Abstract: A method of making a Lateral-Moving Micromachined Thermal Bimorph which provides the capability of achieving in-plane thermally-induced motion on a microchip, as opposed to the much more common out-of-plane, or vertical, motion seen in many devices. The present invention employs a novel fabrication process to allow the fabrication of a lateral bimorph in a fundamentally planar set of processes. In addition, the invention incorporates special design features that allow the bimorph to maintain material interfaces.

Abstract: The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.

Abstract: The Lateral-Moving Micromachined Thermal Bimorph provides the capability of achieving in-plane thermally-induced motion on a microchip, as opposed to the much more common out-of-plane, or vertical, motion seen in many devices. The present invention employs a novel fabrication process to allow the fabrication of a lateral bimorph in a fundamentally planar set of processes. In addition, the invention incorporates special design features that allow the bimorph to maintain material interfaces.

Abstract: A fiber laser thermal coil form and related manufacturing techniques that are substantially suitable for automation. The fiber laser thermal coil form including a thermally conductive substrate to support a fiber placed thereon and to dissipate a heat of the fiber, and a fiber guide groove defined in a surface of the substrate to guide the fiber and dimensioned to partially enclose the fiber and to enhance a thermal contact of the fiber and the substrate.

Abstract: The present invention provides the capability of ascertaining, through a quick and simple measurement, locations on a structure that may have experienced damage that could result in reduced structure lifetime, strength, or reliability. The sensing element is a connectorized section of polarization maintaining (“PM”) optical fiber, where a length of PM fiber represents a fully distributed sensor array. Stress-induced changes to the sensor are measured through white-light Polarimetric interferometry. The output of the measurement is a data array representing the stress concentration magnitude at an array of locations along the length of the sensor. In an application, the knowledge of the optical fiber position on the structure, coupled with the measurement of stress locations along the fiber length, allows the user to determine locations on the structure with large stress concentrations. These locations may signify structural damage.

Abstract: A method of making a Lateral-Moving Micromachined Thermal Bimorph which provides the capability of achieving in-plane thermally-induced motion on a microchip, as opposed to the much more common out-of-plane, or vertical, motion seen in many devices. The present invention employs a novel fabrication process to allow the fabrication of a lateral bimorph in a fundamentally planar set of processes. In addition, the invention incorporates special design features that allow the bimorph to maintain material interfaces.

Abstract: A method for winding a crossover-free fiber optic coil sensor comprising: attaching a fiber optic cable to an outer edge of a coil form, wherein the coil form comprises a first side and a second side; forming a first outside-in coil layer on the first side of the coil form using a first winding head; attaching a first inside-out separator on top of the first outside-in coil layer; forming a first inside-out coil layer on top of the first inside-out separator using the first winding head; forming a second outside-in coil on the second side of the coil form using a second winding head; attaching a second inside-out separator on top of the second outside-in coil layer; and forming a second inside-out coil layer on top of the second inside-out separator using the second winding head.

Abstract: The Miniature Fourier Transform Spectrophotometer provides the capability, in a miniaturized device, of determining the light absorption/transmission spectra of a collected sample of gas or liquid though Fourier Transform spectroscopy techniques. The device takes an optical input from an optical fiber, manipulates that light through miniature optical components, and launches it into a miniaturized Michelson interferometer with a scanning mirror that acquires the interferogram of the optical input. The interferogram can be processed to retrieve the spectrum of the input light. A novel multi-stepped micro-mirror operates as the optical path length modulator in the miniaturized interferometer. A unique monolithic beamsplitter/mirror combination provides for accurate alignment of the components and greatly simplifies product integration. The device is designed to cover various optical spectra of interest.

Abstract: The Miniature Fourier Transform Spectrophotometer provides the capability, in a miniaturized device, of determining the light absorption/transmission spectra of a collected sample of gas or liquid though Fourier Transform spectroscopy techniques. The device takes an optical input from an optical fiber, manipulates that light through miniature optical components, and launches it into a miniaturized Michelson interferometer with a scanning mirror that acquires the interferogram of the optical input. The interferogram can be processed to retrieve the spectrum of the input light. A novel multi-stepped micro-mirror operates as the optical path length modulator in the miniaturized interferometer. A unique monolithic beamsplitter/mirror combination provides for accurate alignment of the components and greatly simplifies product integration. The device is designed to cover various optical spectra of interest.

