Abstract: A barrier layer capable of preventing permeability of moisture, oxygen, other gases, solvents and volatile organic compounds is provided. The barrier layer includes a surface profile undulating in all directions. Further, the surface profile is characterized by the absence of non-undulating surface, straight lines and sharp edges. Further, the surface profile bends in reaction to at least one of thermal stress, mechanical stress, and load caused by deformation of an adjoining substrate or layer. This allows the barrier layer to stretch and shrink in all directions in a plane along the surface profile of the barrier layer and prevents cracking of the barrier layer.

Abstract: A method of manufacturing an organic lighting device, having a form factor substantially equal to or less than 900 square centimeters, without involving a cutting process is provided. The method includes providing one or more first substrates with a size substantially equal to the form factor. Thereafter, the method includes a high throughput first processing of the one or more first substrates and active layer deposition processing on the one or more first substrates. Further, one or more second substrates having a size substantially equal or less than the form factor are provided. Thereafter, a high throughput second processing is performed on the one or more second substrates. Finally, the method includes encapsulating at least one of the one or more first substrates with at least one of the one or more second substrates to form the organic lighting device having the form factor.

Abstract: A package, a system and method of manufacturing discs, the package for storing discs including: a base; a stem, the stem including: a first end including a first protruding portion of a first predetermined protruding shape; and a second end attached to the base, such that the stem is substantially perpendicular to the base; and a cover configured to be locked to the first end of the stem, the cover including a first hole of a first predetermined hole shape, having a shape configured to allow the first predetermined protruding shape to pass through the first hole; wherein the cover is configured to be placed over the stem, such that the first protruding portion enters into the first hole at an open position of the first hole, and the cover is configured to be rotated about a longitudinal axis of the stem, to lock the package at a locked position of the first hole such that the first protruding portion extends beyond at least a portion of the first hole.

Abstract: Optical recording mediums, and methods and systems for manufacturing optical recording mediums are provided. The optical recording medium includes a substrate on which a recordable layer and a reflective layer are formed. The reflective layer includes a predefined proportion of at least copper and zinc, wherein the predefined proportion is 50-75% copper and 15-45% zinc by mass. The recordable layer can either be formed over the substrate or the reflective layer, and is configured to record data. A protective layer is also formed over the reflective layer or recordable layer.

Abstract: An optical disc with uniform appearance, a method and system for manufacturing an optical disc, and a method and system for printing on an optical disc are provided. The optical disc includes a hub area formed between a first inner radius and a first outer radius, and a data area formed between a second inner radius and a second outer radius. The hub area and the data area include grooves and lands formed between a predetermined radius and the second outer radius. The predetermined radius lies at the first inner radius or between the first inner radius and the first outer radius. This enables uniform appearance across an area between the predetermined radius and the second outer radius.

Abstract: A storing medium with undifferentiated visual aspect, a method and system for manufacturing a storing medium, and a method and system for printing on a storing medium are provided. The storing medium includes a base substrate and a print substrate onto which one or more labels can be printed. The base substrate includes a first region formed between a first inner periphery and a first outer periphery, and a second region formed between a second inner periphery and a second outer periphery. One or more first tracks are formed in the first region, and one or more second tracks are formed up to a pre-defined periphery from the second outer periphery in the second region. The pre-defined periphery substantially lies at the second inner periphery or between the second inner periphery and the second outer periphery. The first tracks have a first set of undulations formed thereon, and the second tracks have a second set of undulations formed thereon.

Abstract: A photovoltaic module (and a manufacturing method and system thereof) is provided. The photovoltaic module includes a base substrate, a nano-porous layer of an inorganic material deposited over the base substrate, and a photovoltaic layer of an organic material formed over the nano-porous layer. The nano-porous layer includes a plurality of nano-pores in which the organic material is deposited. The photovoltaic layer is capable of converting solar energy into electricity. The photovoltaic module also includes at least two electrodes capable of collecting electricity generated by the photovoltaic layer.

Abstract: A printing apparatus configured to print a material profile onto a substrate is provided. The printing apparatus includes a container, a nozzle, a positive displacement mechanism, and one or more regulators. The container is adapted to hold a precursor material. The container has a first end and a second end, with the nozzle connected to the first end of the container. The nozzle has an orifice configured to deposit the precursor material over the substrate. The positive displacement mechanism is configured to push the precursor material through the orifice of the nozzle over the substrate. The regulator is configured to deposit the precursor material in accordance with pre-determined parameters governing width and cross-sectional area of the precursor material deposited over the substrate, such that the precursor material deposited over the substrate has a pre-determined width and a pre-determined cross-sectional area.

Abstract: A method of enhancing adhesion of a molding material with a substrate is provided. The method includes forming one or more perforations on a substrate, forming a coat of an affinitive material on at least one of the perforations, and filling the molding material in the perforations. The affinitive material has an affinity for the molding material. Therefore, the molding material adheres to the coat of the affinitive material.

Abstract: A miniature-sized storage device has been provided. The miniature-sized storage device includes one or more electrical components, at least one light source electrically connected to at least one of the electrical components, and an encapsulating material encapsulating the electrical components and the light source. At least one of the electrical components is capable of storing data. The encapsulating material encapsulates the light source in a manner that the light source is partially visible. The encapsulating material encapsulates the electrical components and the light source hermetically, thereby enabling water-resistance and robustness in the miniature-sized storage device. The miniature-sized storage device has the length ranging from 20 mm to 30 mm, the width ranging from 10 mm to 13 mm, and the height ranging from 1 mm to 2.5 mm.

Abstract: A casing for enclosing an electronic device is provided. The electronic device includes one or more electrical components and a light source placed on an electronic substrate. The light source is located at a periphery associated with the electronic device, such that light emitted from the light source travels in a direction parallel to a longitudinal axis of the electronic device. The casing includes a first covering component and a second covering component adapted to engage together mechanically and enclose at least one section of the electronic device that includes the light source. The second covering component includes one or more reflecting surfaces adapted to reflect light emitted from the light source towards a pre-defined view zone. The reflecting surfaces are inclined at one or more pre-defined angles with respect to the longitudinal axis of the electronic device.

Abstract: An electronic device with a light source is provided. The electronic device includes a base substrate, one or more electrical components placed on the base substrate, and a light source placed on the base substrate. The electrical components and the light source are electrically connected in a pre-defined manner. A molding material is molded over the electrical components and the light source, wherein the light source is partially visible.

Abstract: An article involving encapsulation of one or more hygroscopic materials and manufacturing method and system thereof are provided. The article includes a first substrate, a second substrate, one or more first structures formed at a first periphery associated with the first substrate, and one or more second structures formed at a second periphery associated with the second substrate. The first structures and the second structures are engaged together mechanically to form an enclosure between the first substrate and the second substrate. The enclosure is capable of preventing exposure of a hygroscopic material encapsulated between the first substrate and the second substrate to the surrounding environment.

Abstract: A package, a system and method of manufacturing discs, the package for storing discs including: a base; a stem, the stem including: a first end including a first protruding portion of a first predetermined protruding shape; and a second end attached to the base, such that the stem is substantially perpendicular to the base; and a cover configured to be locked to the first end of the stem, the cover including a first hole of a first predetermined hole shape, having a shape configured to allow the first predetermined protruding shape to pass through the first hole; wherein the cover is configured to be placed over the stem, such that the first protruding portion enters into the first hole at an open position of the first hole, and the cover is configured to be rotated about a longitudinal axis of the stem, to lock the package at a locked position of the first hole such that the first protruding portion extends beyond at least a portion of the first hole.