Patents Assigned to MORNINGRICH TECHNOLOGY CO., LTD.
  • Heat dissipation structure and electronic device adopting the same
    Patent number: 11758691
    Abstract: A heat dissipation structure adapted to dissipate heat from a heat-generating structure includes a heat dissipation unit and a liquid metal layer. The heat dissipation unit includes a heat dissipation body and an anti-corrosion metal layer formed on the heat dissipation body. The liquid metal layer is disposed between the heat-generating structure and the anti-corrosion metal layer, and is opposite to the heat dissipation body. An electronic device that adopts the heat dissipation structure is also disclosed.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: September 12, 2023
    Assignee: MORNINGRICH TECHNOLOGY CO., LTD.
    Inventor: Chiu-Lang Lin