Abstract: An electrode catalyst layer for a fuel cell includes a catalyst/support composite including a support and a catalyst supported thereon. The support contains a titanium oxide. The surface of the catalyst/support composite has an oxide of at least one element selected from the group consisting of niobium, tantalum, zirconium, and silicon. The ratio A2/A1 is from 0.35 to 1.70, wherein A1 is the atomic ratio of titanium on a surface of the catalyst layer and A2 is the atomic ratio of a total of niobium, tantalum, zirconium, and silicon on the surface of the catalyst layer, A1 and A2 being measured by X-ray photoelectron spectroscopy. The titanium oxide preferably has a composition TiOX (0.5?x<2).

Abstract: A method is provided for producing a bonding composition containing copper particles and a second liquid medium. In this production method, the copper particles are produced in a first liquid medium using a wet reduction method, and thus a dispersion of the copper particles is prepared. Subsequently, the first liquid medium in the dispersion is ultimately, finally or eventually replaced with the second liquid medium while the dispersion is kept wet. It is also preferable that the first liquid medium is replaced with another liquid medium one or more times, and the second liquid medium is used in the final replacement. The liquid media are preferably replaced at a temperature of lower than 100° C. The second liquid medium preferably includes one or more of water, alcohol, ketone, ester, ether, and hydrocarbon.

Abstract: Provided is a heating element capable of rapidly increasing the temperature even when the supply voltage is low. The heating element includes a resin film and heating wires provided on at least one surface of the resin film and including a copper wire, wherein copper crystal grains forming the copper wire have a cross-sectional crystal size of 1.5 ?m or more.

Abstract: Provided is a copper-clad laminate in which a copper foil and a resin are joined together with high heat-resistant adhesion force though a fluororesin is used. This copper-clad laminate includes a surface-treated copper foil including a copper foil and a zinc-containing layer on at least one surface of the copper foil; and a sheet-shaped fluororesin on the zinc-containing layer side of the surface-treated copper foil. The zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200° C. or more. When the interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by GD-OES, the emission intensity ratio IZn/ICu of the emission intensity of Zn to that of Cu is 3.0×10?3 or less, and the emission intensity ratio IZn/IM of the emission intensity of Zn to that of the transition element M is 0.30 to 0.50.

Abstract: Provided is a carrier-attached metal foil which can suppress the number of foreign matter particles on the surface of a metal layer to enhance circuit formability, and can keep stable releasability even after heating at a high temperature of 240° C. or higher (for example, 260° C.) for a long period of time. The carrier-attached metal foil includes a carrier, a release functional layer provided on the carrier, the release functional layer including a metal oxynitride, and a metal layer provided on the release functional layer.

Abstract: There is provided a sheet fixing apparatus capable of suppressing occurrence of leak between a multilayer sheet and a support stage to secure adhesive force when fixing one surface of the multilayer sheet and releasing a layer on an opposite side thereto. The sheet fixing apparatus includes a support stage for supporting the multilayer sheet, and suction means capable of sucking the multilayer sheet toward the support stage via a suction hole. The support stage has a plate-shaped member having a flat surface on which the multilayer sheet can be placed, a suction hole provided at a position corresponding to an outer peripheral portion of the multilayer sheet in the plate-shaped member, and a step portion provided along an outside of the suction hole in the plate-shaped member. The flat surface of the plate-shaped member has a flatness of 0.30 mm or less as defined by JIS B0621-1984.

Abstract: A composition for pressure bonding contains a metal powder and a solid reducing agent and has a compressibility of 10% to 90%, the compressibility being expressed by a relationship formula using the thickness A of a dried coating film formed by drying the composition in an air atmosphere at 110° C. under atmospheric pressure for 20 minutes and the thickness B of a sintered body formed by treating the dried coating film in a nitrogen atmosphere at 280° C. under a pressure of 6 MPa for 20 minutes. The solid reducing agent may be BIS-TRIS. Also provided is a bonded structure of conductors in which a bonding portion via which two conductors are bonded together is formed by treating, under pressure, the two conductors and a coating film formed of the composition for pressure bonding provided therebetween.

Abstract: A method for measuring a surface parameter of copper foil exhibiting high correlation with high frequency characteristics, the method for measuring a surface parameter of copper foil including: (a) acquiring a surface profile on at least one surface of an untreated copper foil; (b) setting a cutoff value for an L filter based on the surface profile; (c) acquiring a surface profile on at least one surface of surface-treated copper foil originating from the untreated copper foil; (d) subjecting the surface profile of the surface-treated copper foil to filter processing, the filter processing including processing using an L filter with the cutoff value; and (e) calculating at least one of surface parameters defined by ISO25178 on the surface of the surface-treated copper foil based on the surface profile after the filter processing.

Abstract: Provided is a double-sided copper clad laminate that can realize not only good capacitor characteristics but also excellent handleability. This double-sided copper clad laminate is a double-sided copper clad laminate having copper foil adhered onto both surfaces of a dielectric layer, wherein the dielectric layer has a thickness of 0.1 ?m or more and 2.0 ?m or less, and the double-sided copper clad laminate further includes a pair of resin layers arranged in contact with the copper foil between the dielectric layer and the copper foil.

Abstract: There is provided a laminate that can suppress the warpage of a laminated product when used for the manufacture of the laminated product. This laminate includes a float glass substrate having a top surface and a bottom surface; and a metal layer provided on the top surface side of the float glass substrate.

