Patents Assigned to MODULAR POWER TECHNOLOGY, INC.
  • Patent number: 12327670
    Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.
    Type: Grant
    Filed: August 31, 2023
    Date of Patent: June 10, 2025
    Assignee: Modular Power Technology, Inc.
    Inventors: Dhammika L. Perera, John Weld, Matthew Wilkowski
  • Patent number: 11317545
    Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: April 26, 2022
    Assignee: MODULAR POWER TECHNOLOGY, INC.
    Inventors: Dhammika L. Perera, John Weld, Matthew Wilkowski