Abstract: A vertical solder coating machine is described incorporating a tank containing molten solder with a bath of solder leveling fluid on the top thereof. Drive rollers are positioned within the tank and in the solder leveling fluid for grasping workpieces such as a printed circuit board and lowering the workpiece through the solder leveling fluid into the molten solder. The workpiece is forced into the molten solder until it is no longer gripped by the drive rollers and is trapped in the space formed by the rollers in contact with each other. When the rollers reverse direction, the workpiece is withdrawn through the solder leveling fluid and past a pair of leveling tubes positioned in the bath on either side of the workpiece. The leveler tubes direct a stream of solder leveling fluid onto the surface of the workpiece to level the solder thickness and remove solder from within any through-holes in the workpiece. The drive rollers are tapered and thus contact the workpiece only along opposite edges thereof.