Patents Assigned to Mitsui
  • Publication number: 20040256743
    Abstract: A method for producing an organic compound having Q, the method including a step of reacting a compound represented by general formula (2) with an organic starting material having at least one halogen atom bonded to a carbon atom having four &sgr; bonds so as to replace the halogen atom in the organic starting material with Q:
    Type: Application
    Filed: June 10, 2004
    Publication date: December 23, 2004
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Setsuko Funaki, Yoshiteru Taniguchi, Tadahito Nobori, Yoshihiro Yamamoto, Isao Hara, Takaomi Hayashi, Kazumi Mizutani, Shinji Kiyono
  • Patent number: 6833402
    Abstract: The flame-retardant polyamide composition of the present invention comprises (A) 20 to 80% by weight of an aromatic polyamide, composed of recurring units of dicarboxylic acid component unit and diamine component unit, the former composed of 30 to 100% by mol of a terephthalic acid component unit and 0 to 70% by mol of an aromatic dicarboxylic acid component unit other than terephthalic acid and/or 0 to 70% by mol of a C4-C20 aliphatic dicarboxylic acid component unit and the latter composed of an aliphatic diamine component unit and/or an alicyclic diamine component unit; and having an MFR of 40 to 300 g/10 minutes, determined at a load of 2,160 g and temperature of 10° C. plus melting point, and melting point exceeding 290° C.; (B) 5 to 50% by weight of an inorganic reinforcing agent, (C) 5 to 40% by weight of a bromine-based flame retardant, containing at least one type of polybrominated styrene obtained by polymerization of brominated styrene, and (D) 0.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: December 21, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventor: Kunihiro Ouchi
  • Patent number: 6833045
    Abstract: Disclosed is a resin dispersion comprising solid particles of a graft modified ethylene/1-olefin random copolymer dispersed in an organic solvent, which has (a) a specific content of an &agr;-olefin component, (b) a specific intrinsic viscosity (&eegr;) and (h) a specific content of a polar monomer component. The resin dispersion of the invention exhibits excellent adhesion properties as an adhesive between polyolefins or metal and polyolefin or as a heat-sealing material, so that the dispersion is effectively used particularly as an adhesive for packaging, an adhesive for lamination, a coating material or a primer.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: December 21, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Suguru Tokita, Tadao Saito
  • Patent number: 6833044
    Abstract: The solvent-free two-component adhesive composition of the present invention is prepared by a polyol component (A) and a polyisocyanate component (B), wherein the composition comprises at least one polyol component having crystallinity and selected from the group consisting of a polyester polyol, a polyether polyol, a polycarbonate polyol and a polyurethane polyol in an amount of 3 to 50% by weight relative to the total weight of the components (A) and (B). The adhesive composition has the initial viscosity of about 100 to 1,500 mPa·s (in particular, 100 to 1,000 mPa·s) at 70° C. immediately after the components (A) and (B) are mixed together, and the increasing ratio of viscosity after the composition is stood at 70° C. for 10 minutes to the initial viscosity of 120% or less. According to the present invention, a composite laminated film having the good external appearance can be produced simply and effectively.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: December 21, 2004
    Assignee: Mitsui Takeda Chemicals, Inc.
    Inventors: Akihiro Imai, Kazuaki Imamura, Taiji Morimoto
  • Patent number: 6833420
    Abstract: A film having a large tensile stress in the machine direction, excellent mechanical properties and stretch-wrapping property, and that is less broken at the time of wrapping, can be favorably torn off in the transverse direction, can be intimately adhered on the container walls to be wrapped, and excellently restores its shape after it is depressed and deformed as a result of wrapping. The film for stretch-wrapping is formed of a resin composition containing, as a chief component, an ethylene/(meth)acrylic acid/(meth)acrylic acid ester terpolymer that contains not more than 7% by weight of a (meth)acrylic acid ester unit, and, optionally, containing an anti-fogging agent or a tackifier.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: December 21, 2004
    Assignee: Du Pont Mitsui Polychemicals Co., Ltd.
    Inventors: Kenichi Yoshikawa, Akira Kamikuzu
  • Publication number: 20040254368
    Abstract: An aldose having n-1 carbon atoms is produced from an aldonic acid having n carbon atoms using hypochlorous acid or a hypochlorite in a high yield at low cost with safety, by treating the reaction mixture with a compound having reactivity with the hypochlorous acid or hypochlorite higher than that with the produced aldose.
    Type: Application
    Filed: June 10, 2004
    Publication date: December 16, 2004
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Kazuhiko Togashi, Hideki Umetani, Tomoyuki Ando, Hiroki Ishibashi, Yasushi Fukuiri, Atsushi Sakuma
  • Patent number: 6831083
    Abstract: Using a compound selected from compounds represented by the following formula (1) (which include 3-phenyl-2-pyrazoline derivatives and 3-phenyl-tetrahydropyridazine derivatives) and pharmacologically acceptable salts thereof, an agent is provided which can activate glutamic acid transporter and which is useful for prevention and/treatment of cerebral ischemia (cerebral infarct and brain edema), amyotrophic lateral sclerosis (ALS), etc., all caused by glutamic acid toxicity.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: December 14, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Junya Fujiwara, Kazuya Sakai, Kenji Kibayashi, Fumiki Shimada, Yoshio Shiga, Shiro Takagi
  • Patent number: 6831129
    Abstract: An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition: a. a high polymer having cross-linkable  5 to 30 parts by weight functional groups in the molecule, and a cross-linking agent therefor b. an epoxy resin that is liquid at  5 to 30 parts by weight room temperature c.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: December 14, 2004
    Assignee: Mitsui Mining & Smelting Co. Ltd.
