Abstract: Provided is a chromium-free chemical conversion treatment technique that makes it possible to form a conversion layer excellent in corrosion resistance and appearance without using fluorine and hydrogen peroxide. The chemical conversion treatment liquid is for forming a conversion layer on zinc or zinc alloy and free of chromium, hydrogen peroxide and fluorine, includes 0.5 g/L to 38 g/L of magnesium, 0.5 g/L to 3.5 g/L of silicon, and 0.36 g/L or more of nitrate ion, contains the silicon as a water-soluble silicate, optionally further includes cobalt at a concentration of 5 g/L or less, and has an aluminum content of 0.08 g/L or less.

Abstract: Provided is a chromium-free chemical conversion treatment technique that makes it possible to form a conversion layer excellent in corrosion resistance and appearance without using fluorine and hydrogen peroxide. The chemical conversion treatment liquid is for forming a conversion layer on zinc or zinc alloy and free of chromium, hydrogen peroxide and fluorine, includes 0.5 g/L to 38 g/L of magnesium, 0.5 g/L to 3.5 g/L of silicon, and 0.36 g/L or more of nitrate ion, contains the silicon as a water-soluble silicate, optionally further includes cobalt at a concentration of 5 g/L or less, and has an aluminum content of 0.08 g/L or less.

Abstract: The present invention provides an apparatus for forming a solder wicking prevention zone operating when a connector member with a connector is processed using molten solder, to hinder the solder from spreading to a contact site of the connector in a wettable manner. The apparatus includes a main forming agent tank which stores a main forming agent used to form the solder wicking prevention zone, an ejection nozzle which ejects the main forming agent stored in the main forming agent tank, and a direction control section which controls an ejection direction of the main forming agent ejected by the ejection nozzle. The direction control section controls the ejection direction of the main forming agent ejected by the ejection nozzle, so as to apply the main forming agent to a predetermined position on the connector member to form the solder wicking prevention zone.

Abstract: The present invention provides an apparatus for forming a solder wicking prevention zone operating when a connector member with a connector is processed using molten solder, to hinder the solder from spreading to a contact site of the connector in a wettable manner. The apparatus includes a main forming agent tank which stores a main forming agent used to form the solder wicking prevention zone, an ejection nozzle which ejects the main forming agent stored in the main forming agent tank, and a direction control section which controls an ejection direction of the main forming agent ejected by the ejection nozzle. The direction control section controls the ejection direction of the main forming agent ejected by the ejection nozzle, so as to apply the main forming agent to a predetermined position on the connector member to form the solder wicking prevention zone.