Abstract: A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 ?m or more and 3.3 ?m or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

Abstract: A measurement method capable of acquiring, in a simple manner, a surface parameter of copper foil exhibiting high correlation with high frequency characteristics, the method including: (a) acquiring a surface profile of surface-treated copper foil as a reference; (b) setting a cutoff value for an L filter, the cutoff value satisfies: (i) an arithmetical mean height Sa after processing with the L filter, being 0.5 ?m or less, and (ii) a percent change of Sdr or ? value after processing with the L filter being 80% or less; (c) acquiring a surface profile of surface-treated copper foil as a measurement object; (d) subjecting the acquired surface profile of the copper foil as the measurement object to filter processing; and (e) calculating at least one of surface parameters defined in ISO25178 on the copper foil as the measurement object based on the surface profile after the filter processing.

Abstract: There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 ?m thick having a surface having an arithmetic mean waviness Wa of 0.10 ?m or more and 0.25 ?m or less and a valley portion void volume Vvv of 0.010 ?m3/?m2 or more and 0.028 ?m3/?m2 or less; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

Abstract: Provided is an electrodeposited copper foil having high smoothness and exhibiting high flexibility (particularly, high flexibility after annealing at 180° C. for 1 hour) suitable for a flexible substrate. This electrodeposited copper foil has an Rz of 0.1 to 2.0 ?m on at least one surface. In cross-sectional analysis by EBSD, a proportion of an area occupied by copper crystal grains satisfying the following conditions relative to an area of an observation field occupied by copper crystal grains is 63% or more. The conditions are as follows: i) (101) orientation; ii) an aspect ratio of 0.500 or less; iii) |sin ?| of 0.001 to 0.707, where ? (°) is an angle between a normal line of an electrode surface of the electrodeposited copper foil and a major axis of the copper crystal grain; and iv) when the crystal is elliptically approximated, a length of a minor axis of 0.38 ?m or smaller.

Abstract: A resin composition is provided including: coated particles, each including a core containing a metal oxide and a coating layer containing an aluminum hydrous oxide and provided on a surface of the core; and a resin. The metal oxide is represented by MxOy, where M represents at least one element selected from the group consisting of Ba, Ti, Sr, Pb, Zr, La, Ta, Ca, and Bi, and x and y each represent a number determined from a stoichiometric ratio according to the valence of the metal element M. The resin composition has an atomic ratio Al/(M+Al) of 0.05 or more and 0.7 or less, as determined by XPS for the particles contained in the resin composition.

Abstract: A method for measuring a surface parameter of copper foil exhibiting high correlation with high frequency characteristics, the method for measuring a surface parameter of copper foil including: (a) acquiring a surface profile on at least one surface of an untreated copper foil; (b) setting a cutoff value for an L filter based on the surface profile; (c) acquiring a surface profile on at least one surface of surface-treated copper foil originating from the untreated copper foil; (d) subjecting the surface profile of the surface-treated copper foil to filter processing, the filter processing including processing using an L filter with the cutoff value; and (e) calculating at least one of surface parameters defined by ISO25178 on the surface of the surface-treated copper foil based on the surface profile after the filter processing.

Abstract: Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and suppression of powdering. This roughened copper foil includes a roughened surface on at least one side. The roughened surface has a roughness slope tan ? of 0.58 or less as calculated based on a mean height Rc (?m) and a mean width RSm (?m) of profile elements by formula Rc/(0.5×RSm), and a sharpness index Rc×Sku of 2.35 or less that is a product of the mean height Rc (?m) and a kurtosis Sku. Rc and RSm are values measured in accordance with JIS B0601-2013 under a condition of not performing a cutoff by a cutoff value ?s and a cutoff value ?c, and Sku is a value measured in accordance with ISO 25178 under a condition of not performing a cutoff using an S filter and an L filter.

Abstract: A solid electrolyte contains aluminum in an amount of 100 to 1000 ppm, inclusive, on a mass basis, and has lithium ion conductivity. It is preferable that aluminum is derived from an oxide of aluminum. It is also preferable that the solid electrolyte is a sulfide solid electrolyte containing a lithium element, a phosphorus element, and a sulfur element. It is also preferable that the solid electrolyte has an argyrodite-type crystal structure. It is also preferable that the solid electrolyte has a lithium ion conductivity of 4.0 mS/cm or greater.

Abstract: A multilayer capacitor includes a laminate having a first side surface and a second side surface, a first side covering portion covering the first side surface, and a second side covering portion covering the second side surface. The laminate includes first conductor layers, second conductor layers, dielectric layers and insulating layers laminated in the z direction. Each first conductor layer is connected to the first side covering portion and spaced apart from the second side covering portion. Each second conductor layer is connected to the second side covering portion and spaced apart from the first side covering portion. The insulating layers have a lower dielectric strength than the dielectric layers. Each dielectric layer is sandwiched between a first conductor layer and a second conductor layer. The insulating layers include one sandwiched between two first conductor layers and one sandwiched between two second conductor layers.

Abstract: Provided is a beta zeolite satisfying P>76.79Q?29.514 in a range in which Q is less than 0.4011 nm, wherein, P represents an AB value that is an intensity ratio of A to B, A represents a diffraction intensity of a main peak of the beta zeolite observed by X-ray diffraction measurement, B represents a diffraction intensity of the (116) plane of ?-alumina obtained by X-ray diffraction measurement under the same conditions as those for the X-ray diffraction measurement on the beta zeolite, the ?-alumina being the standard substance 674a distributed by the American National Institute of Standards and Technology, and Q represents a lattice interplanar spacing of the main peak of the beta zeolite observed by X-ray diffraction measurement. It is preferable that the formula (1) above is satisfied in a range in which Q is from 0.3940 to 0.4000 nm.