Patents Assigned to MSI Computer (Shenzhen) Co. Ltd.
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Publication number: 20240282272Abstract: A display device and control method thereof. The display device includes a housing, a display assembly, and a plurality of light-emitting components. The housing has a front surface, an outer peripheral surface and a mounting opening. The outer peripheral surface is connected to the front surface. The mounting opening is located on the front surface and surrounded by the outer peripheral surface. The display assembly is disposed in the mounting opening and exposed to outside. The plurality of light-emitting components are fixed to the housing. A light emitted from the plurality of light-emitting components is partially emitted along a normal direction of the outer peripheral surface, and is partially emitted along a normal direction of the front surface.Type: ApplicationFiled: March 30, 2023Publication date: August 22, 2024Applicants: MICRO-STAR INT’L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.Inventors: Chun-Te YEH, Chung-Wen CHEN, Chia-Liang HOU
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Publication number: 20240282273Abstract: A control method of display device including obtaining an image displayed by a display device by a computing controller; dividing the image into a plurality of sub-regions by the computing controller; computing a color weight data of each of the plurality of sub-regions by the computing controller; generating a color data for at least one of the plurality of light-emitting components corresponding to each of the plurality of sub-regions based on the color weight data of each of the plurality of sub-regions by the computing controller; transferring the color data for each of the plurality of light-emitting components to the light controller by the computing controller; and controlling each of the plurality of light-emitting components to emit corresponding color of light based on the color data by the light controller.Type: ApplicationFiled: January 23, 2024Publication date: August 22, 2024Applicants: MICRO-STAR INT’L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.Inventors: Chun-Te YEH, Chung-Wen CHEN, Chia-Liang HOU
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Publication number: 20240217379Abstract: A dual-standard AC smart charging pile includes a first charging gun, a first power supply circuit, a second charging gun, a second power supply circuit and a signal processing circuit. Each of the two charging guns comprises a charging port conforming to different specifications. Each of the two power supply circuits is electrically connected to the corresponding charging gun, and is respectively configured to provide power to the corresponding charging gun based on different specifications. The signal processing circuit is electrically connected to the first charging gun, the second charging gun, the first power supply circuit and the second power supply circuit, and is configured to control one or both of the first power supply circuit and the second power supply circuit according to one or both of a first trigger time point of the first charging gun and a second trigger time point of the second charging gun.Type: ApplicationFiled: July 18, 2023Publication date: July 4, 2024Applicants: MICRO-STAR INT’L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.Inventors: Chuan Yi LIN, Hong Hen LIN, Chi Yang LIN, Chien-Chi HSU
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Publication number: 20240217377Abstract: An AC smart charging pile includes a charging gun, a power supply circuit, a communication transmission unit and a signal processing circuit. The power supply circuit is connected to the charging gun, and configured to provide power to the charging gun. The communication transmission unit is configured to obtain charging data from a user device or a management center. The signal processing circuit is connected to the power supply circuit and the communication transmission unit, and configured to control charging power of the power supply circuit.Type: ApplicationFiled: October 17, 2023Publication date: July 4, 2024Applicants: MICRO-STAR INT’L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.Inventors: Chuan Yi LIN, Hong Hen LIN, Chi Yang LIN
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Publication number: 20240164007Abstract: The disclosure provides an electronic assembly, a method for manufacturing electronic assembly, and a composite thermally conductive sheet. The electronic assembly includes a circuit board, a heat source, an anti-overflow element, a thermally conductive block and a thermally conductive sheet. The heat source is disposed on and electrically connected to the circuit board. The anti-overflow element is disposed on a side of the heat source located farthest away from the circuit board and has an opening. The thermally conductive block is disposed on a side of the anti-overflow element located farthest away from the heat source. The thermally conductive sheet is made of a phase change material. The thermally conductive sheet is located in the opening of the anti-overflow element to be surrounded by the anti-overflow element. Opposite sides of the thermally conductive sheet are in thermal contact with the heat source and the thermally conductive block, respectively.Type: ApplicationFiled: December 19, 2022Publication date: May 16, 2024Applicants: MICRO-STAR INT'L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.Inventors: Cheng-Lung CHEN, Chia-Ming CHANG
