Abstract: Provided is a primer pair of primers for methicillin-resistant gene detection for the purpose of achieving highly sensitive methicillin-resistant gene detection. Said primer pair comprises a combination of SEQ ID NO: 3 and SEQ ID NO: 7, a combination of SEQ ID NO: 2 and SEQ ID NO: 9, a combination of SEQ ID NO: 1 and SEQ ID NO: 8, a combination of SEQ ID NO: 1 and SEQ ID NO: 9, a combination of SEQ ID NO: 4 and SEQ ID NO: 11, a combination of SEQ ID NO: 5 and SEQ ID NO: 12, a combination of SEQ ID NO: 6 and SEQ ID NO: 10, or a combination of SEQ ID NO: 6 and SEQ ID NO: 12.
Abstract: The invention provides a sensor capable of detecting deformation. The deformation sensor has a structure in which an ion-conductive polymer layer is sandwiched between soft electrodes, wherein non-uniform ion distribution is generated in the ion-conductive polymer layer by deformation, thereby generating a potential difference between the electrodes.
Type:
Grant
Filed:
December 22, 2016
Date of Patent:
September 29, 2020
Assignees:
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, MITSUI CHEMICALS TOHCELLO, INC.
Abstract: Provided is a material for a shape memory molded article and a shape memory molded article that exhibits superior shape memory capabilities, the material being a heat-fusible perfluoro resin having a glass transition temperature in the range of 10 to 60° C., and wherein the shape memory molded article exhibits shape memory capabilities in the temperature range of 30 to 100° C.
Abstract: A method of punching a core piece having a bridge formed between a radially-outer end of a magnet insertion hole and an outer region of the core piece. The method includes providing a magnetic steel sheet and a punch configured to form the core piece, punching out the magnet insertion hole from the magnetic steel sheet, and forming a through hole that defines a radially-outer contour of the bridge by punching the magnetic steel sheet. The method includes forming the bridge between the radially-outer end of magnet insertion hole and the outer region of the core piece, and blanking the core piece, from the magnetic steel sheet, in an exterior shape with the punch while avoiding an edge of the punch from coinciding with the radially-outer contour of the bridge.
Type:
Grant
Filed:
February 13, 2018
Date of Patent:
September 22, 2020
Assignees:
MITSUI HIGH-TEC, INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
Abstract: A catalyst powder according to the present invention is a catalyst powder that includes: a core portion that contains ceria and zirconia; and a surface layer portion that is located on the core portion and contains ceria and zirconia. The ratio (M2/M1) is 0.30 or more and 0.95 or less, the ratio (M2/M1) being the ratio of a mole fraction M2 (mol %) of cerium in the surface layer portion measured using X-ray photoelectron spectroscopy to a mole fraction M1 (mol %) of cerium in the entire powder. It is preferable that the ratio (M4/2/M3/1) between M3/1 and M4/2 is 1.1 or more and 5.0 or less, wherein M3/1 (=M3/M1) represents the ratio between a mole fraction M3 (mol %) of zirconium in the entire powder and a mole fraction M1 (mol %) of cerium in the entirety of the powder, and M4/2 (=M4/M2) represents the ratio between a mole fraction M4 (mol %) of zirconium measured using X-ray photoelectron spectroscopy and a mole fraction M2 (mol %) of cerium measured using X-ray photoelectron spectroscopy.
Abstract: An object of the present invention is to provide a curable composition having sufficient polymerization properties even under acidic conditions. The curable composition of the present invention includes (a) a polymerizable monomer having an acidic group, (b) a transition metal compound, (c) at least one compound selected from benzoxazole compounds and benzothiazole compounds, and (d) a reducing agent.
Abstract: Provided is a substrate/oriented apatite-type composite oxide film complex which is suitable as a solid electrolyte for a battery, a sensor, a separation membrane, or the like, and can be produced inexpensively. Proposed is a substrate/oriented apatite-type composite oxide film complex provided with an oriented apatite-type composite oxide film on a substrate, wherein a film thickness of the oriented apatite-type composite oxide film is 10.0 ?m or less, a degree of orientation (Lotgering method) thereof is 0.6 or more, and a material of the substrate at a side on which at least the oriented apatite-type composite oxide film is formed is a metal, an alloy, a ceramic, or a composite material thereof.
