Abstract: The invention relates to a polishing slurry composition, and more specifically, relates to a polishing slurry composition that has excellent thermal stability, dispersion stability, stability over time, and polishing efficiency compared to conventional polishing slurry compositions, and can minimize scratches on the surface to be polished. The polishing slurry composition of the present invention has excellent thermal stability, dispersion stability, stability over time, and polishing efficiency, so it can be widely used in fields such as abrasives for semiconductor wafer processing, biomedical, pharmaceutical, cosmetics, and catalysts.

Abstract: The invention relates to a polishing slurry composition, and more specifically, relates to a polishing slurry composition that has excellent thermal stability, dispersion stability, stability over time, and polishing efficiency compared to conventional polishing slurry compositions, and can minimize scratches on the surface to be polished. The polishing slurry composition of the present invention has excellent thermal stability, dispersion stability, stability over time, and polishing efficiency, so it can be widely used in fields such as abrasives for semiconductor wafer processing, biomedical, pharmaceutical, cosmetics, and catalysts.