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Patent number: 11971742Abstract: A display assembly including a stand, a mounting assembly and a display. The mounting assembly includes a fixed base, a first pivot, a pivotable base, a second pivot, a handle, a plurality of first engagement structures and a second engagement structure. The handle includes a handheld part and a mounting part. The mounting part is connected to the handheld part and pivotally connected to the pivotable base via the second pivot. The first engagement structures are disposed at one of the fixed base and the mounting part of the handle. The second engagement structure is disposed at another one of the fixed base and the mounting part of the handle. The display is fixed on the pivotable base. The first pivot is not coaxial with the second pivot so that the second engagement structure is configured to be engaged with any one of the first engagement structures.Type: GrantFiled: June 7, 2022Date of Patent: April 30, 2024Assignees: MICRO-STAR INT'L CO., LTD., MSI COMPUTER (SHENZHEN) CO., LTD.Inventors: Ping-Cheng Chou, Huang-Lei Sun, Chuan Li Kao
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Patent number: 11905973Abstract: A fan assembly including a fan frame and an impeller. The fan frame includes a frame body and a first peripheral protruding plate and has an air inlet and an air outlet. The first peripheral protruding plate protrudes from a side of the frame body and forms an air channel together with the frame body. The first peripheral protruding plate is configured to reduce a noise made by the fan assembly. The air inlet is in fluid communication with the air outlet via the air channel. The impeller is rotatably disposed on the frame body and located in the air channel. The protruding height of the first peripheral protruding plate relative to the frame body ranges from 50 to 100 percent of an overall axial thickness of the impeller.Type: GrantFiled: June 22, 2022Date of Patent: February 20, 2024Assignees: MICRO-STAR INT'L CO., LTD., MSI COMPUTER (SHENZHEN) CO., LTD.Inventors: Yi Wen Chen, Yung Ching Huang, Shang-Chih Yang
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Publication number: 20230393613Abstract: A display assembly including a stand, a mounting assembly and a display. The mounting assembly includes a fixed base, a first pivot, a pivotable base, a second pivot, a handle, a plurality of first engagement structures and a second engagement structure. The handle includes a handheld part and a mounting part. The mounting part is connected to the handheld part and pivotally connected to the pivotable base via the second pivot. The first engagement structures are disposed at one of the fixed base and the mounting part of the handle. The second engagement structure is disposed at another one of the fixed base and the mounting part of the handle. The display is fixed on the pivotable base. The first pivot is not coaxial with the second pivot so that the second engagement structure is configured to be engaged with any one of the first engagement structures.Type: ApplicationFiled: June 7, 2022Publication date: December 7, 2023Applicants: MICRO-STAR INT'L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.Inventors: Ping-Cheng CHOU, Huang-Lei SUN, Chuan Li KAO
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Publication number: 20230358254Abstract: A fan assembly including a fan frame and an impeller. The fan frame includes a frame body and a first peripheral protruding plate and has an air inlet and an air outlet. The first peripheral protruding plate protrudes from a side of the frame body and forms an air channel together with the frame body. The first peripheral protruding plate is configured to reduce a noise made by the fan assembly. The air inlet is in fluid communication with the air outlet via the air channel. The impeller is rotatably disposed on the frame body and located in the air channel. The protruding height of the first peripheral protruding plate relative to the frame body ranges from 50 to 100 percent of an overall axial thickness of the impeller.Type: ApplicationFiled: June 22, 2022Publication date: November 9, 2023Applicants: MICRO-STAR INT'L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.Inventors: Yi Wen CHEN, Yung Ching HUANG, Shang-Chih YANG
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Patent number: 11799220Abstract: A redriver chip comprising: pre-stage transmission pin sets, pre-stage reception pin sets, post-stage transmission pin sets, post-stage reception pin sets and selectors. The pre-stage transmission pin sets and the pre-stage reception pin sets are disposed in alternating arrangement, and the post-stage transmission pin sets and the post-stage reception pin sets are disposed in alternating arrangement. The amount of the post-stage transmission pin sets is an integral multiple of the amount of pre-stage reception pin sets, and the amount of the pre-stage reception pin sets is an integral multiple of the pre-stage transmission pin sets. Each of the selectors is connected to one of the pre-stage reception pin sets and integral multiple amount of the post-stage transmission pin sets, or is connected to one of the pre-stage transmission pin sets and integral multiple amount of the post-stage reception pin sets.Type: GrantFiled: May 19, 2021Date of Patent: October 24, 2023Assignees: MICRO-STAR INT'L CO., LTD., MSI COMPUTER (SHENZHEN) CO., LTD.Inventor: Chung-Hsing Chang
