Abstract: An opening switch for an opening and closing body includes a switch base having a first substrate and a second substrate which are put together in a manner such that inner faces of the substrates face each other and outer faces of the substrates are outer faces of the switch base; a main switch body provided on the outer face of the first substrate; a lever portion which is provided on the inner face of the first substrate and passes the second substrate through a through hole; and a flange portion for preventing an over stroke of the lever portion. The flange portion protrudes from the outer face of the second substrate and is positioned away from the lever portion and on a side toward which the lever portion is inclined. A flexible cover member for covering a combined body of the lever portion and the flange portion is provided.

Abstract: A power slide device includes a first cable connected to a wire drum and moving in a first direction when wound up by the wire drum, a second cable connected to the wire drum and moving in a second direction when wound up by the wire drum, a first tension roller having a first abutting surface abutting against the first cable, and a second tension roller having a second abutting surface abutting against the second cable. The first abutting surface is taken as an inclined surface becoming gradually shorter in diameter toward the first direction, and the second abutting surface is taken as an inclined surface becoming gradually shorter in diameter toward the second direction.

Abstract: The present invention provides a flat film carrier tape for mounting electronic devices thereon which tape can enhance reliability of a semiconductor chip mounting line. The film carrier tape includes a continuous insulating layer, a wiring pattern formed of a conductor layer provided on a surface of the insulating layer, a row of sprocket holes provided along respective longitudinal edges of the insulating layer, which said row of sprocket holes are at the outer sides of the wiring pattern, and a metallic layer formed around said row of sprocket holes, wherein the metallic layer is provided in a discontinuous manner in the longitudinal direction of the insulating layer by provision of slits on the insulating layer at intervals of three to eight said sprocket holes.

Abstract: The object is to provide a copper foil excellent in the property of selective etching between a resistor layer and a copper layer required in production of a printed-wiring board, and also excellent in UL heat resistance. For this purpose, a copper foil for printed-wiring board comprising a nodular treatment side on one side, wherein a nickel-zinc alloy layer is formed on the nodular treatment side is used for applications of printed-wiring boards. At the same time, a production method suitable for production of the copper foil is provided.

Abstract: A device and method for taking up a spacer which can prevent deformation, for example, the generation of a scratch on the surface of a film carrier tape for mounting an electronic component, the bending of an inner lead, surface damage, a fold caused by bending the film carrier tape, or the like. The feed driving shaft of the reel of the feeding device is coupled to a driving motor, and the take-up driving shaft of the spacer take-up device is coupled to a motor through a clutch, thereby taking up the spacer at a constant tension.

Abstract: The present invention relates to a double-sided copper-clad laminate for forming a capacitor layer, formed by adhering electrodeposited copper foils on the both sides of a dielectric layer of a thickness of 10 ?m or less, and the object of the present invention is to secure good voltage resistant proprieties. For the double-sided copper-clad laminate of the present invention uses an electrodeposited copper foil provided with a matte side to be joined to the dielectric layer prepared by physically polishing the rough surface of an untreated electrodeposited copper foil obtained by an electrolysis method to a surface roughness (Rz) of 0.5 ?m to 3.0 ?m, and nodular treatment, and as required, passivation, silane coupling agent treatment, or the like are performed thereon. As the manufacturing method thereof, a manufacturing method wherein the surfaces of the resin layers of two electrodeposited copper foils having resin layers facing to each other are adhered, or the like.

Abstract: There is provided a flexible printed wiring board including an insulating layer having a high optical transmittance, a high adhesion strength and a high migration resistance, and suitable for a chip on film (hereafter referred to as COF). In a flexible printed wiring board for COF, having an insulating layer on which a conductive layer of an electrodeposited copper foil is laminated, and an optical transmittance of 50% or more of the insulating layer in the etched region when a circuit is formed by etching said conductive layer, electrodeposited copper foil was made to have a rust-proofing layer of a nickel-zinc alloy on the adhering surface to be adhered to the insulating layer; the surface roughness (Rz) of the adhering surface was made to be 0.05 to 1.5 ?m, and the specular gloss was made to be 250 or more when the incident angle is 60°.

