Abstract: A Si-based negative electrode active material that is capable of improving cycle characteristics, reducing or eliminating a plateau region in the discharge profile, and further improving high-rate characteristics. The Si-based negative electrode active material contains Si and a compound containing Si and a semimetal/metal element M, wherein the content of Si in the negative electrode active material is more than 50 wt %; the content of oxygen atoms (O) is less than 30 wt %; the content of the semimetal/metal element M is more than 10 wt % and less than 50 wt %, wherein in an X-ray diffraction pattern as measured by a powder X-ray diffraction (XRD) device using Cu-K?1 rays, the full width at half maximum of the peak of the (111) plane of Si is 0.25° or more; and wherein the peak intensity of the peak of the (111) plane of Si is less than 20,000 cps; and the true density is 2.5 g/cm3 or more.

Abstract: A positive electrode active material for an all-solid-state lithium secondary battery, which is capable of improving the rate characteristics, the cycle characteristics, and the initial charge and discharge efficiency even in the case where a sulfide-based solid electrolyte is used, wherein the surface of a lithium-containing composite oxide, referred to as present core particles, is coated with a compound, referred to as, LiAO compound, containing Li, A, where A represents one or more elements selected from the group consisting of Ti, Zr, Ta, Nb, Zn, W, and Al, and O; and a halogen is present on the surface of the present core particles.

Abstract: Provided is a 5 V class spinel type lithium nickel manganese-containing composite oxide having an operating potential of 4.5 V or more with respect to a metal Li reference potential, wherein the composite oxide is able to improve cycle characteristics while suppressing the amount of gas generated under high temperature environments and, moreover, to improve output characteristics while suppressing a shoulder on discharge at around 4.1 V in a charge and discharge curve. The spinel type lithium nickel manganese-containing composite oxide is represented by a general formula [Li(LiaNiyMnxTibMgzM?)O4-?] (where 0<a, 0<b, 0.30?y<0.60, 0<z, 0??, x=2?a?b?y?z??<1.7, 3?b/a?8, 0.11<b+z+?, 0<z/b<1, 0???0.2, and M represents one or two or more elements selected from the group consisting of Fe, Co, Ba, Cr, W, Mo, Y, Zr, Nb, P, and Ce).

Abstract: An extremely thin copper foil with a carrier is provided that can keep stable releasability even after being heated for a prolonged time at a high temperature of 350° C. or more. The extremely thin copper foil with a carrier includes a carrier composed of a glass or ceramic material; an intermediate layer provided on the carrier and composed of at least one metal selected from the group consisting of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo; a release layer provided on the intermediate layer and including a carbon sublayer and a metal oxide sublayer or containing metal oxide and carbon; and an extremely thin copper layer provided on the release layer.

Abstract: A glass carrier-attached copper foil is provided that can achieve a desired circuit mounting board that reduces separation of a copper layer at the cut edge even if the copper foil is downsized to dimensions enabling mount of a circuit, and has an intended circuit pattern with a fine pitch. The glass carrier-attached copper foil includes a glass carrier, a release layer, and a copper layer with a thickness of 0.1 to 3.0 ?m. The glass carrier has, at least on its surface having the copper layer thereon, a plurality of flat regions each having a maximum height Rz of less than 1.0 ?m as measured in accordance with JIS B 0601-2001 and a rough region having a maximum height Rz of 1.0 to 30.0 ?m as measured in accordance with JIS B 0601-2001. The rough region has a pattern of lines that define the flat regions.

Abstract: A substrate (11) of an exhaust gas purification catalyst (10) includes inflow-side cells (21), outflow-side cells (22), and porous partition walls (23), each separating the inflow-side cell and the outflow-side cell. Catalyst portions (14, 15) are provided on the surfaces of the partition walls that each face the inflow-side cell and/or the surfaces of the partition walls that each face the outflow-side cell. In a cross section vertical to an exhaust gas flow direction, the percentage of the total area of voids, each void satisfying the expression L/{2(?S)1/2}?1.1 (wherein L is the perimeter of the void in the cross section, and S is the area of the void in the cross section), is greater than 10% to 30% or less based on the apparent area of the catalyst portion present on the partition wall. The content of zirconium element in terms of oxide (amount of ZrO2) in the catalyst portions is from 35 mass % to 85 mass %.

