Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.
Type:
Grant
Filed:
August 31, 2023
Date of Patent:
June 10, 2025
Assignee:
Modular Power Technology, Inc.
Inventors:
Dhammika L. Perera, John Weld, Matthew Wilkowski
Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.
Type:
Grant
Filed:
October 6, 2021
Date of Patent:
April 26, 2022
Assignee:
MODULAR POWER TECHNOLOGY, INC.
Inventors:
Dhammika L. Perera, John Weld, Matthew Wilkowski