Abstract: An object is the provision of a peelable electrodeposited copper foil with carrier foil that stabilizes the peel strength between the carrier foil and the electrodeposited copper foil layer even when used in manufacture of the printed wiring boards that requires pressing at the temperatures of 200° C. or higher. For the purpose of achieving the object, the electrodeposited copper foil with carrier foil 1, which includes an adhesive interface layer 4 arranged on one face of the carrier foil 2 and an electrodeposited copper foil layer 3 arranged on the adhesive interface layer 4, characterized in that the adhesive interface layer 4 is composed of a metal oxide layer ML and an organic material layer OL, and the like are used.

Abstract: A flowmeter including a flow rate detection circuit including a thermal flow rate sensor (10) disposed in a measurement flow passage through which fluid to be measured passes, a temperature sensor circuit (12), a flow rate conversion circuit and a storage means EEPROM. The storage means stores, for respective discrete temperature values, a plurality of individual calibration curves indicating the relationship between electric outputs from the flow rate detection circuit and flow rates, and the individual calibration curves are prepared by using flow rates converted into those at a reference temperature. The flow rate conversion circuit performs interpolation based on temperatures measured by the temperature sensor circuit (12) and a plurality of individual calibration curves to obtain calibrated flow rate values corresponding to temperature at measuring.

Abstract: The object of the present invention is to provide a method of producing low oxygen-containing potassium fluorotantalate crystals or low oxygen-containing potassium fluoroniobate crystals, the crystals obtained by the production method, and a method of analyzing oxygen contained in these crystals. The method of producing low oxygen-containing potassium fluorotantalate crystals comprises generating recrystallized potassium fluorotantalate crystals by controlled cooling of a saturated solution of potassium fluorotantalate containing hydrofluoric acid as an essential component, collecting the generated recrystallized crystals through filtration, and drying the collected recrystallized crystals in a drying apparatus so as to obtain the crystals, and the production method is characterized in that the saturated solution of potassium fluorotantalate containing hydrofluoric acid as an essential component contains hydrofluoric acid in a concentration of 0.5 mol/l to 10 mol/l.

Abstract: Measurements are obtained by a computing unit based on an output Vh from an indirectly-heated constant-temperature controlling flow rate measuring section (16) and an output Vout from a two-constant-point temperature difference detecting flow rate measuring sections (18a, 18b). In the flow rate measuring section (16), a heating element (163) is feedback-controlled based on a detected temperature by a heat sensing element (162) to obtain an output Vh based on the feedback-controlled condition. An output Vout is obtained from flow rate measuring sections (18a, 18b) based on the detected temperature difference between a heat sensing element (182) disposed on the liquid-flow-direction upstream side of the flow rate measuring section (16) and a temperature sensing element disposed on the downstream side.

Abstract: A copper foil which is substantially free of generation of voids even if fusing treatment is conducted on a tin-plated layer and which is excellent in etching properties is provided. To achieve this object, a pure copper-coated copper foil in which a pure-copper plated layer is formed at least on a gloss surface of a base copper foil is employed. The pure copper-plated layer preferably has a thickness of not less than 0.3 ?m. A method of producing a pure copper-coated copper foil, in which electrolysis is conducted using, as an electrolyte, an aqueous sulfuric acid-copper sulfate solution having a Cl? ion concentration of not more than 0.5 mg/l with a base copper foil serving as a cathode, thereby forming a pure copper-plated layer at least on a gloss surface of the base copper foil. The aqueous sulfuric acid-copper sulfate solution preferably has a Cu2+ ion concentration of 40 g/l to 120 g/l and a free SO42? ion concentration of 100 g/l to 200 g/l.

Abstract: The invention provides a surface-treated copper foil which can sufficiently ensure adhesive strength with a low-dielectric substrate used in forming a printed wiring board for high-frequency applications and can minimize transmission losses. There is provided a surface-treated copper foil for a low-dielectric substrate which is used in bonded relationship to a low-dielectric substrate, which is characterized in that a nodular-treated layer constituted by bump-like copper particles is formed on a surface of the copper foil and that ultrafine copper particles are caused to precipitate on the whole surface of the nodular-treated layer and adhere thereto and the roughness value Rz of the surface is 1.0 to 6.5 ?m. The surface color of the surface-treated copper foil has L* of not more than 50, a* of not more than 20 and b* of not more than 15.

