Abstract: A plastic package that includes a cavity for holding an integrated circuit die. The package also includes several singel-piece leads that each have bonding pad area on one end and an area for connecting to external circuitry on the other end. The package's plastic body supports the leads, separates them from each other, and includes a ridge that substantially encircles the cavity and separates the bonding pad areas from the cavity. The package may be made by forming a first portion including alignment protrusions sized to receive lead bonding pad ends, placing the leads with their bonding pads so that they are spaced apart by the protrusions, and securing them, preferably by supplying heat to the protrusions. A second portion of the package may then be molded around the first portion, the leads, and, preferably, a heat sink.