Patents Assigned to Momentum Technical Consulting Inc.
  • Method of and apparatus for chemical-mechanical polishing
    Patent number: 6572441
    Abstract: During a CMP operation, vibration-caused variations in the forces holding a wafer against a polishing pad, and/or relatively moving the pad and the wafer are measured and the standard deviation thereof is used to minimize or eliminate the deleterious effects of the vibrations.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: June 3, 2003
    Assignee: Momentum Technical Consulting, Inc.
    Inventors: Ralf Lukner, Owen Hehmeyer
  • Chemical/mechanical polishing endpoint detection device and method
    Patent number: 6547637
    Abstract: A device (28) and method for detecting endpoints (Ep1, Ep2) of a chemical-mechanical polishing (CMP) process for semiconductor wafers (14). A carrier current signal driving a polishing carrier motor is received and detected, the carrier current signal is modified, and the modified carrier current is analyzed to detect at least one endpoint of the polishing process. The device (28) includes a detector (40), a logic circuit (42) and storage (44).
    Type: Grant
    Filed: October 5, 2000
    Date of Patent: April 15, 2003
    Assignee: Momentum Technical Consulting Inc.
    Inventor: Fu Zhang
  • Method of and apparatus for chemical-mechanical polishing
    Publication number: 20020182978
    Abstract: During a CMP operation, vibration-caused variations in the forces holding a wafer against a polishing pad, and/or relatively moving the pad and the wafer are measured and the standard deviation thereof is used to minimize or eliminate the deleterious effects of the vibrations.
    Type: Application
    Filed: May 31, 2001
    Publication date: December 5, 2002
    Applicant: Momentum Technical Consulting, Inc.
    Inventors: Ralf Lukner, Owen Hehmeyer