Patents Assigned to Modus Test Automation, LLC
  • Patent number: 9885737
    Abstract: A testing system for semiconductor chips having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. The DUT PCB is quickly and easily removed and replaced by moving the locking posts between an engaged position and a disengaged position. In this way, a single testing system can be used to test a great variety of semiconductor chips thereby reducing capital equipment costs and space needed in cleanrooms.
    Type: Grant
    Filed: January 14, 2016
    Date of Patent: February 6, 2018
    Assignee: Modus Test Automation, LLC
    Inventors: Lynwood Adams, Jack Lewis
  • Patent number: D751433
    Type: Grant
    Filed: January 6, 2015
    Date of Patent: March 15, 2016
    Assignee: Modus Test Automation, LLC
    Inventors: Lynwood Adams, Jack Lewis
  • Patent number: D821337
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: June 26, 2018
    Assignee: MODUS TEST AUTOMATION, LLC.
    Inventors: Lynwood Dale Adams, Jack Lewis
  • Patent number: D821338
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: June 26, 2018
    Assignee: MODUS TEST AUTOMATION, LLC.
    Inventors: Lynwood Dale Adams, Jack Lewis