Patents Assigned to Mold Research Co., Ltd.
  • Patent number: 6051184
    Abstract: A metal powder injection moldable composition which hardly causes debinding deformation is obtained. This composition consists of a metal powder and an organic binder. The components which constitute the organic binder are:a. polyoxymethylene having a Vicat softening temperature A.gtoreq.150.degree. C.,b. polypropylene having a Vicat softening temperature B.gtoreq.130.degree. C.,c. an organic compound whose viscosity at said Vicat softening temperature A (.degree. C.) is not more than 200 mPa.multidot.s, andd. a thermoplastic resin whose Vicat softening temperature is not higher than said B (.degree. C.).
    Type: Grant
    Filed: October 15, 1998
    Date of Patent: April 18, 2000
    Assignee: Mold Research Co., Ltd.
    Inventor: Yoshimitsu Kankawa