Abstract: The present invention relates to an optical transparent resin comprising: 1) a polyorganosiloxane resin represented by chemical formula 1 above; and 2) at least one light initiator, the optical transparent resin having a refractive index of 1.41-1.55, and to an electronic element formed by using the optical transparent resin.

Abstract: A composition for an encapsulant according to an exemplary embodiment of the present invention comprises: 1) a first copolymer comprising the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a second copolymer comprising the second unit represented by Chemical Formula 2 and the third unit represented by Chemical Formula 3; 3) one or more photoinitiators; and 4) a compound capable of dissolving the photoinitiators.

Abstract: The present invention relates to a composition for an organic electronic device encapsulant and an encapsulant formed by using the same. A composition for an encapsulant according to the present invention comprises: 1) a first copolymer comprising the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a silicone urethane methacrylate-based polymer comprising the second unit represented by Chemical Formula 2 as a main unit; and 3) one or more photoinitiators.

Abstract: The present invention relates to a composition for an organic electronic device encapsulant and an encapsulant formed by using the same. A composition for an encapsulant according to an exemplary embodiment of the present invention includes: 1) a first copolymer including the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a second copolymer including the second unit represented by Chemical Formula 2 and the third unit represented by Chemical Formula 3; and 3) one or more photoinitiators.

Abstract: A composition for an encapsulant according to one embodiment of the present application comprises 1) a silicone resin, 2) one or more types of moisture absorbent, 3) one or more types of photoinitiator, 4) one or more types of fillers, and 5) a reactive silicone oligomer.

Abstract: A composition for an encapsulant according to an embodiment of the present application comprises: 1) a silicone resin; 2) one or more moisture absorbents; 3) one or more photoinitiators; and 4) a monomer capable of dissolving the photoinitiators.

Abstract: A composition for an encapsulant according to an exemplary embodiment of the present invention comprises: 1) a first copolymer comprising the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a second copolymer comprising the second unit represented by Chemical Formula 2 and the third unit represented by Chemical Formula 3; 3) one or more photoinitiators; and 4) a compound capable of dissolving the photoinitiators.

Abstract: The present invention relates to a composition for an organic electronic device encapsulant and an encapsulant formed by using the same. A composition for an encapsulant according to an exemplary embodiment of the present invention comprises: 1) a first copolymer comprising the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a second copolymer comprising the second unit represented by Chemical Formula 2 and the third unit represented by Chemical Formula 3; 3) one or more photoinitiators; 4) a reactive silicone-based oligomer; and 5) a silicone acrylate-based compound.