Abstract: Provided is a copper-clad laminate in which a copper foil and a resin are joined together with high heat-resistant adhesion force though a fluororesin is used. This copper-clad laminate includes a surface-treated copper foil including a copper foil and a zinc-containing layer on at least one surface of the copper foil; and a sheet-shaped fluororesin on the zinc-containing layer side of the surface-treated copper foil. The zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200° C. or more. When the interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by GD-OES, the emission intensity ratio IZn/ICu of the emission intensity of Zn to that of Cu is 3.0×10?3 or less, and the emission intensity ratio IZn/IM of the emission intensity of Zn to that of the transition element M is 0.30 to 0.50.

Abstract: Provided is a method for manufacturing a copper-clad laminate in which a copper foil and a resin are joined together with high heat-resistant adhesion force though a fluororesin, which is a low dielectric constant thermoplastic resin, is used. This method includes providing a surface-treated copper foil including a copper foil and a zinc-containing layer on at least one surface of the copper foil, and affixing a sheet-shaped fluororesin to the zinc-containing layer side of the surface-treated copper foil. The zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200° C. or more. When the interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by XPS, the content of Zn is 10 wt % or less, and the Zn/M weight ratio, the ratio of the content of Zn to the content of the transition element M, is 0.2 to 0.6.

Abstract: A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 ?m or more and 3.3 ?m or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

Abstract: Provided is a sulfide-based solid electrolyte which is capable of suppressing the generation of hydrogen sulfide caused by reaction with moisture even when in contact with dry air in a dry room or the like, and capable of maintaining lithium ion conductivity. Proposed is a sulfide-based solid electrolyte for a lithium secondary battery, wherein the surface of a compound containing lithium, phosphorus, sulfur, and halogen, and having a cubic argyrodite-type crystal structure is coated with a compound containing lithium, phosphorus, and sulfur, and having a non-argyrodite-type crystal structure.

Abstract: A sulfide-based solid electrolyte particle having a crystal phase of a cubic argyrodite-type crystal structure composed of Li, P, S and a halogen (Ha. The proposed sulfide-based solid electrolyte particle has a feature such that the ratio (ZHa2/ZHa1) of an element ratio ZHa2 of the halogen (Ha) at the position of 5 nm in depth from the particle surface to an element ratio ZHa1 of the halogen (Ha) at the position of 100 nm in depth from the particle surface is 0.5 or lower, as measured by XPS; and the ratio (ZO2/ZA2) of an element ratio ZO2 of oxygen to the total ZA2 of element ratios of phosphorus (P), sulfur (S), oxygen (O) and the halogen (Ha) at the position of 5 nm in depth from the particle surface is 0.5 or higher, as measured by XPS.

Abstract: There is provided a double-sided copper-clad laminate for forming a capacitor that can exhibit excellent properties in voltage endurance and peel strength, while ensuring high capacitor capacity, when used as a capacitor. This double-sided copper-clad laminate includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 ?m or more and 3.3 ?m or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

Abstract: An electrode catalyst layer for fuel cells capable of effectively preventing reduction of cell voltage in a high current density region. The electrode catalyst layer contains a catalyst-on-support composed of a support made of a conductive inorganic oxide having a catalyst supported thereon and a hydrophilic material. The hydrophilic material is an agglomerate including hydrophilic conductive particles. The content of the hydrophilic material in the catalyst layer is 2 mass % or higher and lower than 20 mass % relative to the sum of the support and the hydrophilic material. The ratio of the particle size d1 of the hydrophilic particles to the particle size D of the catalyst-on-support is 0.5 to 3.0. The ratio of the particle size d2 of the hydrophilic material to the thickness T of the catalyst layer is 0.1 to 1.2.

