Abstract: A method of forming an infrared detector includes defining an optical window in a cover substrate. Defining the optical window includes forming a multilayer interference filter or a periodic diffraction grating on an upper surface of the optical window and a periodic diffraction grating on the lower surface of the optical window. The method also includes performing anodic bonding of a spacer onto the cover substrate, transferring the cover substrate provided onto a base substrate, and hermetically bonding the spacer onto the base substrate.

Abstract: Provided is a component arrangement, including a carrier substrate; a spacer which is arranged on the carrier substrate so as to surround an installation space and has an outlet opening on a side facing away from the carrier substrate; an optical component arranged in the installation space; a contact connection which electrically conductively connects the optical component to external contacts arranged outside the installation space; a cover substrate which is arranged on the spacer and with which the outlet opening is covered in a light-permeable manner; and a light-reflecting surface which is formed on an anisotropically etched silicon component and is arranged in the installation space as an inclined surface at an angle of approx.

Abstract: Provided is a method for manufacturing a component arrangement for a package, including providing a wafer made of a semiconductor material having a polished wafer surface; forming an opening in the wafer by anisotropic etching, wherein an anisotropically etched surface is manufactured near the opening; separating a component from the anisotropically etched wafer, wherein the separated component is manufactured having the following surfaces: an optical surface formed near a surface portion of the polished wafer surface and a mounting surface formed in the region of the anisotropically etched surface; and mounting the separated component on a substrate surface of a carrier substrate using the mounting surface in such a manner that the anisotropically etched surface is bonded to the substrate surface, wherein the optical surface is arranged as an inclined exposed surface. Furthermore, a component arrangement and a package are provided having a component arrangement.