Abstract: An improved method for post-texturing cleaning, surface conditioning, and rinsing silicon wafers or similar surfaces, with particular, although not exclusive, applicability in photovoltaic applications which includes cleaning the surfaces sequentially with dilute HF/HCl and dilute oxidizing rinse, particularly following texturing with concentrated HF/HNO3 and/or KOH. The method allows for the recycling of the oxidizing rinse in the dilute HF/HCl and other upstream rinse steps.
Type:
Application
Filed:
October 1, 2009
Publication date:
April 7, 2011
Applicant:
MT SYSTEMS, INC.
Inventors:
Karen A. Reinhardt, Pythias V. Herrera, Thomas M. Vukosav