Abstract: An integrated high speed driver/modulator assembly includes a driver amplifier assembly having a specified input impedance, such as 50 ohms. The driver/modulator assembly also includes an optical modulator having a modulator transmission line. The impedance of the modulator transmission line is less than the specified input impedance, which results in a reduced V&pgr; for the optical modulator. The reduction in V&pgr; enables the driver/modulator assembly to more effectively support OC-768 and higher data rates of at least 40 Gb/s.
Type:
Grant
Filed:
May 15, 2001
Date of Patent:
April 22, 2003
Assignee:
ModeTek, Inc
Inventors:
Dariush Mirshekar-Syahkal, Eric Goutain