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Publication number: 20230328923Abstract: A heat dissipation device is provided, including a main body, a plurality of fins, a plurality of flat tubes, a pump head, and a fan. The pump head and the fan are disposed on opposite sides of the main body. The main body has three tanks arranged along the long axis of the main body. The flat tubes communicate with the tanks. The fins are disposed on the flat tubes.Type: ApplicationFiled: June 14, 2022Publication date: October 12, 2023Applicants: MICRO-STAR INT'L CO., LTD., MSI COMPUTER (SHENZHEN) CO., LTD.Inventors: Lin-Yu LEE, Shang-Chih YANG, Yung-Ching HUANG
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Patent number: 11783329Abstract: A payment method is provided. The method is used in a payment system and includes: receiving, by a monitoring device, a contract corresponding to a transaction transmitted by a smart contract device and receiving status information of a plurality of unmanned control devices, wherein the transaction is created by a user; transmitting, by the monitoring device, the contract and the status information to a residual service contract device; and receiving, by a first unmanned control device of the unmanned control devices, service information generated by the residual service contract device according to the contract and the status information and providing services to the user according to the service information.Type: GrantFiled: September 9, 2020Date of Patent: October 10, 2023Assignees: MICRO-STAR INT'L CO., LTD., MSI COMPUTER (SHENZHEN) CO., LTD.Inventor: Shih-Che Hung
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Patent number: 11742603Abstract: An input/output transmission interface assembly capable of being assembled on a motherboard includes a first transmission interface, a board-to-board connector, and a second transmission interface. The first transmission interface includes a first circuit board, a first electrical connector, a driving chip, and a plug portion. The plug portion is at one side of the first circuit board for being plugged into the motherboard. The second transmission interface includes a second circuit board and a second electrical connector. The second circuit board is substantially parallel to the first circuit board. The board-to-board connector is assembled on and between the first circuit board and the second circuit board. The first circuit board and the second circuit board are electrically connected with each other through the board-to-board connector.Type: GrantFiled: June 29, 2021Date of Patent: August 29, 2023Assignees: MICRO-STAR INT'L CO., LIMITED., MSI COMPUTER (SHENZHEN) CO., LTD.Inventors: Tung-Yi Tsai, Chung-Hsing Chang, Kuo-Wei Lu
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Publication number: 20230225069Abstract: An electronic device including a chassis, a motherboard, an expansion card and a support. The motherboard is disposed in the chassis. The expansion card includes a circuit board assembly and a fixing plate. The circuit board assembly is fixed to a side of the fixing plate. The circuit board assembly is electrically connected to the motherboard and is fixed to the chassis via the fixing plate. A side of the support supports a side of the circuit board assembly that is located farthest from the fixing plate. A side of the support that is located farthest from the circuit board assembly is fixed to the motherboard and the chassis.Type: ApplicationFiled: April 14, 2022Publication date: July 13, 2023Applicants: MICRO-STAR INT?L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.Inventors: Ting Rong CIOU, Yung Ching HUANG, Shang-Chih YANG
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Patent number: 11690191Abstract: An electronic device including a chassis, a motherboard, an expansion card and a support. The motherboard is disposed in the chassis. The expansion card includes a circuit board assembly and a fixing plate. The circuit board assembly is fixed to a side of the fixing plate. The circuit board assembly is electrically connected to the motherboard and is fixed to the chassis via the fixing plate. A side of the support supports a side of the circuit board assembly that is located farthest from the fixing plate. A side of the support that is located farthest from the circuit board assembly is fixed to the motherboard and the chassis.Type: GrantFiled: April 14, 2022Date of Patent: June 27, 2023Assignees: MICRO-STAR INT'L CO., LTD., MSI COMPUTER (SHENZHEN) CO., LTD.Inventors: Ting Rong Ciou, Yung Ching Huang, Shang-Chih Yang
