102) includes a polyurethane-based resin having an aromatic ring structure in a main chain.

Abstract: A method for manufacturing a semiconductor device according to the present invention includes at least the following three steps: (A) a step of preparing a first structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and a first semiconductor component (60) adhered to the adhesive resin layer (30) and having a first terminal (65); (B) a step of performing solder reflow processing on the first structure (100) in a state where the first semiconductor component (60) is adhered to the adhesive resin layer (30); and (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50).

Abstract: A component manufacturing method includes a step of obtaining a holding tool. The holding tool includes: a frame body having an opening; and a holding film placed on the frame body. The step is a step of placing the holding film on the frame body while stretching the holding film in at least three different directions or in all directions to the frame body. The holding film includes a base layer and a holding layer. The holding tool forming device includes: a mechanism that pushes a plain film from a base layer side to bring about a stretched state; a mechanism that fixes the plain film to the frame body such that the stretched state is maintained; and a mechanism that isolates an unnecessary portion from the plain film to obtain the holding film.

Abstract: A coating material for a gas barrier includes polycarboxylic acid, a polyamine compound, a polyvalent metal compound, and a base, in which (molar number of —COO— groups included in the polycarboxylic acid)/(molar number of amino groups included in the polyamine compound)=100/20 to 100/90.

Abstract: A method for manufacturing electronic apparatus includes: a step (A) of preparing a structure provided with an adhesive film and one or two or more electronic components affixed to an adhesive surface of the adhesive film; a step (B) of disposing the structure in the electronic component testing apparatus such that the electronic component is positioned over an electronic component installation region of a sample stand of the electronic component testing apparatus in a defined manner; a step (C) of evaluating the properties of the electronic component in a state of being affixed to the adhesive film with the probe terminal being in contact with a terminal of the electronic component; and a step (D) of picking up the electronic component from the adhesive film after the step (C). A defined sample stand is also provided.

Abstract: An adhesive film used when sealing an electronic component to temporarily fix the electronic component, the adhesive film including a base material layer, an adhesive resin layer which is provided on a first surface side of the base material layer and which is for temporarily fixing the electronic component, and an adhesive resin layer which is provided on a second surface side of the base material layer and of which the adhesive strength decreases according to an external stimulus, in which the adhesive resin layer includes a polyvalent carboxylic acid ester-based plasticizer and an adhesive resin, and a content of the polyvalent carboxylic acid ester-based plasticizer in the adhesive resin layer is more than or equal to 0.7 parts by mass and less than or equal to 50 parts by mass with respect to 100 parts by mass of the adhesive resin included in the adhesive resin layer.

Abstract: A method for manufacturing electronic apparatus includes: a step (A) of preparing a structure provided with an adhesive film and one or two or more electronic components affixed to an adhesive surface of the adhesive film; a step (B) of disposing the structure in the electronic component testing apparatus such that the electronic component is positioned over an electronic component installation region of a sample stand of the electronic component testing apparatus in a defined manner; a step (C) of evaluating the properties of the electronic component in a state of being affixed to the adhesive film with the probe terminal being in contact with a terminal of the electronic component; and a step (D) of picking up the electronic component from the adhesive film after the step (C). A defined sample stand is also provided.

Abstract: In order to provide a component manufacturing apparatus and a component manufacturing method that can normally chuck and fix a component holding film to a chuck table in a heated state, the present component manufacturing apparatus 1 includes a chucking and fixing means 20 that chucks and fixes a component holding film to a heated chucking surface 21a, and a preventing means 30 that prevents heat convection, occurring on the chucking surface 21a, from contacting the film. The present component manufacturing method includes a setting step of chucking and fixing the film to the heated chucking surface 21a, and the setting step includes a preventing step of preventing heat convection, occurring on the chucking surface 21a, from contacting the film.

Abstract: A coating material for a gas barrier includes polycarboxylic acid, a polyamine compound, a polyvalent metal compound, and a base, in which (molar number of —COO— groups included in the polycarboxylic acid)/(molar number of amino groups included in the polyamine compound)=100/20 to 100/90.

Abstract: The present invention provides a freshness-retentive film having high antibacterial characteristics. In the freshness-retentive film according to the present invention, at least one compound selected from the group consisting of palmityldiethanolamine, stearyldiethanolamine, glycerol monolaurate, and diglycerol monolaurate is present on at least one surface of the film at 0.002 to 0.5 g/m2.

Abstract: A barrier laminate film (100) of the present invention includes: a base material layer (101), a stress relaxation layer (102), an inorganic material layer (103), and a barrier resin layer (104) in this order. The barrier resin layer (104) includes an amide cross-linked compound of a polycarboxylic acid and a polyamine, and the stress relaxation layer (102) includes a polyurethane-based resin having an aromatic ring structure in a main chain.

Abstract: Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E?(160)/E?(?40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at ?40° C. is RE?0.01, and the elastic modulus E?(?40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

Abstract: The method for manufacturing an electronic device includes at least: a step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer and for temporarily fixing an electronic component, and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, an electronic component attached to the adhesive resin layer (A) of the adhesive film, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; at least one step selected from a step of decreasing water content in the adhesive film and a step of decreasing water content in the structure; and a step of sealing the electronic component with a sealing material.

Abstract: Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E?(160)/E?(?40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at ?40° C. is RE?0.01, and the elastic modulus E?(?40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.