Patents Assigned to MK CHEM & TECH
  • Electroless gold plating liquid
    Patent number: 9416453
    Abstract: The present invention relates to an electroless gold plating liquid, which may form gold plating without corrosion of a base metal by performing substitution and reduction reactions in the same bath, and satisfy both weldability of lead-free soldering and wire bonding characteristics, and has excellent stability such that a gold deposition rate may be continuously maintained.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: August 16, 2016
    Assignee: MK CHEM & TECH
    Inventors: Tae-Ho Lee, Deok-Gon Han, Tae-Hyun Sung
  • ELECTROLESS GOLD PLATING LIQUID
    Publication number: 20160040296
    Abstract: The present invention relates to an electroless gold plating liquid, which may form gold plating without corrosion of a base metal by performing substitution and reduction reactions in the same bath, and satisfy both weldability of lead-free soldering and wire bonding characteristics, and has excellent stability such that a gold deposition rate may be continuously maintained.
    Type: Application
    Filed: December 22, 2014
    Publication date: February 11, 2016
    Applicant: MK CHEM & TECH
    Inventors: Tae-Ho LEE, Deok-Gon HAN, Tae-Hyun SUNG