Abstract: A method for manufacturing a laminated core includes a laminating process of obtaining a laminate in which a plurality of core pieces are laminated, and a welding process of forming a weld bead which extends in a thickness direction of the laminate on a side surface of the laminate. In the welding process, a heat input when a center portion in a longitudinal direction of the weld bead is formed is greater than a heat input when an end portion of the weld bead is formed.

Abstract: There is provided a rotor core which increases the quality and reliability thereof by preventing the occurrence of a core separation of the rotor core. There is provided a rotor core including a plurality of substantially cylindrical core blocks which are stacked on each other; and a plurality of magnets, characterized in that a plurality of magnet holes extending in an axial direction are provided in the plurality of core blocks so as to extend over the plurality of core blocks in that the plurality of magnets are accommodated in each of the plurality of magnet accommodation holes and fixed therein with a resin, and in that an axial position of core block boundary planes where the plurality of core blocks are brought into abutment with each other and an axial position of magnet boundary planes where the plurality of magnets are brought into abutment with each other differ from each other.

Abstract: In a lead frame used for manufacturing a semiconductor device by forming a circuit pattern group including unit lead frames having plural upper side terminal parts in the periphery of a semiconductor element mounting region in one line or plural lines and an outer frame surrounding the circuit pattern group in a state of having a gap in a lead frame material and then mounting a semiconductor element every the unit lead frame and carrying out necessary wiring and enclosing the entire surface of the circuit pattern group in which the semiconductor element is mounted and a part of the outer frame with a resin from an upper surface side and further etching from a lower surface side and forming lower side terminal parts joined to the upper side terminal parts of the circuit pattern group, the circuit pattern group and the outer frame are had and the inner edge of the outer frame is formed in an uneven portion in plan view and bonding between the resin and the outer frame is enhanced.

Abstract: In order to remove plating burrs generated in etching step, there is provided a manufacturing method of semiconductor devices on each of unit leadframes in a leadframe material in which a plurality of the unit leadframes are arranged in plural rows or a single row, wherein at least two types of plating burr removals are conducted after a half-etching is performed onto a front surface side of the leadframe material, using a first plating layer as resist film.

Abstract: In the surface of a lower die 104 in a resin sealing mold, a region where an external leads 18 of a lead frame 12 and its peripheral regions having a width of 0.1 mm are mirror-finished to form a mirror-face region 22. The other region than the mirror-face region is subjected to discharging processing to form a satin-finished region 24. The resin-sealing mold having such a structure permits a package to be smoothly released and prevents resin from remaining.

Abstract: The present invention relates to a method for annealing a core blank of a transformer or the like so as to relieve the stress generated in the electrical steel sheet sections due to blanking.The present invention is an improvement over the conventional resistance or gas-heating method in the light of heating efficiency and time and is characterized by induction-heating a core blank at a power input range of from 0.5 to 3 kW/kg of the core blank. This range attains a small variation in the shape of a core blank due to induction-heating.