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Patent number: 11674817Abstract: A method for relocating a mobile vehicle in a simultaneous localization and mapping (SLAM) map is provided. The method can be used in the mobile vehicle moving in an area and includes: using SLAM to establish the SLAM map that corresponds to the area at an initial time point; detecting, by a non-SLAM positioning device, a first position trajectory and a first azimuth trajectory of the mobile vehicle on the SLAM map; detecting, by a SLAM positioning device, a loss probability of the mobile vehicle between a first timestamp and a second timestamp; determining whether a condition is satisfied; and updating the SLAM map to a new SLAM map corresponding to a current time point and updating positioning information of the mobile vehicle in the new SLAM map when the condition is satisfied at the current time point.Type: GrantFiled: September 9, 2020Date of Patent: June 13, 2023Assignees: MICRO-STAR INTL CO., LTD., MSI COMPUTER (SHENZHEN) CO., LTD.Inventors: Hoa-Yu Chan, Shih-Che Hung
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Publication number: 20230155393Abstract: An electric vehicle charging system includes: an identification device configured to identify a vehicle and generate feature data associated with the vehicle, a computing device electrically coupled to the identification device, with the computing device configured to obtain a charging specification of the vehicle from a database according to the feature data, wherein the computing device generates a power-supply command associated with the charging specification, and a charging device electrically coupled to the computing device and comprising a plurality of connectors respectively having a power inserter, with the connectors configured to be electrically coupled to a plurality of vehicles with different charging specifications through the power inserters, wherein the charging device selects one of the connectors according to the power-supply command, and provides power to the selected connector.Type: ApplicationFiled: January 14, 2022Publication date: May 18, 2023Applicants: MICRO-STAR INT'L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.Inventor: Lou Wei PENG
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Publication number: 20220395747Abstract: A display device electrically connectable to an external operation device and a host is provided. The display device includes an imaging unit, a display controller, an image receiving port, a command output port and at least one computing device. The image receiving port obtains image data from the host and transmit to the display controller. The display controller controls the imaging unit to display the image data. The at least one computing device has a host operation mode and a display operation mode. The computing device receives a control command from the external operation device, sends the control command to the host through the command output port in the host operation mode, and sends the control command to the display controller to adjust the display setting in the display operation mode.Type: ApplicationFiled: October 7, 2021Publication date: December 15, 2022Applicants: MICRO-STAR INT'L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.Inventors: Chun-Te YEH, Chia-Fu LIU, Chung-Wen CHEN
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Publication number: 20220320767Abstract: A redriver chip comprising: pre-stage transmission pin sets, pre-stage reception pin sets, post-stage transmission pin sets, post-stage reception pin sets and selectors. The pre-stage transmission pin sets and the pre-stage reception pin sets are disposed in alternating arrangement, and the post-stage transmission pin sets and the post-stage reception pin sets are disposed in alternating arrangement. The amount of the post-stage transmission pin sets is an integral multiple of the amount of pre-stage reception pin sets, and the amount of the pre-stage reception pin sets is an integral multiple of the pre-stage transmission pin sets. Each of the selectors is connected to one of the pre-stage reception pin sets and integral multiple amount of the post-stage transmission pin sets, or is connected to one of the pre-stage transmission pin sets and integral multiple amount of the post-stage reception pin sets.Type: ApplicationFiled: May 19, 2021Publication date: October 6, 2022Applicants: MICRO-STAR INT'L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.Inventor: Chung-Hsing CHANG
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Patent number: 11416047Abstract: A heat dissipation system of a portable electronic device including a first processing element, a second processing element, a heat dissipation module located between the first processing element and the second processing element, a first heat transferring member, and a second heat transferring member, is provided. The first processing element has a first region and a second region. The first heat transferring member is in thermal contact with the first region, the second processing element, and the heat dissipation module. The second heat transferring member is in thermal contact with the second region and the heat dissipation module.Type: GrantFiled: May 11, 2021Date of Patent: August 16, 2022Assignees: Micro-Star International Co., Ltd., MSI Computer (Shenzhen) Co., LtdInventors: Yu An Wang, Chun Mo Wu, Chih-Shiang Hsu, Wei En Kao, Shuan-Cheng Su, Kung Ming Shen, Chia Chun Lin, Chung-Bi Lee, Huan-Jung Lee, Cheng-Lung Chen, Chia Hao Yeh