Abstract: A process for producing cyanonorbornene of the present invention includes Step 1 of preparing a mixture solution including 0.5% by weight to 28% by weight of methyl bicyclononadiene, with respect to a total amount of 100% by weight of dicyclopentadiene, acrylonitrile, and the methyl bicyclononadiene, in a container, and Step 2 of reacting the bicyclopentadiene with the acrylonitrile in the presence of the methyl bicyclononadiene, in the mixture solution.
Abstract: A resealable packaging container, which is a resealable package including a lid material that uses a multilayer film including three layers in which a substrate layer (A), an intermediate layer (B), and a heat seal layer (C) are laminated in the sequence (A)/(B)/(C); and a bottom material that uses a single-layer or multilayer sheet having an adherend (D) that can adhere to the heat seal layer (C), wherein the substrate layer (A), the intermediate layer (B), and the heat seal layer (C) all include a polyolefin resin, and when the heat seal layer (C) and the adherend (D) are heat-sealed to form a heat seal part, and the multilayer film is subsequently peeled from the heat seal part, the intermediate layer (B) and the heat seal layer (C) are delaminated and exposed in a resealable state.
Abstract: Provided are electronic eyeglasses including a power supply unit that is less likely to be unfastened and is easily attachable and detachable. A power supply unit is detachably attached to an accommodating chamber in a distal end portion of a temple. The power supply unit includes, from a front end toward a rear end, an electrical connection terminal; a first housing unit that holds a first battery, and that has a side surface having an arc shape in a plan view; a narrow portion that is connected to the arc-shaped side surface, and that has a side surface narrower than the side surface; and a second housing unit that has a side surface connected to the narrow side surface, and that hold a second battery. The accommodating chamber has a protruding portion that is elastically deformed so as to be fitted to the narrow portion of the power supply unit.
Abstract: There is provided a copper foil with a carrier particularly suitable for a circuit forming process for removing a carrier after laser drilling and desmear treatment, in detail, a copper foil with a carrier having high heat press resistance (heat resistance) of the carrier, laser drilling performance, corrosion resistance of the carrier against the desmear treatment, corrosion resistance of a release layer against the desmear treatment, and carrier release strength. The copper foil with a carrier comprises a carrier comprising at least one resin selected from polyethylene naphthalate (PEN) resins, polyethersulfone (PES) resins, polyimide resins, and polyphenylene sulfide resins; a silicon layer provided on the carrier, the silicon layer mainly containing silicon; a carbon layer provided on the silicon layer, the carbon layer mainly containing carbon; and an extremely thin copper layer provided on the carbon layer.
Abstract: A composition for forming a film for semiconductor devices including: a compound (A) including a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and having a weight average molecular weight of from 10,000 to 400,000; a crosslinking agent (B) which includes the three or more —C(?O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(?O)OX groups are —C(?O)OH groups, and which has a weight average molecular weight of from 200 to 600; and water (D), in which the compound (A) is an aliphatic amine.
Type:
Grant
Filed:
November 16, 2016
Date of Patent:
September 1, 2020
Assignee:
MITSUI CHEMICALS, INC.
Inventors:
Yasuhisa Kayaba, Hirofumi Tanaka, Hiroko Wachi, Shoko Ono
Abstract: There is provided a copper foil having a surface coating layer that can achieve a high bonding strength to a resin layer even if the copper foil has an extremely smooth surface such as one formed by vapor deposition, for example, sputtering and also has a desirable insulation resistance suitable for achieving a fine pitch in a printed wiring board. A surface-treated copper foil according to the present invention includes a copper foil and a silicon-based surface coating layer provided on at least one surface of the copper foil, the silicon-based surface coating layer being mainly composed of silicon (Si). The silicon-based surface coating layer has a carbon content of 1.0 to 35.0 atomic % and an oxygen content of 12.0 to 40.0 atomic % relative to a total content in 100 atomic % of carbon (C), oxygen (O) and silicon (Si) elements as measured by X-ray photoelectron spectroscopy (XPS).
