Abstract: A waterproof and breathable insole includes a shoe lining with two bottom side edges respectively curved inwards, an insole, which is peripherally stitched to the border area of the shoe lining and has two projections longitudinally arranged at two sides respectively attached to the bottom side of the bottom side edges of the shoe lining and defining with the bottom side edges of the shoe lining a plurality of gaps for ventilation, and a pad, which has a layer of waterproof and breathable material and is bonded to the whole area of the outside wall of the insole and a part of the shoe lining with a layer of non-waterproof and breathable glue.

Abstract: A probe card mainly includes a circuit board, a probe assembly, an elastic support assembly, a plurality of level maintaining assemblies and a turning secure assembly. The circuit board has pads and spring bores. The probe assembly has a electrical signal transform board and probes on it. The elastic support assembly has a fixed plate, a locking plate and a plurality of springs. The springs are received in the spring bores of the circuit board to urge the electrical signal transform board for absorption of a height difference of the electrical signal transform board when the electrical signal transform board is inclined.

Abstract: A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer.

Abstract: A method of making an electrical contact device includes the step of (a) preparing a substrate, (b) forming a dielectric layer on a surface of the substrate and forming a well on the dielectric layer by means of a non-etching technique, (c) forming a first sacrifice layer in the well, (d) forming a second sacrifice layer on the dielectric layer and the first sacrifice layer and defining a probe body contour and forming a probe body metal layer in the probe body contour and then repeating this step once or several times to form a probe structure, and (e) removing the sacrifice layers to obtain the desired electrical contact device having the substrate and the probe structure.

Abstract: An elastic micro probe includes an electrically conductive and stretchable spring, which has a first end, a second end opposite to the first end, and connection points disposed adjacent to the first end for connection to an external element, an electrically conductive probe body, which has a first end connected to the second end of the spring and a second end vertically upwardly protruding over the first end of the spring, and an electrically conductive tip, which has a bottom side connected to the second end of the probe body such that when the tip is pressed, the probe body is forced to move the second end of the spring, thereby causing the spring to be stretched and elastically deformed.

Abstract: A cantilever-type probe card includes a circuit board, a grounding block electrically connected to a zero potential, signal probes, and at least one grounding probe connected to the grounding block. Each signal probe has a probing tip, a connection portion affixed to the circuit board, and a front arm defined between the connection portion and the probing tip. The front arm of each of the signal probes is suspended in the grounding block and spaced from the grounding block at a predetermined pitch.

Abstract: A vertical probe device includes two guide members arranged in a stack manner and defining therebetween an accommodation chamber, a probe holder plate disposed between the guide members, and a plurality of probes inserted through the guide plates and the probe holder plate in such a manner that the probes are flexible within the accommodation chamber. One of the guide plates has at least one through hole. The probe holder plate is slightly moveable in horizontal and vertical directions but fixable to one of the guide plats under a force applied through the at least one through hole to the probe holder plate while the other of the guide plates is removed, thereby preventing damage of the probes or movement of the probes during a maintenance work.

Abstract: A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly.

Abstract: A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the grounding circuit, and a probe assembly, which is arranged at the bottom side of the circuit board and has an upper guide plate, a lower guide plate, a conducting layer provided on the lower guide plate, a plurality of signal probes respectively electrically connected to the signal circuits and adjacent to a plurality of compensation probes, and at least one grounding probe electrically connected to the grounding circuits in a manner that the signal, compensation and grounding probes are vertically inserted through the upper and lower guide plates, and the conducting layer is conducted with the compensation probe and the grounding probe while electrically insulated to the signal probe.

Abstract: A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the grounding circuit, and a probe assembly, which is arranged at the bottom side of the circuit board and has an upper guide plate, a lower guide plate, a conducting layer provided on the lower guide plate, a plurality of signal probes respectively electrically connected to the signal circuits and adjacent to a plurality of compensation probes, and at least one grounding probe electrically connected to the grounding circuits in a manner that the signal, compensation and grounding probes are vertically inserted through the upper and lower guide plates, and the conducting layer is conducted with the compensation probe and the grounding probe while electrically insulated to the signal probe.

Abstract: A vertical probe device includes two guide members arranged in a stack manner and defining therebetween an accommodation chamber, a probe holder plate disposed between the guide members, and a plurality of probes inserted through the guide plates and the probe holder plate in such a manner that the probes are flexible within the accommodation chamber. One of the guide plates has at least one through hole. The probe holder plate is slightly moveable in horizontal and vertical directions but fixable to one of the guide plats under a force applied through the at least one through hole to the probe holder plate while the other of the guide plates is removed, thereby preventing damage of the probes or movement of the probes during a maintenance work.