    Inventors: Tetsuro Sato, Tsutomu Asai, Toshifumi Matsushima
  • Patent number: 6831036
    Abstract: A co-catalyst for purifying an exhaust gas which can be used for a loner period of time as an actual catalyst by using the cerium oxide in the conventional co-catalyst for purifying the exhaust gas as a cerium-containing complex oxide for elevating the resistance to heat and suppressing the performance reduction due to thermal deterioration and by making a specific surface area and an oxygen storage capacity over specified values. A co-catalyst for purifying an exhaust gas of the present invention includes a composite oxide including (a) cerium; and (b) at least one element selected from the group consisting of zirconium, yttrium, strontium, barium and a rare-earth element supported on a particulate aluminum oxide support; a specific surface area of the co-catalyst after sintering being not less than 40 m2/g; an oxygen storage capacity at 400° C. being not less than 10 &mgr;mols/g and an oxygen storage capacity at 700° C. being not less than 100 &mgr;mols/g.
    Type: Grant
    Filed: May 10, 2001
    Date of Patent: December 14, 2004
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Masatoshi Yamazaki, Yuichi Anno, Kiyoshi Shinoda, Isamu Yashima
  • Publication number: 20040245104
    Abstract: In order to discharge current from a gas diffusion electrode in an electrolytic unit cell including a gas chamber, the gas diffusion electrode is electrically connected to the wall surface of the gas chamber having conductivity through an electric connecting element in partial contact with the gas diffusion electrode
    Type: Application
    Filed: March 30, 2004
    Publication date: December 9, 2004
    Applicants: CHLORINE ENGINEERS CORP., LTD., MITSUI CHEMICALS, INC., TOAGOSEI CO., LTD., KANEKA CORPORATION, TOSOH CORPORATION, ASAHI GLASS COMPANY, LIMITED, ASAHI KASEI CHEMICALS CORPORATION, DAISO CO., LTD., TOKUYAMA CORPORATION
    Inventors: Hiroaki Aikawa, Tsugiyoshi Osakabe, Mitsuharu Hamamori, Shinji Katayama, Kiyohito Asaumi
  • Publication number: 20040247908
    Abstract: The present invention relates to a composition for forming a film for protecting wiring, wherein the content of sulfur atoms in solid contents of the composition is 150 ppm or less. The present invention also relates to a dry film for forming a wiring-protecting film, using the composition, and a substrate having wiring protected by means of the dry film.
    Type: Application
    Filed: June 1, 2004
    Publication date: December 9, 2004
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Katsuhiko Funaki, Shuji Tahara, Kazuhito Fujita, Takeshi Tsuda, Etsuo Ohkawado
  • Publication number: 20040245495
    Abstract: A method of dusting-preventive treatment in which a powder having dusting property is treated with fibril-forming PTFE (polytetrafluoroethylene) to impart non-dusting property thereto and the non-dusting property of the powder, after having been reduced during transportation, are economically and advantageously recovered or improved through a relatively simple step. The method comprises: a first dusting-preventive treatment step in which fibril-forming polytetrafluoroethylene is added to a powder having dusting property, and a compression/shear force is exerted to the mixture at a temperature in the range of 20 to 200° C. to thereby regulate powder so as to have a flow value of 150 mm to 200 mm; and a second dusting-preventive treatment step in which a compression/shear force is exerted again at a temperature in the range of 50 to 150° C.
    Type: Application
    Filed: November 10, 2003
    Publication date: December 9, 2004
    Applicants: ASO CEMENT CO., LTD., MURAKASHI LIME INDUSTRY CO., LTD., NIPPON HODO CO., LTD., DU PONT-MITSUI FLUORO CHEMICALS CO., LTD.
    Inventors: Hirofumi Tsutsumi, Teruo Urano, Masatsune Ogura, Tetsuya Shimoda
  • Publication number: 20040245109
    Abstract: A film carrier tape for mounting electronic devices thereon has a tin-bismuth alloy deposit in which the bismuth content in the deposit is substantially uniform along a thickness direction thereof. The film carrier tape can be produced by plating at least a part of a wiring pattern with a tin-bismuth alloy and washing the tin-bismuth alloy deposit formed by plating with a water-ejecting washing nozzle within 6 seconds after the plating is completed. A plating apparatus for use in the above production includes a washing nozzle for washing the film carrier tape within 6 seconds after the film carrier tape has exited a plating tank.
