Patents Assigned to MORTECH CORPORATION
  • Publication number: 20200165391
    Abstract: A polyimide polymer includes a first monomeric unit from dianhydride and a second monomeric unit from diamine, and the dianhydride includes 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride (HQDPA), and coefficient of thermal expansion (CTE) is below 60 ppm/° C. The polyimide film includes a film layer, and the film layer includes the above polyimide polymer. The film layer optionally includes a pigment and an inorganic nanoparticle. Therefore, the thermal resistance and the transparency of the polyimide film are improved, and the polyimide film having high thermal resistances with different colors is available.
    Type: Application
    Filed: December 12, 2018
    Publication date: May 28, 2020
    Applicant: MORTECH CORPORATION
    Inventors: Der-Jen SUN, Chi Sheng CHEN, Chang Lin LU
  • Publication number: 20190023576
    Abstract: A method of manufacturing composite material containing artificial graphite is disclosed. An artificial graphite powder and a first solvent are mixed together to obtain a graphite dispersion solution, and a particle size of the graphite powder is less than 50 ?m. The graphite dispersion solution and a polyamic acid solution are mixed together to obtain a liquid mixture. The liquid mixture is heated to obtain a polyamic acid film containing artificial graphite powder. The imidization of the polyamic acid film is performed to obtain the composite material containing artificial graphite. A method of manufacturing a graphite sheet by using the composite material containing artificial graphite as raw material is disclosed.
    Type: Application
    Filed: July 19, 2018
    Publication date: January 24, 2019
    Applicant: MORTECH CORPORATION
    Inventors: Der-Jen SUN, Chi-Sheng CHEN, Yen-Huey HSU
  • Patent number: 9499664
    Abstract: A polyimide polymer, polyimide film and polyimide laminate plate including the same are provided. The polyimide polymer includes Formula (I), Formula (II) and Formula (III). In Formula (I), Formula (II) and Formula (III), A is an aromatic group with fluorine, B, B?, and B? are aromatic groups different from one another. B/(B+B?+B?), B?/(B+B?+B?), and B?/(B+B?+B?) are larger than 0. The polyimide film includes a film layer which includes the above polyimide polymer. The film layer optionally includes colorants or inorganic nanoparticles. Therefore, the thermal resistance and the transparency of the polyimide film are improved, and a polyimide film with high thermal resistance and different colors is available. The polyimide solution can also be applied on metal film to form polyimide laminate plate.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: November 22, 2016
    Assignee: MORTECH CORPORATION
    Inventors: Der-Jen Sun, Chi-Sheng Chen, Kuo-Wei Li, Yen-Huey Hsu
  • Patent number: 9234085
    Abstract: A polyimide film comprising a polyimide and a lithium iron phosphate and a polyimide laminate thereof are disclosed. The weight percentage of the lithium iron phosphate is between 1 wt % and 49 wt %, and the weight percentage of the lithium iron phosphate is based on the total weight of the polyimide film. The polyimide laminate comprises a substrate and a polyimide film. The polyimide film covers the substrate.
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: January 12, 2016
    Assignee: MORTECH CORPORATION
    Inventors: Der-Jen Sun, Yen-Huey Hsu, Kuo-Wei Li
  • Publication number: 20140205824
    Abstract: A polyimide film comprising a polyimide and a lithium iron phosphate and a polyimide laminate thereof are disclosed. The weight percentage of the lithium iron phosphate is between 1 wt % and 49 wt %, and the weight percentage of the lithium iron phosphate is based on the total weight of the polyimide film. The polyimide laminate comprises a substrate and a polyimide film. The polyimide film covers the substrate.
    Type: Application
    Filed: May 1, 2013
    Publication date: July 24, 2014
    Applicant: MORTECH CORPORATION
    Inventors: Der-Jen SUN, Yen-Huey HSU, Kuo-Wei LI
  • Publication number: 20100143706
    Abstract: Disclosed herein are a polyimide laminate and a method for fabricating the same. In the disclosed method, a polyimide film having a thermally-conductive filler distributed homogenously therein is prepared, the polyimide film is characterized in having a thermal conductivity greater than 0.3 W/m-° C. Then, at least one metal film is subsequently deposited on one or both sides of the polyimide film by electroplating, electroless plating, evaporation, sputtering or lamination and thereby forming the desired polyimide laminate.
    Type: Application
    Filed: December 8, 2009
    Publication date: June 10, 2010
    Applicant: MORTECH CORPORATION
    Inventors: Der-Jen Sun, Yen-Huey Hsu, Ming-Hsiang Chen, Hsiu-Yeh Hu