Abstract: An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.
Type:
Application
Filed:
March 16, 2009
Publication date:
January 5, 2012
Applicant:
Modex Incorporated
Inventors:
Victor Zaderej, Daniel B. McGowan, Michael C. Picini