Patents Assigned to Mitsui High-Tech Inc.
  • Mold for resin sealing
    Patent number: 6276913
    Abstract: In the surface of a lower die 104 in a resin sealing mold, a region where an external leads 18 of a lead frame 12 and its peripheral regions having a width of 0.1 mm are mirror-finished to form a mirror-face region 22. The other region than the mirror-face region is subjected to discharging processing to form a satin-finished region 24. The resin-sealing mold having such a structure permits a package to be smoothly released and prevents resin from remaining.
    Type: Grant
    Filed: February 2, 2000
    Date of Patent: August 21, 2001
    Assignee: Mitsui High-Tech Inc.
    Inventors: Masanori Mitsui, Masanori Mikawa