Abstract: A clutch mechanism of the power device includes a movable gear member which is rotated integrally with a wheel and engaged with a stationary gear member when moved in a first direction and disengaged from the stationary gear member when moved in a second direction opposite to the first direction, an armature for pushing out the movable gear member in the first direction when rotated relatively to the movable gear member, and an electromagnetic coil for applying brake resistance to the armature by attracting the armature by the magnetic force to restrict a co-rotating state of the armature and the movable gear member. The armature has a clutch holding surface for maintaining a clutch-engaged state where the movable gear member and the stationary gear member is engaged with other even when the electromagnetic coil is turned off in the clutch-engaged state.

Abstract: A film carrier tape for mounting electronic devices thereon having a mounting unit in which a wiring pattern is formed by etching on a base material, wherein the mounting unit has a target mark to be a reference of an alignment for carrying out final defect marking in a target position on the mounting unit by marking means as a pattern formed on the base material by the etching, and a defect marking method using the same are provided.

Abstract: There is provided a cerium-based abrasive containing cerium oxide as a main component, in which the abrasive particles composing the abrasive are coated with a coating layer containing at least either one of a silicon component of silicon or a silicon compound and an aluminum component of aluminum or an aluminum compound. The cerium-based abrasive can be produced by wet-dispersing the cerium-based abrasive in a dispersion medium to obtain a slurry and carrying out surface treatment by adding a treatment solution containing at least either one of the silicon compound and the aluminum compound to the slurry. Further, the cerium-based abrasive can be produced by carrying out surface treatment by adding a treatment solution containing at least either one of the silicon compound and the aluminum compound to the slurry during the pulverization step or after the pulverization step in the conventional cerium-based abrasive production process and after that roasting and classifying the obtained cerium-based abrasive.

Abstract: There is provided a cerium-based abrasive containing cerium oxide as a main component, in which the abrasive particles composing the abrasive are coated with a coating layer containing at least either one of a silicon component of silicon or a silicon compound and an aluminum component of aluminum or an aluminum compound. The cerium-based abrasive can be produced by wet-dispersing the cerium-based abrasive in a dispersion medium to obtain a slurry and carrying out surface treatment by adding a treatment solution containing at least either one of the silicon compound and the aluminum compound to the slurry. Further, the cerium-based abrasive can be produced by carrying out surface treatment by adding a treatment solution containing at least either one of the silicon compound and the aluminum compound to the slurry during the pulverization step or after the pulverization step in the conventional cerium-based abrasive production process and after that roasting and classifying the obtained cerium-based abrasive.

Abstract: Nickel powder includes, on the basis of the total number of particles, not less than 10% of particles whose particle size is not less than 1.2 times the average particle size, as determined by the SEM observation; and not less than 10% of particles whose particle size is not more than 0.8 times the average particle size, as determined by the SEM observation. The nickel powder can be prepared by, for instance, precipitating nickel particles from an aqueous solution containing a nickel salt and a hydrazine reducing agent, without forming any hydroxide of nickel as an intermediate. A conductive paste containing the nickel powder can be applied onto an internal or external electrode for electronic parts.

Abstract: A vehicle door handle device includes a base case secured to a door, and an L-shaped handle lever rotatably mounted on the base case by a supporting shaft and connected to a latch device of the door by way of a connecting member. The handle lever includes an operation arm extending in a first direction and receiving a manual operational force and a coupling arm extending in a second direction substantially orthogonal to the first direction to be connected to the connecting member. The operation arm is made of a synthetic resin and has a small specific gravity, and the coupling arm is made of a metal and has a great specific gravity. The base portions of the operation arm and the coupling arm are undetachably coupled with each other by the supporting shaft.

Abstract: This invention is a silver powder having a low-temperature sintering performance and dispersibility, which allows the powder particles to be agglomerated to a small degree and be nearly in the monodisperse state. Employed is silver powder of fine silver particles each to which fine silver particles adhere, wherein fine silver particles of nano-order particle size are adhered to the surface of each silver powder particle. The powder particles of the silver powder of fine silver particles each to which fine silver particles adhere have excellent dispersibility.