Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.
Type:
Grant
Filed:
March 4, 2022
Date of Patent:
September 26, 2023
Assignee:
Modular Power Technoogy, Inc.
Inventors:
Dhammika L. Perera, John Weld, Matthew Wilkowski