Patents Assigned to Mitsui Mining and Smelting Company, Ltd.
  • Patent number: 6409985
    Abstract: A process for producing lithium manganate, comprising pulverizing electrodeposited manganese dioxide by causing particles of electrodeposited manganese dioxide to collide with each other to produce a pulverized material, screening the pulverized material to an average particle size of 3 to 20 &mgr;m thereby to produce a screened material, mixing the screened material with the lithium raw material to form a mixture, and firing the mixture to produce lithium manganate. During screening, electrolytic manganese dioxide having an average particle size smaller than 3 &mgr;m is removed from the screened material.
    Type: Grant
    Filed: June 13, 2000
    Date of Patent: June 25, 2002
    Assignee: Mitsui Mining and Smelting Company, Ltd.
    Inventors: Koichi Numata, Hiromu Shinkawa
  • Patent number: 6395332
    Abstract: A process for producing fine copper powder characterized by comprising mixing fat and oil into a dendritic electrolytic copper powder having an average particle size of 20 to 35 &mgr;m and a bulk density of 0.5 to 0.8 g/cm3 to coat the surface of the electrolytic copper powder particles with the fat and oil and pulverizing the coated particles by means of a jet mill of collision plate type.
    Type: Grant
    Filed: April 28, 2000
    Date of Patent: May 28, 2002
    Assignee: Mitsui Mining and Smelting Company, Ltd.
    Inventors: Kenzo Hanawa, Kazuaki Takahashi
  • Patent number: 6383683
    Abstract: Electrolytic manganese dioxide is pulverized. The manganese dioxide power is neutralized with sodium hydroxide or sodium carbonate to a pH of 2 or higher. The neutralized electrolytic manganese dioxide powder is mixed with a lithium raw material and the mixture is fired.
    Type: Grant
    Filed: March 28, 2000
    Date of Patent: May 7, 2002
    Assignee: Mitsui Mining and Smelting Company, Ltd.
    Inventors: Masatoshi Nagayama, Shinji Arimoto, Koichi Numata, Tsuneyoshi Kamada
  • Patent number: 6334905
    Abstract: A lead-free solder in which oxidation of the powder surface with time is prevented and a process for preparing the same. The lead-free solder powder has tin-zinc or tin-zinc-bismuth as a major composition and forms an organometallic compound of malonic acid and a metal of the solder alloy powder on the surface of solder alloy powder containing no lead.
    Type: Grant
    Filed: June 1, 2000
    Date of Patent: January 1, 2002
    Assignee: Mitsui Mining and Smelting Company, Ltd.
    Inventors: Kenzo Hanawa, Kiyotaka Yanagi
  • Patent number: 4559200
    Abstract: A copper alloy excellent in general properties such as heat resistance, electric and heat conductivity and mechanical strength and suitable for use as materials for lead frames of electronic parts, heat exchanger fins, or the like can be obtained by optimizing the Fe and Ti contents and proportions of a Cu-Fe-Ti ternary alloy and adding thereto a suitable amount of one or more members selected from the group consisting of Mg, Sb, V Misch metal, Zr, In, Zn, Sn, Ni, Al, and P.
    Type: Grant
    Filed: August 7, 1984
    Date of Patent: December 17, 1985
    Assignee: Mitsui Mining and Smelting Company, Ltd.
    Inventors: Syuichi Yamasaki, Hiroshi Yamaguchi, Yousuke Taniguchi