Abstract: Provided is a novel positive electrode active material capable of suppressing resistance and improving rate characteristics and cycle characteristics while enhancing lithium ionic conductivity, wherein the surface of particles composed of a spinel-type composite oxide containing Li, Mn, O, and two or more other elements is coated with a lithium ion conductive oxide such as LiNbO3. Proposed is a positive electrode active material for an all-solid-type lithium secondary battery, wherein the surface of present core particles composed of a spinel-type composite oxide containing Li, Mn, O, and two or more other elements is coated with an amorphous compound containing Li, A (A represents one or more elements selected from the group consisting of Ti, Zr, Ta, Nb, and Al), and O; and the molar ratio (Li/A) of Li relative to the A element in the surface, as obtained by XPS, is 1.0 to 3.5.
Abstract: Provided is a composition for forming a film for semiconductor devices, including: a compound (A) including a Si—O bond and a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom; a crosslinking agent (B) which includes three or more —C(?O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(?O)OX groups are —C(?O)OH groups, and which has a weight average molecular weight of from 200 to 600; and a polar solvent (D).
Type:
Grant
Filed:
November 16, 2016
Date of Patent:
August 25, 2020
Assignee:
MITSUI CHEMICALS, INC.
Inventors:
Yasuhisa Kayaba, Hirofumi Tanaka, Koji Inoue
Abstract: At least one caulking group (13) that includes a plurality of caulking parts (14, 15) with different directions is formed on a plurality of thin plates (10) placed in a stacked state to fix the position of the stacked thin plates (10), and then a preset punching process is performed with respect to the thin plates (10) that have been positioned with pilot holes (12). This makes it possible to perform a high-accuracy punching process when punching the plurality of thin plates (10) placed in a stacked state, since positional deviations between the thin plates (10) are avoided and pilot pins (11) are prevented from deforming the periphery of the pilot holes (12).
Abstract: A water-based inkjet ink composition comprising composite resin fine particles composed of a first resin and a second resin, and having an SP value of from 9.0 to 12.0 (cal/cm3)1/2, wherein the SP value of the second resin is higher than the SP value of the first resin, and the first resin has a higher mass than the second resin.
Type:
Grant
Filed:
January 14, 2019
Date of Patent:
August 25, 2020
Assignees:
Seiko Epson Corporation, MITSUI CHEMICALS, INC.
Abstract: A solar cell sealing material of the present invention is a solar cell sealing material that is used to seal a solar cell element and includes an ethylene.?-olefin copolymer, an organic peroxide (A) having a one-hour half-life temperature in a range of equal to or higher than 100° C. and equal to or lower than 130° C., and an organic peroxide (B) having a one-hour half-life temperature in a range of higher than 130° C. and equal to or lower than 160° C., and a ratio (X2/X1) of a content X2 of the organic peroxide (B) to a content X1 of the organic peroxide (A) in the solar cell sealing material is equal to or more than 0.05 and equal to or less than 1.10.
Abstract: A material for forming an underlayer film according to the present invention is a material for forming an underlayer film which is used to form a resist underlayer film used in a multi-layer resist process, the material including a cyclic olefin polymer which has a repeating structural unit [A] represented by Formula (1) and a repeating structural unit [B] represented by Formula (2), in which a molar ratio [A]/[B] of the structural unit [A] to the structural unit [B] in the cyclic olefin polymer is greater than or equal to 5/95 and less than or equal to 95/5.
Type:
Application
Filed:
May 30, 2018
Publication date:
August 20, 2020
Applicant:
MITSUI CHEMICALS, INC.
Inventors:
Koji INOUE, Takashi ODA, Keisuke KAWASHIMA
Abstract: A first recess (102) of a lower substrate (100) is coated with conductive ink to form a first auxiliary electrode layer (104), a lower electrode pattern (105) is formed thereon by vacuum deposition, a second recess (202) of an upper substrate (200) is coated with the conductive ink to form a second auxiliary electrode layer (204), an upper electrode pattern (205) is formed thereon by vacuum deposition, the upper and lower substrates are bonded to each other with an electric element (300) interposed between the lower substrate (100) and the upper substrate (100), and the upper and lower substrates are cut at positions on the overlap portion of the first auxiliary electrode layer (104) and the lower electrode pattern (105) and the overlap portion of the second auxiliary electrode layer (204) and the upper electrode pattern (205) so as to expose the cut surfaces of the substrates.