Abstract: The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.

Abstract: A method for winding a crossover-free fiber optic coil sensor comprising: attaching a fiber optic cable to an outer edge of a coil form, wherein the coil form comprises a first side and a second side; forming a first outside-in coil layer on the first side of the coil form using a first winding head; attaching a first inside-out separator on top of the first outside-in coil layer; forming a first inside-out coil layer on top of the first inside-out separator using the first winding head; forming a second outside-in coil on the second side of the coil form using a second winding head; attaching a second inside-out separator on top of the second outside-in coil layer; and forming a second inside-out coil layer on top of the second inside-out separator using the second winding head.

Abstract: The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.

Abstract: The Miniature Fourier Transform Spectrophotometer provides the capability, in a miniaturized device, of determining the light absorption/transmission spectra of a collected sample of gas or liquid though Fourier Transform spectroscopy techniques. The device takes an optical input from an optical fiber, manipulates that light through miniature optical components, and launches it into a miniaturized Michelson interferometer with a scanning mirror that acquires the interferogram of the optical input. The interferogram can be processed to retrieve the spectrum of the input light. A novel multi-stepped micro-mirror operates as the optical path length modulator in the miniaturized interferometer. A unique monolithic beamsplitter/mirror combination provides for accurate alignment of the components and greatly simplifies product integration. The device is designed to cover various optical spectra of interest.

Abstract: The Resettable Latching MEMS Shock Sensor provides the capability of recording external shock extremes without consuming electrical power. The device incorporates a shock sensitive suspended proof mass, spring-loaded contacts, latches, and actuators for device reset. The device can be designed, hardwired, or programmed to trigger at various shock levels. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the device consumes no quiescent power. The device can be configured to close a circuit, switch an interrupt signal, or switch some other electrical trigger signal between devices at the time of a shock extreme being reached, or it can be configured to latch and be polled at some time after the shock limit has occurred.

Abstract: The Resettable Latching MEMS Temperature Sensor provides the capability of recording external temperature extremes without consuming electrical power. The device incorporates a thermal bimorph, contacts, latches, and actuators for device reset. The device can be designed, hardwired, or programmed to trigger at various temperature levels. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the device consumes no quiescent power. The device can be configured to close a circuit, switch an interrupt signal, or switch some other electrical trigger signal between devices at the time of a temperature extreme being reached, or it can be configured to latch and be polled at some time after the temperature limit has occurred.

Abstract: The Miniature Fourier Transform Spectrophotometer provides the capability, in a miniaturized device, of determining the light absorption/transmission spectra of a collected sample of gas or liquid though Fourier Transform spectroscopy techniques. The device takes an optical input from an optical fiber, manipulates that light through miniature optical components, and launches it into a miniaturized Michelson interferometer with a scanning mirror that acquires the interferogram of the optical input. The interferogram can be processed to retrieve the spectrum of the input light. A novel multi-stepped micro-mirror operates as the optical path length modulator in the miniaturized interferometer. A unique monolithic beamsplitter/mirror combination provides for accurate alignment of the components and greatly simplifies product integration. The device is designed to cover various optical spectra of interest.

Abstract: The Resettable Latching MEMS Shock Sensor provides the capability of recording external shock extremes without consuming electrical power. The device incorporates a shock sensitive suspended proof mass, spring-loaded contacts, latches, and actuators for device reset. The device can be designed, hardwired, or programmed to trigger at various shock levels. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the device consumes no quiescent power. The device can be configured to close a circuit, switch an interrupt signal, or switch some other electrical trigger signal between devices at the time of a shock extreme being reached, or it can be configured to latch and be polled at some time after the shock limit has occurred.

Abstract: The present invention provides the capability of ascertaining, through a quick and simple measurement, locations on a structure that may have experienced damage that could result in reduced structure lifetime, strength, or reliability. The sensing element is a connectorized section of polarization maintaining (“PM”) optical fiber, where a length of PM fiber represents a fully distributed sensor array. Stress-induced changes to the sensor are measured through white-light Polarimetric interferometry. The output of the measurement is a data array representing the stress concentration magnitude at an array of locations along the length of the sensor. In an application, the knowledge of the optical fiber position on the structure, coupled with the measurement of stress locations along the fiber length, allows the user to determine locations on the structure with large stress concentrations. These locations may signify structural damage.