Abstract: A die bonding system uses an inert gas chamber having a bottom aperture through which a heater assembly can insert a part for bonding, a cover having a top aperture through which a die bond head can insert and bond a die to the part, and a plurality of apertures through a base of the inert gas chamber through which a forming gas is bled through to evacuate the chamber of oxygen before performing a die bonding operation, reducing the potential for oxidation while maintaining cycle times suitable for use in a production environment.

Abstract: A die bonding system comprising a wafer lift and level assembly configured to allow rapid planarization of a wafer comprising a wafer frame configured to retain a wafer and be slidably retained within guide clevises and a leveling pedestal configured to support a wafer from below in a localized area where a die bonding operation is to take place, allowing the quick and repeatable planarization of die(s) to the wafer without the need for distinct planarization procedures that would slow cycle times and decrease production.

Abstract: A die placement system provides a tip body and die placement head to ensure planarity of a die to substrate without the need for calibration prior to each pick and place operation. A self-aligning tip incorporated into a tip body aids in die placement/attachment. This tip provides for global correction of planarity errors that exist between a die and substrate, regardless of whether those errors stem from gantry (i.e. die-side misalignment) or machine deck tool (i.e. substrate-side misalignment) misalignment.

Abstract: A die bonding system comprising a wafer lift and level assembly configured to allow rapid planarization of a wafer comprising a wafer frame configured to retain a wafer and be slidably retained within guide clevises and a leveling pedestal configured to support a wafer from below in a localized area where a die bonding operation is to take place, allowing the quick and repeatable planarization of die(s) to the wafer without the need for distinct planarization procedures that would slow cycle times and decrease production.

Abstract: A die bonding system comprising a heated bond head with the ability to heat up and cool down quickly, change tips to handle different sized dies, and load and unload tips automatically while maintaining the precision required to handle dies smaller than 200 um2.

Abstract: Disclosed is a method and system for passively aligning optical fibers (4), a first waveguide array (62), and a second waveguide array (42) using chip-to-chip vertical evanescent optical waveguides (44) and (64), that can be used with fully automated die bonding equipment. The assembled system (2, 30, 60) can achieve high optical coupling and high process throughput for needs of high volume manufacturing of photonics, silicon photonics, and other applications that would benefit from aligning optical fibers to lasers efficiently.

Abstract: Herein described is a system for the placement of dies on a substrate that uses a rotating turret carried with the die placement system to supply die placement heads necessary for the placement of various dies on a substrate, where multiple dies are to be placed, to a force application rod, thereby allowing for the rapid and efficient placement of a variety of dies on a single substrate.

Abstract: Disclosed is a method and system for passively aligning optical fibers (4), a first waveguide array (62), and a second waveguide array (42) using chip-to-chip vertical evanescent optical waveguides (44) and (64), that can be used with fully automated die bonding equipment. The assembled system (2, 30, 60) can achieve high optical coupling and high process throughput for needs of high volume manufacturing of photonics, silicon photonics, and other applications that would benefit from aligning optical fibers to lasers efficiently.

Abstract: Disclosed is a method and system for passively aligning optical fibers (4), a first waveguide array (62), and a second waveguide array (42) using chip-to-chip vertical evanescent optical waveguides (44) and (64), that can be used with fully automated die bonding equipment. The assembled system (2, 30, 60) can achieve high optical coupling and high process throughput for needs of high volume manufacturing of photonics, silicon photonics, and other applications that would benefit from aligning optical fibers to lasers efficiently.

Abstract: Co-planarity adjustment systems and methods, gantries capable of applying high force without imposing moment loads to their bearings, systems and methods for achieving rapid heating and cooling and efficient slidable seal systems capable of sealing a chamber and injecting one or more fluids into the chamber as well as actively recovering portions of such fluid which have migrated into the seal itself are disclosed in the context of thermo-compression bonding systems, apparatuses and methods, although many alternative uses will be apparent to those of skill in the art.