Patents Assigned to Mosaic, Inc.
  • Patent number: 8677320
    Abstract: A software testing system and method provides full reuse of software tests and associated test data in a centralized shared repository, including enabling the full reuse of test assets including test actions, test scenarios, test data; and automation scripts. Reusable test components consisting of test steps and the type of test data needed by those test steps, are managed and maintained. These components are assembled into reusable components with no binding of test data until execution time, thereby treating the test data as a reusable asset. A reusable test is initially defined using only an indication of a type or category of data, and not bound to the actual data itself, until it is assembled into an executable immediately prior to automated or manual test execution.
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: March 18, 2014
    Assignee: Mosaic, Inc.
    Inventors: Peter B. Wilson, Karen B. Johns
  • Publication number: 20120260129
    Abstract: A software testing system and method provides full reuse of software tests and associated test data in a centralized shared repository, including enabling the full reuse of test assets including test actions, test scenarios, test data; and automation scripts. Reusable test components consisting of test steps and the type of test data needed by those test steps, are managed and maintained. These components are assembled into reusable components with no binding of test data until execution time, thereby treating the test data as a reusable asset. A reusable test is initially defined using only an indication of a type or category of data, and not bound to the actual data itself, until it is assembled into an executable immediately prior to automated or manual test execution.
    Type: Application
    Filed: April 6, 2011
    Publication date: October 11, 2012
    Applicant: MOSAIC, INC.
    Inventors: Peter B. Wilson, Karen B. Johns
  • Patent number: 5055907
    Abstract: A low cost, lightweight, fast, dense and reliable extended integration semiconductor structure is provided by forming a thin film multilayer wiring decal on a support substrate and aligning and attaching one or more integrated chips to the decal. A support ring is attached to the decal surrounding the aligned and attached integrated substrate, and the support substrate is removed. Reach-through vias connect the decal wiring to the chips.
    Type: Grant
    Filed: January 25, 1989
    Date of Patent: October 8, 1991
    Assignee: Mosaic, Inc.
    Inventor: Scott L. Jacobs