Patents Assigned to MODULAR THERMAL TECHNOLOGIES, LLC
  • Patent number: 12773345
    Abstract: A thermal transfer apparatus and a method of use thereof are provided. The thermal transfer apparatus comprises a first container comprising a first wall, and a second wall connected to the first wall at ends of each wall, thereby defining a first enclosed cavity. At least four protrusions extend from the first wall into the first enclosed cavity towards the second wall and each protrusion comprising a third wall defining a second enclosed cavity. At least four protrusions comprise at least two short protrusions and at least two long protrusions. The short protrusions extend a first distance from the first wall into the first enclosed cavity towards the second wall, and are positioned intermediate two or more of the long protrusions. The long protrusions extend a second distance from the first wall into the first enclosed cavity towards the second wall. The second distance is greater than the first distance.
    Type: Grant
    Filed: October 17, 2023
    Date of Patent: October 27, 2026
    Assignee: MODULAR THERMAL TECHNOLOGIES, LLC
    Inventors: Colin M. Hall, Bradley J. Waugh
  • Patent number: D1098467
    Type: Grant
    Filed: May 8, 2024
    Date of Patent: October 14, 2025
    Assignee: MODULAR THERMAL TECHNOLOGIES, LLC
    Inventor: Colin M. Hall