Patents Assigned to Modus Test, LLC
  • Patent number: 11674996
    Abstract: A testing system for test sockets is presented having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A top stiffener is attached to the lower surface of the DUT PCB and is locked in place by engagement members of a locking mechanism, that is operated by an actuating mechanism, that includes a rack and pinion arrangement that converts rotational movement of the pinions to lateral movement of the racks thereby locking the stiffener connected to the DUT PCB to the socket plate so as to facilitate testing. The upper surface of the DUT PCB has an infinite top plane that is uninterrupted and can be of any size and shape. The system is also modular and can be formed of any number of modules depending on the pin count density required.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: June 13, 2023
    Assignee: Modus Test, LLC
    Inventors: Lynwood Adams, Jack Lewis, Njteh Keleshian
  • Patent number: 11668731
    Abstract: A testing system for electrical interconnects having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. An actuator is also presented that presses the device under test into the electrical interconnect at increments where tests are performed on one, some or all of the contact points of the electrical interconnect. This information is then analyzed and graphed to assist with determine the optimum force and/or height to use during actual use.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: June 6, 2023
    Assignee: Modus Test, LLC
    Inventors: Lynwood Adams, Jack Lewis
  • Patent number: 11385277
    Abstract: A testing system for test sockets is presented having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A top stiffener is attached to the lower surface of the DUT PCB and is locked in place by engagement members of a locking mechanism, that is operated by an actuating mechanism, that includes a rack and pinion arrangement that converts rotational movement of the pinions to lateral movement of the racks thereby locking the stiffener connected to the DUT PCB to the socket plate so as to facilitate testing. The upper surface of the DUT PCB has an infinite top plane that is uninterrupted and can be of any size and shape. The system is also modular and can be formed of any number of modules depending on the pin count density required.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: July 12, 2022
    Assignee: MODUS TEST, LLC
    Inventors: Lynwood Adams, Jack Lewis, Njteh Keleshian
  • Patent number: 11313880
    Abstract: A testing system for electrical interconnects having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. An actuator is also presented that presses the device under test into the electrical interconnect at increments where tests are performed on one, some or all of the contact points of the electrical interconnect. This information is then analyzed and graphed to assist with determine the optimum force and/or height to use during actual use.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: April 26, 2022
    Assignee: MODUS TEST, LLC
    Inventors: Lynwood Adams, Jack Lewis
  • Patent number: 10788531
    Abstract: An improved package device simulator for the testing of testing sockets, the package device simulator being formed of a first layer of non-conductive rigid substrate with a second layer formed of a plurality of electrically conductive traces being added thereto. A third layer of non-conductive rigid substrate is adhered to the first layer with the second layer being sealed there between. The third layer having a plurality of openings therein, wherein the openings align with and expose a portion of the electrically conductive traces of the second layer. Conductive binding material and contact balls are added to the openings and the chip is cured thereby fusing the contact balls with the exposed portions of the traces. Next, the exposed surfaces are coated with a hardening conductive material, such as layers of Nickel and/or Gold. In this way an improved package device simulator is formed that is durable, easier to manufacture and less expensive than a solid metallic package device simulator.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: September 29, 2020
    Assignee: MODUS TEST, LLC
    Inventors: Lynwood Adams, Bruce Rogers, Jack Lewis, Tim Conner, Jay Williams, Mike Young, Dawn Ritz
  • Patent number: 10705120
    Abstract: A testing system for electrical interconnects having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. An actuator is also presented that presses the device under test into the electrical interconnect at increments where tests are performed on one, some or all of the contact points of the electrical interconnect. This information is then analyzed and graphed to assist with determine the optimum force and/or height to use during actual use.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: July 7, 2020
    Assignee: MODUS TEST, LLC
    Inventors: Lynwood Adams, Jack Lewis
  • Patent number: 10534017
    Abstract: A testing system for semiconductor chips having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. The DUT PCB is quickly and easily removed and replaced by moving the locking posts between an engaged position and a disengaged position. In this way, a single testing system can be used to test a great variety of semiconductor chips thereby reducing capital equipment costs and space needed in cleanrooms.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: January 14, 2020
    Assignee: MODUS TEST, LLC
    Inventors: Lynwood Adams, Jack Lewis
  • Patent number: 10156586
    Abstract: A testing system for electrical interconnects having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. An actuator is also presented that presses the device under test into the electrical interconnect at increments where tests are performed on one, some or all of the contact points of the electrical interconnect. This information is then analyzed and graphed to assist with determine the optimum force and/or height to use during actual use.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: December 18, 2018
    Assignee: Modus Test, LLC
    Inventors: Lynwood Adams, Jack Lewis
  • Patent number: D893433
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: August 18, 2020
    Assignee: MODUS TEST, LLC
    Inventors: Lynwood Adams, Jack Lewis
  • Patent number: D927429
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: August 10, 2021
    Assignee: MODUS TEST, LLC
    Inventors: Lynwood Adams, Jack Lewis
  • Patent number: D933016
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: October 12, 2021
    Assignee: MODUS TEST, LLC
    Inventors: Lynwood Adams, Jack Lewis