Abstract: Techniques for measuring and/or compensating for process variations in a semiconductor manufacturing processes. Machine learning algorithms are used on extensive sets of input data, including upstream data, to organize and pre-process the input data, and to correlate the input data to specific features of interest. The correlations can then be used to make process adjustments. The techniques may be applied to any feature or step of the semiconductor manufacturing process, such as overlay, critical dimension, and yield prediction.
Abstract: Techniques for measuring and/or compensating for process variations in a semiconductor manufacturing processes. Machine learning algorithms are used on extensive sets of input data, including upstream data, to organize and pre-process the input data, and to correlate the input data to specific features of interest. The correlations can then be used to make process adjustments. The techniques may be applied to any feature or step of the semiconductor manufacturing process, such as overlay, critical dimension, and yield prediction.
Abstract: The invention provides reagents, methods, and compositions for studying protein-protein interactions. The inventive system and methods allow the analysis of protein-protein interactions in vivo and in vitro. Advantages offered by various embodiments of the inventive system and methods compared to existing photocrosslinking approaches include, for example, (i) novel reversible crosslinking reagents that allow easy isolation, purification, and enrichment of the crosslinked products; (ii) trifiuoromethyl phenyldiazirine- or perfluorinaled phenylazide-based photocrosslinking reagents that provide high specific labeling, no side product, and higher photocrosslinking efficiency; (iii) versatile spacer groups that allow systematic contact site mapping; (iv) novel methods for isolating, purifying, and detecting crosslinked products based on the reversible-link chemistry; and (v) the ability to study the interaction sites in vitro, in situ, or in vivo.
Abstract: A software testing system and method provides full reuse of software tests and associated test data in a centralized shared repository, including enabling the full reuse of test assets including test actions, test scenarios, test data; and automation scripts. Reusable test components consisting of test steps and the type of test data needed by those test steps, are managed and maintained. These components are assembled into reusable components with no binding of test data until execution time, thereby treating the test data as a reusable asset. A reusable test is initially defined using only an indication of a type or category of data, and not bound to the actual data itself, until it is assembled into an executable immediately prior to automated or manual test execution.
Abstract: A software testing system and method provides full reuse of software tests and associated test data in a centralized shared repository, including enabling the full reuse of test assets including test actions, test scenarios, test data; and automation scripts. Reusable test components consisting of test steps and the type of test data needed by those test steps, are managed and maintained. These components are assembled into reusable components with no binding of test data until execution time, thereby treating the test data as a reusable asset. A reusable test is initially defined using only an indication of a type or category of data, and not bound to the actual data itself, until it is assembled into an executable immediately prior to automated or manual test execution.
Abstract: A low cost, lightweight, fast, dense and reliable extended integration semiconductor structure is provided by forming a thin film multilayer wiring decal on a support substrate and aligning and attaching one or more integrated chips to the decal. A support ring is attached to the decal surrounding the aligned and attached integrated substrate, and the support substrate is removed. Reach-through vias connect the decal wiring to the chips.