    Type: Application
    Filed: December 12, 2003
    Publication date: December 9, 2004
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventor: Akira Fujimoto
  • Publication number: 20040248015
    Abstract: Provided are a carrier for electrophotography developers prepared with generating a slight amount of byproducts such as water, alcohol, etc, which carrier is free from release of a magnetic powder, has excellent mechanical strength and durability, and good environmental stability, and further can restrain occurrence of toner spent condition and has favorable fluidity and excellent capability of imparting charging to a toner, a two-component developer comprising the carrier and a method for forming an image using the developer.
    Type: Application
    Filed: June 4, 2004
    Publication date: December 9, 2004
    Applicants: MITSUI MINING & SMELTING CO., LTD., POWDERTECH CO., LTD.
    Inventors: Yoichi Kamikoriyama, Kenji Suzuoka, Takashi Nakashima, Kazuya Kinoshita, Yuji Sato, Hiromichi Kobayashi, Takeshi Gondo, Takashi Hikichi
  • Publication number: 20040245111
    Abstract: A plating machine for plating a film carrier tape for mounting electronic parts includes a plating tank for plating wiring patterns of a film carrier tape and also has a bubble adhesion prevention means that is position adjustable with respect to the surface of a plating solution contained in the plating tank. The process for producing film carrier tapes for mounting electronic parts comprises partially immersing a film carrier tape in a plating solution contained in a plating tank and selectively plating wiring patterns formed in the immersed area while adsorbing bubbles generated in the plating solution to a bubble adhesion prevention means arranged at the surface of the plating solution.
    Type: Application
    Filed: June 4, 2004
    Publication date: December 9, 2004
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventor: Akira Fujimoto
  • Patent number: 6828461
    Abstract: A process for producing 1,5-diaminonaphthalene without formation of 1,8-diaminonaphthalene and not through an unstable nitro imine and nitro enamine as intermediates, the process including the steps of dehydrogenating 5-substituted-1-tetralone to produce a naphtol compound and then aminating the hydroxyl group of the naphtol compound.
    Type: Grant
    Filed: January 12, 2004
    Date of Patent: December 7, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yukihiro Kumamoto, Masazumi Takaoka, Hideki Mizuta, Yoriaki Matsuzaki
  • Patent number: 6827867
    Abstract: A printed wiring board manufacturing method is provided which is so consitituted that when a carbon dioxide leaser is used to form holes such as via holes in a copper clad laminate, copper foils and resin layers may be processed at the same time, without having to perform an etching treatment on the cooper foil. Namely, a carbon dioxide laser is used to form recess portions such as via holes in a copper clad laminate, followed by plating to form interlayer electrical connections, forming etching resist layers, and exposing and developing the etching resist layers, thereby effecting a circuit etching treatment. In particular, the copper clad laminate is a laminate formed by using waved copper foils to form external copper foils.
    Type: Grant
    Filed: May 15, 2001
    Date of Patent: December 7, 2004
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Takuya Yamamoto, Takashi Kataoka, Yutaka Hirasawa
  • Patent number: 6824578
    Abstract: A polishing material is provided in which the dispersibility of the abrasive grains of the polishing material having, as a major component, rare earth oxides including cerium oxide is made better and the hardness of abrasive grain precipitates is reduced, and at the same time high efficiency of polishing can be achieved stably. According to the present invention, in a polishing material having, as the major component, rare earth oxides including cerium oxide, any one of crystalline cellulose, calcium secondary phosphate, a condensate of sodium &bgr;-naphthalenesulphonate and formalin, and synthetic silica is contained as an anti-solidification agent capable of softening abrasive grain precipitates of the polishing material when the abrasive grains of the polishing material are dispersed into a dispersion medium, and sodium hexametaphosphate or pyrophosphate is contained as a dispersant capable of dispersing the abrasive grains of the polishing material into the dispersion medium.
    Type: Grant
    Filed: March 6, 2003
    Date of Patent: November 30, 2004
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Yoshitsugu Uchino, Hidehiko Yamasaki, Shigeru Kuwabara
  • Publication number: 20040231981
    Abstract: The present invention provides an ITO sputtering target for forming a high-resistance transparent conductive film which target can be used virtually in a DC magnetron sputtering apparatus and can form a high-resistance, transparent film, and a method for producing a high-resistance transparent conductive film. The sputtering target for forming a high-resistance transparent conductive film having a resistivity of about (0.8-10)×10−3 &OHgr;cm contains indium oxide, an insulating oxide, and optionally tin oxide.
    Type: Application
    Filed: May 23, 2003
    Publication date: November 25, 2004
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Seiichiro Takahashi, Makoto Ikeda, Hiroshi Watanabe
  • Patent number: 6822090
    Abstract: An efficient method for producing cytidine derivatives that took away the previous drawbacks by efficiently synthesizing cytidine derivatives by utilizing a tertiary amine can be provided.
    Type: Grant
    Filed: March 6, 2002
    Date of Patent: November 23, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Kunihiko Morizane, Hiroharu Tanikawa, Toshiyuki Kouno, Hironori Komatsu, Nobuyuki Fukazawa