Abstract: A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. High-frequency test signal provided by a test machine to the signal circuits can be transmitted to the signal probes through the first lead wires. Since the grounding circuits and second lead wires are provided adjacent to the signal circuits and first lead wires respectively, the high-frequency signal can be efficiently transmitted and the characteristic impedance matching can be maintained during high-frequency signal transmission. The bi-wire structure of the transmission lines has a diameter equal to or less than 1 millimeter, thereby allowing installation of a big number of the transmission lines such that the high-frequency test for a big number of electronic elements can be realized.

Abstract: A micro contact element made by photolithography technology includes a suspension arm having a first long side and a second long side opposite to the first long side, a point connected to an end of the first long side of the suspension arm and extending perpendicularly from the suspension arm, and an insertion portion perpendicularly extending from the second long side of the suspension arm. The insertion portion is to be inserted a hole of a base member having circuitry thereon. The insertion portion may be formed by layers of deposited material or may be a springy member. The suspension member may include an intermediate deformable portion to adjust stiffness.

Abstract: A probe card mainly includes a circuit board, a probe assembly, an elastic support assembly, a plurality of level maintaining assemblies and a turning secure assembly. The circuit board has pads and spring bores. The probe assembly has a electrical signal transform board and probes on it. The elastic support assembly has a fixed plate, a locking plate and a plurality of springs. The springs are received in the spring bores of the circuit board to urge the electrical signal transform board for absorption of a height difference of the electrical signal transform board when the electrical signal transform board is inclined.

Abstract: A guide panel for a vertical probe card is disclosed to have a via area and a reinforcing area. The via area has a plurality of feed through vias. The reinforcing area is bonded to the via area. The reinforcing area has a plurality of through holes in communication with the feed through vias and a plurality of reinforcing ribs formed around the through holes and bonded to the via area.

Abstract: A method for making a guide panel for a vertical probe card in batch includes the steps of a) preparing a non-metal substrate, b) forming a shielding layer having a plurality of openings on the substrate, c) etching a part of the substrate corresponding to the openings of the shielding layer by an anisotropic etching so as to form bind holes with a predetermined depth on the substrate, d) grinding the substrate to open the blind holes by a back side thinning technology so as to form micro feed through holes on the substrate, and e) removing the shielding layer so as to obtain the desired guide panel.

Abstract: The present invention provides probes of a probe card and the method of making the same, which is easier to control the size and hardness of each probe and provides the probes with well strength, hardness and electric property. The probe has a main member with a suspended arm, at least one conductive layer on the suspended arm and a dielectric layer between the conductive layer and the suspended arm. The conductive layer(s) is/are stacked on the suspended arm of the main member by electrocasting process and grinded to control the total thickness of the suspended arm.

Abstract: A stepped printed circuit board for a probe card and for clamping by a testing machine is disclosed. The stepped printed circuit board includes a main body and a protruding body. The main body has a conductive circuit pattern arranged therein and a border area for the clamping of the testing machine. The protruding body is joined to a bottom side of the main body beyond the border area and defines with the bottom side of the main body an elevational difference. The protruding body has a conductive circuit pattern arranged therein and electrically connected to the conductive circuit pattern of the main body.

Abstract: An electrical contact device of a probe card includes a base and probes on the base. The base has a top side with a cavity thereon, and the cavity has sidewalls connected to the top side. Anchored portion are provided on the sidewalls of the cavity. Each of the probes has a first end and a second end, wherein the first end is connected to the anchored portion, and the second end is extended toward the cavity respectively.

Abstract: The probe card comprises a primary circuit board with a plurality of signal contacts, a probe assembly including a plurality of probes electrically connected to the signal contact and an adjusting assembly for adjusting the coplanarity between the probe assembly and a device under test. The adjusting assembly comprises a groove plate with a plurality of grooves, a wedge positioned in the groove, at least one adjusting pin connecting the wedge and the probe assembly and at least one screw positioned at one side of the wedge. The wedge comprises an inclined surface, and one end of the adjusting pin contacts the inclined surface of the wedge and the other end contacts the probe assembly. The circuit probe card moves the wedge laterally to further move the adjusting pin upwards and downwards, so that to the coplanarity between the probe assembly and the device under test can be adjusted.