Abstract: Bender devices are demonstrated by developing non-uniform fields within a homogeneous, non-planar single slab active member material of non-uniform thickness through geometrical constraints and electrode placement. Single slab actuators are demonstrated for semiconductor designs including MEMS applications. Single slab bender periodic designs are demonstrated to be well suited for MEMS fabrication. Shaped actuators having a topological pattern formed across at least one portion are demonstrated to induced strain at the patterned portion of the actuator, causing the patterned portion to flare into open and close positions upon application of an external field. Voltage transformers, spark generators, power sources, and sensors are developed using the non-planar, homogeneous, single slab active member material of non-uniform thickness. Last, semiconductor process design techniques are demonstrated for periodic and other non-planar single slab actuators.