Abstract: A process for producing lithium manganate, comprising pulverizing electrodeposited manganese dioxide by causing particles of electrodeposited manganese dioxide to collide with each other to produce a pulverized material, screening the pulverized material to an average particle size of 3 to 20 &mgr;m thereby to produce a screened material, mixing the screened material with the lithium raw material to form a mixture, and firing the mixture to produce lithium manganate. During screening, electrolytic manganese dioxide having an average particle size smaller than 3 &mgr;m is removed from the screened material.
Type:
Grant
Filed:
June 13, 2000
Date of Patent:
June 25, 2002
Assignee:
Mitsui Mining and Smelting Company, Ltd.
Abstract: A process for producing fine copper powder characterized by comprising mixing fat and oil into a dendritic electrolytic copper powder having an average particle size of 20 to 35 &mgr;m and a bulk density of 0.5 to 0.8 g/cm3 to coat the surface of the electrolytic copper powder particles with the fat and oil and pulverizing the coated particles by means of a jet mill of collision plate type.
Type:
Grant
Filed:
April 28, 2000
Date of Patent:
May 28, 2002
Assignee:
Mitsui Mining and Smelting Company, Ltd.
Abstract: Electrolytic manganese dioxide is pulverized. The manganese dioxide power is neutralized with sodium hydroxide or sodium carbonate to a pH of 2 or higher. The neutralized electrolytic manganese dioxide powder is mixed with a lithium raw material and the mixture is fired.
Type:
Grant
Filed:
March 28, 2000
Date of Patent:
May 7, 2002
Assignee:
Mitsui Mining and Smelting Company, Ltd.
Abstract: A lead-free solder in which oxidation of the powder surface with time is prevented and a process for preparing the same. The lead-free solder powder has tin-zinc or tin-zinc-bismuth as a major composition and forms an organometallic compound of malonic acid and a metal of the solder alloy powder on the surface of solder alloy powder containing no lead.
Type:
Grant
Filed:
June 1, 2000
Date of Patent:
January 1, 2002
Assignee:
Mitsui Mining and Smelting Company, Ltd.
Abstract: A copper alloy excellent in general properties such as heat resistance, electric and heat conductivity and mechanical strength and suitable for use as materials for lead frames of electronic parts, heat exchanger fins, or the like can be obtained by optimizing the Fe and Ti contents and proportions of a Cu-Fe-Ti ternary alloy and adding thereto a suitable amount of one or more members selected from the group consisting of Mg, Sb, V Misch metal, Zr, In, Zn, Sn, Ni, Al, and P.
Type:
Grant
Filed:
August 7, 1984
Date of Patent:
December 17, 1985
Assignee:
Mitsui Mining and Smelting Company, Ltd.