Patents Assigned to Monolith IC 3D
  • Patent number: 8163581
    Abstract: Techniques to utilize layer transfer schemes such as ion-cut to form novel light emitting diodes (LEDs), CMOS image sensors, displays, microdisplays and solar cells are disclosed.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: April 24, 2012
    Assignee: Monolith IC 3D
    Inventors: Zvi Or-Bach, Deepak C. Sekar