Abstract: A glass carrier-attached copper foil is provided that is suitable for production of a desired circuit mounting board ensuring electric conduction over the entire copper layer, reducing separation of the copper layer at the cut edge even if the copper foil is downsized, and having an intended circuit pattern with a fine pitch. The glass carrier-attached copper foil includes a glass carrier, a release layer provided on the glass carrier, and a copper layer provided on the release layer. The release layer has a function to enable release of the copper layer from the glass carrier. The glass carrier-attached copper foil has a plurality of releasable regions including the release layer and an unreleasable region not including the release layer. The unreleasable region has a pattern defining the releasable regions.

Abstract: Provided is a carrier-attached metal foil which has excellent carrier-releasability and excellent selective metal layer-etchability, and can achieve a reduction in transmission loss and resistance in a semiconductor package (for example, a millimeter-wave antenna substrate) manufactured using the same. The carrier-attached metal foil includes: (a) a carrier; (b) a release functional layer on the carrier and including (b1) an adhesion layer disposed closer to the carrier and having a thickness of more than 10 nm and less than 200 nm and (b2) a release assistance layer disposed farther from the carrier and having a thickness of 50 nm or more and 500 nm or less; and (c) a composite metal layer on the release functional layer and including (c1) a carbon layer disposed closer to the release assistance layer, and (c2) a first metal layer disposed farther from the release assistance layer and mainly composed of Au or Pt.

Abstract: A composition for exhaust gas purification containing Y—Mn—O and Al2O3 and having a specific surface area (SSA) retention satisfying inequality (1) SSA retention (%) >?61.54×(Y—Mn—O ratio)+75.55 and inequality (2) SSA retention (%) >45 (2), where SSA retention is represented by (SSA after aging)/(initial SSA)×100 (%). The SSA after aging and the initial SSA are as defined in the description. The Y—Mn—O ratio is a mass ratio of Y—Mn—O to the sum of Y—Mn—O and Al2O3 in the composition for exhaust gas purification, being represented by Y—Mn—O/(Y—Mn—O+Al2O3).

Abstract: Provided is a sulfide-based solid electrolyte comprising lithium, phosphorus, sulfur, and a halogen, as a novel solid electrolyte capable of suppressing generation of hydrogen sulfide and securing ionic conductivity. The solid electrolyte is characterized by comprising Li7?aPS6?aHaa (wherein Ha represents a halogen, and “a” satisfies 0.2<a?1.8) having an argyrodite-type crystal structure, and Li3PS4, wherein, in an X-ray diffraction (XRD) pattern obtained through measurement by an X-ray diffraction method, the ratio of the peak intensity of a peak appearing at a position in a range of diffraction angle 2?=26.0° to 28.8° derived from Li3PS4, relative to the peak intensity of a peak appearing at a position in a range of diffraction angle 2?=24.9° to 26.3° derived from the argyrodite-type crystal structure, is 0.04 to 0.3.

Abstract: There is provided a resin laminate including a first layer composed of a first resin composition and a second layer composed of a second resin composition. The first resin composition includes a resin component including an epoxy resin, a diamine compound, and a polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 60 to 85 parts by weight based on 100 parts of the first resin composition, and the content of the polyimide resin is 20 to 60 parts by weight based on 100 parts of the resin component. The second resin composition includes a resin component including an epoxy resin and a diamine compound but is free of polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 70 to 90 parts by weight based on 100 parts of the second resin composition.

Abstract: The present invention relates to an oxide sintered material that can be used suitably as a sputtering target for forming an oxide semiconductor film using a sputtering method, a method of producing the oxide sintered material, a sputtering target including the oxide sintered material, and a method of producing a semiconductor device 10 including an oxide semiconductor film 14 formed using the oxide sintered material.

Abstract: Provided is a carrier-attached metal foil which can suppress the number of foreign matter particles on the surface of a metal layer to enhance circuit formability, and can keep stable releasability even after heating at a high temperature of 240° C. or higher (for example, 260° C.) for a long period of time. The carrier-attached metal foil includes a carrier, a release functional layer provided on the carrier, the release functional layer including a metal oxynitride, and a metal layer provided on the release functional layer.